US 2721858A
· Joyner et al.
· 1955
[cited by applicant]
US 2784127A
· Joyner et al.
· 1957
[cited by applicant]
US 3254111A
· Hawkins et al.
· 1966
[cited by applicant]
US 3527224A
· Rabinowitz
· 1970
[cited by applicant]
US 3564078A
· Wicker et al.
· 1971
[cited by applicant]
US 3591676A
· Hawkins et al.
· 1971
[cited by applicant]
US 3667472A
· Halpern
· 1972
[cited by applicant]
US 3704089A
· Stehlik
· 1972
[cited by applicant]
US 3940362A
· Overhults
· 1976
[cited by applicant]
US 3995641A
· Kronenthal et al.
· 1976
[cited by applicant]
US 4035334A
· Davydov et al.
· 1977
[cited by applicant]
US 4364876A
· Kimura et al.
· 1982
[cited by applicant]
US 4444933A
· Columbus et al.
· 1984
[cited by applicant]
US 4650826A
· Waniczek et al.
· 1987
[cited by applicant]
US 6143805A
· Hickey et al.
· 2000
[cited by applicant]
US 6579469B1
· Nicholson
· 2003
[cited by examiner]
US 8048086B2
· Lee-Sepsick et al.
· 2011
[cited by applicant]
US 8048101B2
· Lee-Sepsick et al.
· 2011
[cited by applicant]
US 8052669B2
· Lee-Sepsick et al.
· 2011
[cited by applicant]
US 8316853B2
· Lee-Sepsick et al.
· 2012
[cited by applicant]
US 8316854B2
· Lee-Sepsick et al.
· 2012
[cited by applicant]
US 8324193B2
· Lee-Sepsick et al.
· 2012
[cited by applicant]
US 8336552B2
· Lee-Sepsick et al.
· 2012
[cited by applicant]
US 8695606B2
· Lee-Sepsick et al.
· 2014
[cited by applicant]
US 8726906B2
· Lee-Sepsick et al.
· 2014
[cited by applicant]
US 9034053B2
· Lee-Sepsick et al.
· 2015
[cited by applicant]
US 9220880B2
· Lee-Sepsick et al.
· 2015
[cited by applicant]
US 9554826B2
· Lee-Sepsick et al.
· 2017
[cited by applicant]
US 20070248486A1
· Morales
· 2007
[cited by examiner]
US 20120004288A1
· Worm
· 2012
[cited by applicant]
BR 112019015714
· 2020
[cited by applicant]
CA 3050319
· 2018
[cited by applicant]
CN 103083718
· 2013
[cited by applicant]
CN 105079856
· 2015
[cited by applicant]
CN 110267687
· 2019
[cited by applicant]
EP 0659441
· 2002
[cited by applicant]
EP 3579890
· 2025
[cited by applicant]
HK 40007722
· 2020
[cited by applicant]
HK 40018048
· 2020
[cited by applicant]
IN 430804
· 2023
[cited by applicant]
JP H07252455
· 1995
[cited by applicant]
JP 2002503522
· 2002
[cited by applicant]
JP 2009120851
· 2009
[cited by applicant]
JP 4916102
· 2012
[cited by applicant]
JP 201209880
· 2012
[cited by applicant]
JP 2002322220
· 2012
[cited by applicant]
JP 2020508367
· 2020
[cited by applicant]
JP 7252455
· 2023
[cited by applicant]
JP 7379157
· 2023
[cited by applicant]
JP 2024023211
· 2024
[cited by applicant]
JP 7594647
· 2024
[cited by applicant]
KR 100523662
· 2005
[cited by applicant]
KR 20190112135
· 2019
[cited by applicant]
KR 102713236
· 2024
[cited by applicant]
WO 9942142
· 1999
[cited by applicant]
WO 2001089501
· 2001
[cited by applicant]
WO 2004106284
· 2004
[cited by applicant]
WO 2018148453
· 2018
[cited by applicant]
Machado et al. ‘Study of dentinal adhesives compatibility using histological analysis’, Braz J Oral Sci., 2007, vol. 6, No. 20, pp. 1289-1294.
[cited by applicant]
PCT Search Report, Issued May 7, 2018, in PCT/US18/17484, inventor K. Lee-Sepsick (3 pgs).
[cited by applicant]
PCT Written Opinion, Issued May 7, 2018, in PCT/US18/17484, inventor K. Lee-Sepsick (5 pgs).
[cited by applicant]
PCT Search Strategy, Issued May 7, 2018, in PCT/US18/17484, inventor K. Lee-Sepsick (3 pgs).
[cited by applicant]
Office Action, issued Oct. 11, 2022, in Brazilian Patent Application No. BR112019015714-0, filed Aug. 2, 2018; Applicant, Femasys Inc., 4 p.
[cited by applicant]
Office Action, issued Apr. 19, 2022, in Brazilian Patent Application No. BR112019015714-0, filed Aug. 2, 2018; Applicant, Femasys Inc., 7 p.
[cited by applicant]
Office Action, issued May 31, 2022, in Chinese Patent Application No. 2018800109689, filed Aug. 2, 2018, Applicant, Femasys Inc., 11 p.
[cited by applicant]
Office Action, issued May 24, 2021, in Chinese Patent Application No. 2018800109689, filed Aug. 2, 2018, Applicant, Femasys Inc., 8 p.
[cited by applicant]
Extended European Search Report, issued Dec. 8, 2020, in European Patent Application No. 18751753.7, filed Aug. 2, 2018, Applicant, Femasys Inc., 8 p.
[cited by applicant]
First Examination Report, issued Jan. 31, 2022 , in Indian Patent Application No. 201917028409, filed Aug. 2, 2018, Applicant, Femasys Inc., 6 p.
[cited by applicant]
Office Action, issued Feb. 14, 2022, in Japanese Patent Application No. 2019-542727, filed Aug. 2, 2018, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Office Action, issued Sep. 19, 2022, in Korean Patent Application No. 10-2019-7026332, filed Aug. 2, 2018, Applicant, Femasys Inc., 8 p.
[cited by applicant]
Notice of Allowance in decision published in the Official Gazette n° 2722, Mar. 7, 2023, and translation, for Brazilian Patent Application No. BR112019015714-0, filed Feb. 8, 2018; Applicant, Femasys Inc., 2 p.
[cited by applicant]
Office Action, issued Apr. 19, 2024, in Canadian patent application No. 3050319, filed Feb. 8, 2018; Applicant, Femasys Inc., 5 p.
[cited by applicant]
Interview, issued Jun. 25, 2025, in Canadian patent application No. 3050319, filed Feb. 8, 2018; Applicant, Femasys Inc., 1 p.
[cited by applicant]
Rejection Decision and translation, issued Feb. 24, 2023, in Chinese Patent Application No. 2018800109689, filed Aug. 2, 2018, Applicant, Femasys Inc., 24 p.
[cited by applicant]
Office Action, issued May 3, 2023, in European Patent Application No. 18751753.7, filed Feb. 8, 2018, Applicant, Femasys Inc., 4 p.
[cited by applicant]
Decision to Grant, issued May 25, 2025, in European Patent Application No. 18751753.7, filed Feb. 8, 2018, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Transmission of granted Patent, issued Jul. 1, 2025, in European Patent Application No. 18751753.7, filed Feb. 8, 2018, Applicant, Femasys Inc., 41p.
[cited by applicant]
Patent Grant, issued May 1, 2023, in Indian Patent Application No. 201917028409, filed Aug. 2, 2018, Applicant, Femasys Inc., 1 p.
[cited by applicant]
Second Office Action, translation, issued Oct. 4, 2022, in Japanese Patent Application No. 2019-542727, filed Aug. 2, 2018, Applicant, Femasys Inc., 3 p.
[cited by applicant]
Third Office Action, translation, issued May 16, 2023, in Japanese Patent Application No. 2019-542727, filed Aug. 2, 2018, Applicant, Femasys Inc., 6 p.
[cited by applicant]
Decision to Grant, translation, issued Oct. 3, 2023, in Japanese Patent Application No. 2019-542727, filed Aug. 2, 2018, Applicant, Femasys Inc., 5 p.
[cited by applicant]
Certificate of Patent, issued Nov. 6, 2023, in Japanese Patent Application No. 2019-542727, filed Aug. 2, 2018, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Decision to Grant, translation, issued in Japanese Patent Application No. 2023-187621, filed Nov. 1, 2023, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Filing Receipt, translation, issued Nov. 1, 2023, in Japanese Patent Application No. 2023-187621, filed Nov. 1, 2023, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Decision to Grant, translation, issued Nov. 12, 2023, in Japanese Patent Application No. 2023-187621, filed Nov. 1, 2023, Applicant, Femasys Inc., 6 p.
[cited by applicant]
Patent Certificate, issued Nov. 26, 2024, in Japanese Patent Application No. 2023-187621, filed Nov. 1, 2023, Applicant, Femasys Inc., 2 p.
[cited by applicant]
Final Rejection, translation, issued May 30, 2023, in Korean Patent Application No. 10-2019-7026332, filed Feb. 8, 2018, Applicant, Femasys Inc., 10 p.
[cited by applicant]
NonFinal Rejection, translation, issued Sep. 26, 2023, in Korean Patent Application No. 10-2019-7026332, filed Feb. 8, 2018, Applicant Femasys Inc., 10 p.
[cited by applicant]
Notice of Allowance, issued Jun. 27, 2024, in Korean Patent Application No. 10-2019-7026332, Filed Feb. 8, 2018, Applicant Femasys Inc., 8 p.
[cited by applicant]
“European Application Serial No. 25182956.0, Extended European Search Report mailed Nov. 17, 2025”, 7 pgs.
[cited by applicant]
“Canadian Application Serial No. 3,050,319, Response filed Aug. 9, 2024 to Office Action mailed Apr. 19, 2024”, 10 pgs.
[cited by applicant]
“European Application Serial No. 18751753.7, Response filed Jul. 20, 2021 to Extended European Search Report mailed Dec. 8, 2020”, 11 pgs.
[cited by applicant]
“European Application Serial No. 18751753.7, Response filed Jun. 15, 2023 to Communication Pursuant to Article 943 EPC mailed May 3, 2023”, 97 pgs.
[cited by applicant]
“Korean Application Serial No. 10-2019-7026332, Response filed Dec. 21, 2022 to Notice of Preliminary Rejection mailed Sep. 19, 2022”, W English Claims, 37 pgs.
[cited by applicant]
“Korean Application Serial No. 10-2019-7026332, Response filed Aug. 11, 2023 to Final Rejection mailed May 30, 2023”, W English Claims, 27 pgs.
[cited by applicant]
“Korean Application Serial No. 10-2019-7026332, Response filed Dec. 15, 2023 to Non Final Rejection mailed Sep. 26, 2023”, W English Claims, 17 pgs.
[cited by applicant]
“Japanese Application Serial No. 2019-542727, Notification of Reasons for Rejection mailed Jan. 11, 2022”, W English Translation, 6 pgs.
[cited by applicant]
“Japanese Application Serial No. 2019-542727, Response filed Jun. 27, 2022 to Notification of Reasons for Rejection mailed Jan. 11, 2022”, 2 pgs.
[cited by applicant]
“Japanese Application Serial No. 2019-542727, Response filed Mar. 16, 2023 to Notification of Reasons for Rejection mailed Oct. 4, 2022”, 3 pgs.
[cited by applicant]
“Japanese Application Serial No. 2019-542727, Response filed Jul. 13, 2023 to Notification of Reasons for Rejection mailed May 16, 2023”, 6 pgs.
[cited by applicant]
“Indian Application Serial No. 202244057646, Response filed Jul. 27, 2022 to First Examination Report mailed Jan. 31, 2022”, 8 pgs.
[cited by applicant]