Vertical semiconductor device
A vertical semiconductor device includes lower circuit patterns disposed on a first substrate. A bonding layer is disposed on the lower circuit patterns. A wire is disposed on the bonding layer. A cell stack structure is disposed on the wire. A base pattern is disposed on the cell stack structure. An upper insulating layer is disposed on the base pattern. A cell contact plug passes through the cell stack structure and extends to the upper insulating layer. A through-plug is disposed inside a through-hole formed through an outer side of the base pattern to extend to the upper insulating layer. Each of the cell contact plug and the through-plug includes a barrier metal pattern and a metal pattern, and the barrier metal pattern is disposed along sidewalls and bottom surfaces of the cell contact hole and the through-hole.
1 . A vertical semiconductor device, comprising:
lower circuit patterns disposed on a first substrate;
a bonding layer disposed on the lower circuit patterns;
a wire disposed on the bonding layer;
pattern structures disposed on the wire, each of the pattern structures including insulating patterns and gate electrodes, which are alternately stacked on a top surface of the first substrate in a vertical direction, the pattern structures having an edge region having a step shape in which a length gradually increases from a bottom to a top, and extending in a first direction that is parallel to the top surface of the first substrate;
an embedded insulating pattern disposed inside a trench that is disposed between the pattern structures, and extending in the first direction;
a base pattern disposed on the pattern structure;
an upper insulating layer disposed on the base pattern;
a channel structure disposed inside a channel hole formed through the pattern structure, and extending to the base pattern;
a cell contact plug disposed inside a cell contact hole formed through a step-shaped region of the pattern structure, extending to the upper insulating layer, and electrically connected to one gate electrode in the pattern structure; and
a through-plug disposed inside a through-hole formed through an outer side of the base pattern and extending to the upper insulating layer,
wherein each of bottom surfaces of the cell contact plug and the through-plug is disposed at a level higher than a bottom surface of the embedded insulating pattern.
2 . The vertical semiconductor device of claim 1 , wherein each of the trench, the channel hole, the cell contact hole, and the through-hole has a sidewall inclined to have a width that gradually widens from a bottom to a top, and
wherein a sidewall of each of the trench, the channel hole, the cell contact hole, and the through-hole has a bent part.
3 . The vertical semiconductor device of claim 2 , wherein the bent parts of the trench, the channel hole, the cell contact hole, and the through-hole are disposed on a same plane.
4 . The vertical semiconductor device of claim 1 , wherein the cell contact plug and the through-plug include a same metal pattern, and
wherein a seam is included inside the metal pattern.
5 . The vertical semiconductor device of claim 1 , wherein each of the cell contact plug and the through-plug includes a barrier metal pattern and a metal pattern, and
wherein the barrier metal pattern is disposed along sidewalls and bottom surfaces of the cell contact hole and the through-hole.
6 . The vertical semiconductor device of claim 1 , wherein the wire includes a contact plug, and
wherein a barrier metal pattern included in each of the cell contact plug and the through-plug makes direct contact with the contact plug.
7 . The vertical semiconductor device of claim 1 , further comprising a plate contact plug disposed inside a plate contact hole formed through an outer side of the pattern structure, and electrically connected to the base pattern.
8 . The vertical semiconductor device of claim 7 , wherein bottom surfaces of the cell contact plug, the through-plug, and the plate contact plug are disposed on a same plane.
9 . The vertical semiconductor device of claim 8 , wherein the bottom surfaces of the cell contact plug, the through-plug, and the plate contact plug are disposed on a plane between a bottom surface of the channel structure and the bottom surface of the embedded insulating pattern.
10 . The vertical semiconductor device of claim 7 , wherein the plate contact plug passes through the base pattern and contacts the upper insulating layer.
11 . The vertical semiconductor device of claim 7 , wherein the plate contact plug contacts a bottom surface of the base pattern without passing through the base pattern.
12 . The vertical semiconductor device of claim 1 , wherein each of uppermost portions of the cell contact plug and the through-plug has an inclination so that a width gradually decreases from a top to a bottom.
13 . The vertical semiconductor device of claim 1 , further comprising a dummy structure passing through the step-shaped region of the pattern structure and extending to a bottom surface of the base pattern.
14 . A vertical semiconductor device, comprising:
lower circuit patterns disposed on a first substrate;
a bonding layer disposed on the lower circuit patterns;
a wire disposed on the bonding layer;
pattern structures disposed on the wire, each of the pattern structures including insulating patterns and gate electrodes, which are alternately stacked on a top surface of the first substrate in a vertical direction, the pattern structures having an edge region having a step shape in which a length gradually increases from a bottom to a top, and extending in a first direction that is parallel to the top surface of the first substrate;
a base pattern disposed on the pattern structure;
an upper insulating layer on the base pattern;
a channel structure disposed inside a channel hole formed through the pattern structure, and extending to the base pattern;
a cell contact plug disposed inside a cell contact hole formed through a step-shaped region of the pattern structure, extending to the upper insulating layer, and electrically connected to one gate electrode in the pattern structure;
a through-plug disposed inside a through-hole formed through an outer side of the base pattern to extend to the upper insulating layer; and
a plate contact plug disposed inside a plate contact hole formed through an outer side of the pattern structure, and electrically connected to the base pattern,
wherein bottom surfaces of the cell contact plug, the through-plug, and the plate contact plug are disposed on a same plane.
15 . The vertical semiconductor device of claim 14 , further comprising an embedded insulating pattern disposed inside a trench that is disposed between the pattern structures, and extending in the first direction,
wherein each of the bottom surfaces of the cell contact plug, the through-plug, and the plate contact plug is disposed at a level higher than a bottom surface of the embedded insulating pattern.
16 . The vertical semiconductor device of claim 14 , wherein each of the channel hole, the cell contact hole, the through-hole, and the plate contact hole has a sidewall inclination to have a width that gradually widens from a bottom to a top, and
wherein a sidewall of each of the channel hole, the cell contact hole, the through-hole, and the plate contact hole has a bent part.
17 . The vertical semiconductor device of claim 14 , wherein the bent parts of the channel hole, the cell contact hole, the through-hole, and the plate contact hole are disposed on a same plane.
18 . The vertical semiconductor device of claim 14 , wherein each of the cell contact plug, the through-plug, and the plate contact plug includes a barrier metal pattern and a metal pattern, and
wherein the barrier metal pattern is disposed along sidewalls and bottom surfaces of the cell contact hole, the through-hole, and the plate contact hole.
19 . A vertical semiconductor device, comprising:
lower circuit patterns disposed on a first substrate;
a bonding layer disposed on the lower circuit patterns;
a wire disposed on the bonding layer;
a cell stack structure disposed on the wire;
a base pattern disposed on the cell stack structure;
an upper insulating layer disposed on the base pattern;
a cell contact plug passing through the cell stack structure and extending to the upper insulating layer; and
a through-plug disposed inside a through-hole formed through an outer side of the base pattern to extend to the upper insulating layer,
wherein each of the cell contact plug and the through-plug includes a barrier metal pattern and a metal pattern, and
wherein the barrier metal pattern is disposed along sidewalls and bottom surfaces of the cell contact hole and the through-hole.
20 . The vertical semiconductor device of claim 19 , further comprising a plate contact plug disposed inside a plate contact hole formed through an outer side of the pattern structure, and electrically connected to the base pattern.