Magnetic tunnel junction structure for MRAM
Method and a magnetoresistive random access memory (MRAM) structure is provided. The structure includes an interconnect and a multilayered magnetic tunnel junction (MTJ) pillar located on the interconnect and having an outermost sidewall. The MTJ pillar includes an electrode layer electrically connecting the MTJ pillar to the interconnect. The electrode layer includes an insulative material at an outermost portion of the electrode layer and a conductive material at a first inner portion of the electrode layer disposed radially inward from the outermost portion of the electrode layer.
1 . A magnetoresistive random access memory (MRAM) structure comprising:
an interconnect; and
a multilayered magnetic tunnel junction (MTJ) pillar disposed on the interconnect and having an outermost sidewall contacting multiple layers in the MTJ pillar, the MTJ pillar comprising an electrode layer electrically connecting the MTJ pillar to the interconnect, the electrode layer comprising an insulative material at an outermost portion of the electrode layer and a conductive material at a first inner portion of the electrode layer disposed radially inward from the outermost sidewall and the outermost portion of the electrode layer, wherein the insulative material directly contacts the outermost portion of the electrode layer and the outermost sidewall.
2 . The MRAM structure of claim 1 , wherein the insulative material is a dielectric material and the conductive material comprises a metal selected from Ru, Ta, Ti, W, Mo, Pt, and a combination thereof.
3 . The MRAM structure of claim 2 , wherein the dielectric material comprises a silicon nitride.
4 . The MRAM structure of claim 1 , wherein the electrode layer comprises a second inner portion of the electrode layer comprising the conductive material, wherein the second inner portion is disposed radially inward and concentric with the first inner portion, the first and second inner portion separated by the insulative material.
5 . The MRAM structure of claim 4 , wherein the electrode layer comprises a central portion disposed radially inward from the second inner portion, the central portion composed of the insulative material.
6 . The MRAM structure of claim 4 , wherein the first inner portion of the electrode layer interfaces a first nucleation layer at a first inner circumferential surface of the first inner portion.
7 . The MRAM structure of claim 6 , wherein the second inner portion of the electrode layer interfaces a second nucleation layer at a second inner circumferential surface of the second inner portion.
8 . The MRAM structure of claim 1 , wherein the first inner portion of the electrode layer interfaces a first nucleation layer at a first inner circumferential surface of the first inner portion.
9 . A magnetoresistive random access memory (MRAM) structure comprising:
an interconnect;
an electrode disposed on the interconnect, the electrode comprising one or more conductive rings surrounded by a dielectric material at an outermost circumferential surface of an outermost conductive ring of the one or more conductive rings; and
a multilayered magnetic tunnel junction (MTJ) pillar disposed on the electrode, the one or more conductive rings forming an electrical connection between the MTJ pillar and interconnect, wherein at least two of the one or more conductive rings are composed of different conductive material.
10 . The MRAM structure of claim 9 , wherein at least one conductive ring of the one or more conductive rings interfaces a nucleation layer at an inner circumferential surface of the at least one conductive ring.
11 . The MRAM structure of claim 10 , wherein the nucleation layer is composed of a metal nitride.
12 . The MRAM structure of claim 11 , wherein the metal is selected from Ru, Ta, W, Mo, Pt, and a combination thereof.
13 . A method of forming a magnetoresistive random access memory (MRAM) structure, comprising:
forming an electrode layer on an interconnect, the electrode layer comprising one or more conductive rings surrounded by a dielectric material at an outer circumferential surface of the one or more conductive rings; and
forming a multilayered magnetic tunnel junction (MTJ) pillar on the electrode layer and having an outermost sidewall contacting multiple layers in the MTJ pillar, wherein the one or more conductive rings form an electrical connection between the MTJ pillar and interconnect, and wherein the dielectric material directly contacts the outermost portion of the electrode layer and the outermost sidewall.
14 . The method of claim 13 , wherein forming the electrode layer comprises:
depositing the dielectric material over a cap layer disposed over the interconnect;
depositing a conductive ring of the one or more conductive rings, the conductive ring surrounding the dielectric material; and
depositing an outer dielectric portion surrounding the conductive ring.
15 . The method of claim 14 , wherein depositing the dielectric material, the conductive ring surrounding the dielectric material, and the dielectric material surrounding the conductive ring is repeated cyclically, such that the conductive rings are separated from one another by the dielectric material.
16 . The method of claim 14 , further comprising:
etching the electrode layer between each depositing of the dielectric material and the conductive rings.
17 . The method of claim 14 , further comprising:
prior to depositing each of the conductive rings, depositing a nucleation layer surrounding the dielectric material.
18 . The method of claim 14 , further comprising:
depositing a hard mask over the MTJ pillar;
removing portions of the MTJ pillar to form an outer sidewall of the MTJ pillar; and
removing portions of the electrode layer, wherein etching the electrode layer comprises etching only the outer dielectric portion of the electrode layer.
19 . The method of claim 13 , wherein forming the electrode layer, comprises atomic layer deposition, chemical vapor deposition, reactive ion etching, ion beam etching, or combinations thereof.