Head chip and liquid ejecting head
A liquid ejecting head includes a first head chip that includes a first wiring member having flexibility, and a relay substrate that includes a first terminal group α and is electrically coupled to the first wiring member. The first wiring member includes a first terminal group A that is adhered or bonded to the first terminal group α of the relay substrate, and a first terminal group B that is not adhered or bonded to the relay substrate, and the first terminal group A is compatible with the first terminal group B.
1 . A liquid ejecting head comprising:
a first head chip including a first wiring member having flexibility and configured to eject a liquid; and
a relay substrate that includes a first terminal group α and is electrically coupled to the first wiring member, wherein
the first wiring member includes
a first terminal group A that is adhered or bonded to the first terminal group α of the relay substrate, and
a first terminal group B that is not adhered or bonded to the relay substrate, and
the first terminal group A is compatible with the first terminal group B.
2 . The liquid ejecting head according to claim 1 , wherein
the first wiring member includes a body portion, a first end portion, and a second end portion,
the first end portion includes the first terminal group A,
the second end portion includes the first terminal group B, and
the body portion includes a common wiring group that is wired in common to the first terminal group A and the first terminal group B.
3 . The liquid ejecting head according to claim 2 , wherein
the first end portion includes an individual wiring group A wired to the first terminal group A,
the second end portion includes an individual wiring group B wired to the first terminal group B, and
the common wiring group is wired in common to the individual wiring group A and the individual wiring group B.
4 . The liquid ejecting head according to claim 2 , wherein
the first end portion includes a first fragile portion located between the body portion and the first terminal group A.
5 . The liquid ejecting head according to claim 4 , wherein
the first fragile portion is a perforated line formed at the first end portion.
6 . The liquid ejecting head according to claim 4 , wherein
the first fragile portion is closer to the body portion than is the first terminal group A.
7 . The liquid ejecting head according to claim 4 , wherein
the first fragile portion is closer to the first terminal group A than is the body portion.
8 . The liquid ejecting head according to claim 2 , wherein
a length from the body portion to the first terminal group A is different from a length from the body portion to the first terminal group B.
9 . The liquid ejecting head according to claim 2 , wherein
the first head chip includes a plurality of driving elements that drive for ejecting a liquid,
the first wiring member includes a drive signal selection circuit including a plurality of switching elements for selecting whether or not to drive each of the plurality of driving elements, and
a portion of the common wiring group is located between the drive signal selection circuit, and the first terminal group A and the first terminal group B.
10 . The liquid ejecting head according to claim 1 , wherein
the relay substrate includes a first terminal group β that is not adhered or bonded to the first wiring member, and
the first terminal group α is compatible with the first terminal group β.
11 . The liquid ejecting head according to claim 10 , wherein
the relay substrate includes a first surface and a second surface on an opposite side of the first surface,
the first terminal group α is disposed on the first surface, and
the first terminal group β is disposed on the second surface.
12 . The liquid ejecting head according to claim 11 , wherein
the first terminal group α overlaps the first terminal group β when viewed in a thickness direction of the relay substrate.
13 . The liquid ejecting head according to claim 12 , wherein
the first terminal group α and the first terminal group β are wired via a through-hole that penetrates the relay substrate in the thickness direction.
14 . The liquid ejecting head according to claim 10 , wherein
each of the first terminal group α and the first terminal group β is configured by arranging a plurality of terminals in a first direction,
an opening through which the first wiring member is inserted is formed in the relay substrate, and
the first terminal group α and the first terminal group β are disposed on the same surface of the relay substrate to interpose the opening in a second direction intersecting the first direction.
15 . The liquid ejecting head according to claim 14 , wherein
the first terminal group α and the first terminal group β are disposed substantially point-symmetrically to interpose the opening.
16 . The liquid ejecting head according to claim 10 , wherein
each of the first terminal group α and the first terminal group β is configured by arranging a plurality of terminals in a first direction, and
the first terminal group α and the first terminal group β are arranged in the first direction on the same surface of the relay substrate.
17 . The liquid ejecting head according to claim 1 , further comprising:
a second head chip including a second wiring member having flexibility and configured to eject a liquid, wherein
the second wiring member includes
a second terminal group A that is adhered or bonded to the relay substrate, and
a second terminal group B that is not adhered or bonded to the relay substrate,
the relay substrate includes
a first terminal group β that is not adhered or bonded to the first wiring member,
a second terminal group α that is adhered or bonded to the second terminal group A, and
a second terminal group β that is not adhered or bonded to the second wiring member,
the first terminal group α is compatible with the first terminal group β,
the second terminal group α is compatible with the second terminal group β, and
the first terminal group A, the first terminal group B, the second terminal group A, and the second terminal group B are compatible with each other.
18 . The liquid ejecting head according to claim 1 , wherein
the first wiring member further includes a first terminal group C that is not adhered or bonded to the relay substrate, and
the first terminal group A, the first terminal group B, and the first terminal group C are compatible with each other.