IP Library Granted Patent US 12,604,451
Granted Patent B2
US 12,604,451 · App. 18/251,607 · Granted Apr 14, 2026

Mounting system and mounting method

Inventor: Takeshi Sakurayama (Nisshin, JP)
Assignee: FUJI CORPORATION
H05K13/0882H05K13/0419
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Quick Facts
Patent No.
US 12,604,451
App. No.
18/251,607
Granted
Apr 14, 2026
Kind
B2
Abstract

A mounting system of the present disclosure includes a component supply section configured to supply a component from a holding member on which multiple components are held, a mounting section configured to mount a pickup member configured to pick up the component from the component supply section, a measurement section configured to measure an upper surface height of the component held on the holding member, and a lifting and lowering mechanism configured to lift and lower the pickup member by a push-in amount larger than the upper surface height of the component measured by the measurement section.

Claims (38)

1 . A mounting system comprising:

a component supply section configured to supply a component from a holding member on which multiple components are held;

a mounting section configured to mount a pickup member configured to pick up the component from the component supply section;

a measurement section configured to measure an upper surface height of the component held on the holding member;

a lifting and lowering mechanism configured to lift and lower the pickup member by a push-in amount larger than the upper surface height of the component measured by the measurement section; and

a control section configured to set an offset value for the lifting and lowering mechanism to adjust a pickup height of the mounting based on the measured height of the component,

wherein the control section is configured to

cause the measurement section to measure a height of the component on the holding member when a type of the component is a predetermined component type,

determine whether the holding member is of a first type or of a second type,

when it is determined that the holding member is the first type

determine whether the measured height of the component is within a first allowable range,

when the measured height of the component is within the first allowable range, set the offset value based on the measured height of the component, and

when the measured height of the component is not within the first allowable range, set the offset value within the first allowable range, and

when it is determined that the holding member is the second type

determine whether the measured height of the component is within a second allowable range,

when the measured height of the component is within the second allowable range, set the offset value based on the measured height of the component, and

when the measured height of the component is not within the second allowable range, set the offset value within the second allowable range, and

wherein the second allowable range is narrower than the first allowable range.

2 . The mounting system according to claim 1 ,

wherein the control section is configured to not set the offset value when the offset value is designated.

3 . The mounting system according to claim 1 ,

wherein the control section is configured to cause the mounting section to pick up the component from the holding member at the pickup height using the set offset value.

4 . The mounting system according to claim 1 ,

wherein the control section is configured to reset the set offset value when a pickup rate falls below a predetermined allowable pickup accuracy in a pickup process of the component performed using the set offset value.

5 . A mounting method used in a mounting device including a component supply section configured to supply a component from a holding member on which multiple components are held, a mounting section configured to mount a pickup member configured to pick up the component from the component supply section, and a measurement section configured to measure an upper surface height of the component held on the holding member, the mounting method comprising:

a setting step of setting an offset value for adjusting a pickup height of the mounting section based on a height of the component on the holding member measured by the measurement section when a type of the component is a predetermined component type, the setting step including

determining whether the holding member is of a first type or of a second type,

when it is determined that the holding member is the first type

determining whether the measured height of the component is within a first allowable range,

when the measured height of the component is within the first allowable range, setting the offset value based on the measured height of the component, and

when the measured height of the component is not within the first allowable range, setting the offset value within the first allowable range, and

when it is determined that the holding member is the second type

determining whether the measured height of the component is within a second allowable range,

when the measured height of the component is within the second allowable range, setting the offset value based on the measured height of the component, and

when the measured height of the component is not within the second allowable range, setting the offset value within the second allowable range,

wherein the second allowable range is narrower than the first allowable range.

6 . The mounting method according to claim 5 , further comprising:

a display step of displaying the offset value set in the setting step and the offset value before being set in the setting step.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 4, 2023
From: SAKURAYAMA, TAKESHI
To: FUJI CORPORATION
Reel/Frame 063528/0162 →
Continuity (1)
Related Publication 20240015944A1 · Jan 11, 2024
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