Laser cutting method using spatial light modulator and laser cutting device
The present disclosure provides a laser cutting method comprising steps of: (a) emitting a laser light to a spatial light modulator that has a plurality of pixels; (b) the laser light modulated by the spatial light modulator being irradiated on an uncut object, which is to be cut, for forming a focal point and cutting the uncut object; (c) measuring a cutting depth of the object; (d) the spatial light modulator converting a phase of each of the laser light modulated by each of the pixels to change a light pattern distribution at the focal point when the cutting depth of the object reaches a first predetermined depth; and (e) repeating the step (b) to the step (d) until the cutting depth of the object reaches a second predetermined depth; wherein the first predetermined depth is varied when the step (b) to the step (d) are repeated.
1 . A laser cutting device adopted to cut an object to be cut, comprising:
a laser light source, adopted to emit a laser light;
a spatial light modulator, disposed at a path of the laser light emitted by the laser light source, comprising a plurality of pixels;
a laser cutting head, comprising an autofocus system, and further comprising:
a focusing lens; and
a water jacket disposed below the focusing lens, the water jacket comprising:
a transparent window disposed on an upper lateral surface of the water jacket;
a water inlet disposed on a lateral surface of the water jacket and configured to receive a liquid; and
a nozzle disposed on a lower side surface of the water jacket, the nozzle being located in a vertical projection plane common with the transparent window and configured to spray the liquid toward the object to form a water column;
a jig, adopted to fix an uncut object, which is to be cut; and
a controller, electrically connecting to the laser light source, the spatial light modulator and the laser cutting head;
wherein the laser light reflected by the pixels of the spatial light modulator passes through the laser cutting head to the object;
wherein the laser light is irradiated onto the object by total reflection in the water column;
wherein the controller detects a cutting depth of the object through the autofocus system of the laser cutting head;
wherein the controller controls each of the pixels of the spatial light modulator in order to convert a phase of each of the laser light reflected by each of the pixels when the cutting depth reaches a first predetermined depth; and
wherein the controller controls the jig or the laser cutting head to move when the cutting depth reaches a second predetermined depth.
2 . The laser cutting device according to claim 1 further comprising a beam expander disposed along the path of the laser light emitted by the laser light source.
3 . The laser cutting device according to claim 1 , wherein the controller controls rotation of the jig.
4 . The laser cutting device according to claim 1 , wherein the spatial light modulator is an LCOS (Liquid Crystal On Silicon) device.