Granted Patent B2

US 12,604,763 · App. 17/600,668 · Granted Apr 14, 2026

Inventors: Petrus Sundgren (Lappersdorf, DE); Andreas Biebersdorf (Regensburg, DE)

Assignee: OSRAM OPTO SEMICONDUCTORS GMBH

H10W90/00H10H20/856H10H20/036

Abstract

Claims (58)

1 . A method for producing a plurality of components each comprising a semiconductor body having an optically active zone, comprising:

providing a semiconductor structure on an intermediate carrier, wherein a sacrificial layer is disposed in a vertical direction between the semiconductor structure and the intermediate carrier;

forming a plurality of separation trenches throughout the semiconductor structure for forming a plurality of laterally spaced semiconductor bodies, wherein after formation of the separation trenches, the sacrificial layer is removed in such a way that cavities are formed in the vertical direction between the intermediate carrier and the semiconductor bodies, wherein remaining partial regions of the sacrificial layer form retaining elements; and

modifying the retaining elements, namely the remaining partial regions of the sacrificial layer, for reducing mechanical adhesion between the semiconductor bodies and the intermediate carrier, so that the semiconductor bodies are formed to be detachable from the intermediate carrier,

wherein in a top view of the intermediate carrier, the semiconductor bodies overlap the retaining elements as well as the cavities, and

wherein the modification is effected by oxidation.

2 . The method according to claim 1 ,

wherein the sacrificial layer and the semiconductor structure are based on the same semiconductor material system.

3 . The method according to claim 1 ,

wherein, after modification of the retaining elements, the semiconductor bodies are mechanically connected to the intermediate carrier exclusively via the modified retaining elements, wherein

the components are formed to be detachable from the intermediate carrier and thus transferable, and

the semiconductor bodies are released from the intermediate carrier under mechanical load, by irradiation or by etching the retaining elements.

4 . The method according to claim 1 ,

wherein the semiconductor bodies are removed from the intermediate carrier individually or in groups by one or a plurality of stamps, wherein

the retaining elements release the semiconductor bodies from the intermediate carrier under mechanical load of the stamp or stamps, and

the semiconductor bodies are fixed on one carrier or on several carriers before being detached from the stamp or stamps.

5 . The method according to claim 1 ,

wherein

the semiconductor bodies are removed from the intermediate carrier individually or in groups, and

an absorption layer is irradiated to release the semiconductor bodies from the intermediate carrier, wherein the absorption layer is part of the retaining elements, and

is embedded within the retaining elements, or

is arranged facing the intermediate carrier or facing the semiconductor bodies.

6 . The method according to claim 1 ,

wherein the intermediate carrier is a growth substrate, the semiconductor structure being epitaxially deposited on the growth substrate, and the sacrificial layer being deposited in the vertical direction between the semiconductor structure and the intermediate carrier.

7 . The method according to claim 1 ,

wherein the semiconductor structure is a layer sequence epitaxially deposited on a growth substrate, wherein the semiconductor structure and the sacrificial layer are arranged in the vertical direction between the growth substrate and the intermediate carrier, and wherein after the semiconductor structure is attached to the intermediate carrier, the growth substrate is removed.

8 . The method according to claim 1 ,

wherein the sacrificial layer is an aluminum containing semiconductor layer.

9 . A component assembly comprising of a plurality of components, a modified sacrificial layer and a common intermediate carrier, wherein

the components each comprise a semiconductor body having an active zone, the semiconductor bodies being disposed on the common intermediate carrier and being laterally spaced from each other by separation trenches,

the sacrificial layer is arranged in a vertical direction between the common intermediate carrier and the semiconductor bodies, the sacrificial layer having a plurality of retaining elements between the semiconductor bodies and the common intermediate carrier, and the semiconductor bodies being mechanically connected to the common intermediate carrier exclusively via the retaining elements,

the retaining elements are surrounded by cavities in lateral directions, and

the semiconductor bodies are formed to be detachable from the common intermediate carrier, wherein the retaining elements are configured to release the semiconductor bodies from the common intermediate carrier under mechanical load or by irradiation or by etching,

wherein the semiconductor bodies are based on GaAs or on GaP and the sacrificial layer is an aluminum-containing GaAs or GaP layer.

10 . The component assembly according to claim 9 ,

wherein the retaining elements are arranged exclusively below the semiconductor bodies and in a top view of the common intermediate carrier, the semiconductor bodies completely cover the retaining elements.

11 . The component assembly according claim 9 ,

wherein at least one of the retaining elements is arranged both below the semiconductor bodies and laterally of the semiconductor bodies in the separation trenches, wherein the at least one retaining element is assigned to a plurality of semiconductor bodies at the same time and thus is simultaneously covered by a plurality of semiconductor bodies.

12 . The component assembly according to claim 9 ,

wherein a contact layer and a further contact layer are assigned to each semiconductor body, wherein

the contact layer and the further contact layer are configured for electrically contacting an associated semiconductor body,

the contact layer is disposed laterally of a retaining element on a first main surface of the semiconductor body and partially covers the first main surface, and

the further contact layer is arranged on a second main surface of the semiconductor body facing away from the first main surface and completely covers the second main surface.

13 . The component assembly according to claim 9 ,

wherein a contact layer and a further contact layer are assigned to each semiconductor body, wherein

the contact layer and the further contact layer are arranged on the same side of an associated semiconductor body and are configured for electrically contacting the semiconductor body,

one of the contact layers is electrically conductively connected to a through-via, and

the through-via extends in vertical direction throughout the active zone for electrically contacting a semiconductor layer of the semiconductor body.

14 . The component assembly according to claim 9 ,

wherein the sacrificial layer has a plurality of sublayers, the sublayers having different modification rates.

15 . The component assembly according to claim 14 ,

wherein the sublayers are based on the same material system, the sublayers having different concentrations of aluminum or different dopants.

16 . A component assembly comprising of a plurality of components, a modified sacrificial layer and a common intermediate carrier, wherein

the components each comprise a semiconductor body having an active zone, the semiconductor bodies being disposed on the common intermediate carrier and being laterally spaced from each other by separation trenches,

the sacrificial layer is arranged in a vertical direction between the common intermediate carrier and the semiconductor bodies, the sacrificial layer having a plurality of retaining elements between the semiconductor bodies and the common intermediate carrier, and the semiconductor bodies being mechanically connected to the common intermediate carrier exclusively via the retaining elements,

the retaining elements are surrounded by cavities in lateral directions, and

the semiconductor bodies are formed to be detachable from the common intermediate carrier, wherein the retaining elements are configured to release the semiconductor bodies from the common intermediate carrier under mechanical load or by irradiation or by etching,

wherein at least one of the retaining elements is arranged both below the semiconductor bodies and laterally of the semiconductor bodies in the separation trenches, wherein the at least one retaining element is assigned to a plurality of semiconductor bodies at the same time and thus is simultaneously covered by a plurality of semiconductor bodies.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (33)