Air-gap encapsulation of nanostructured optical devices
Embodiments described herein relate to encapsulated optical devices and methods of forming optical devices with controllable air-gapped encapsulation. In one embodiment, a plurality of openings are formed in a support layer surrounding the plurality of optical device structures to create a high refractive index contrast between the optical device structures, the support layer, and the openings. In another embodiment, sacrificial material is disposed in-between the optical device structures and then an encapsulation layer is disposed on the optical device structures. The sacrificial material is removed, forming a space bounded by the encapsulation layer, the substrate, and each of the optical device structures. In yet another embodiment, the encapsulation layer is disposed over the optical device structures forming a space bounded by the encapsulation layer, the substrate, and each of the optical device structures.
1 . An optical device comprising:
a plurality of optical device structures disposed in or on a surface of a substrate, wherein each structure of the plurality of optical device structures comprises:
a critical dimension less than 2 microns corresponding to a width or a diameter of a cross section of each structure; and
a structure material having an optical device refractive index between about 1.7 and about 4.0; and
a support layer in contact with the surface of the substrate, wherein the support layer surrounds each optical device structure of the plurality of optical device structures along the surface of the substrate, the support layer comprising:
a support material having a support layer refractive index of about 1.0 to about 1.5; and
a plurality of openings that extend through the support layer to the surface of the substrate, the plurality of openings having a refractive index of about 1.0, wherein:
the support layer is only disposed between the plurality of optical device structures, and
a height of the support layer is different from a structure height of the plurality of optical device structures.
2 . The optical device of claim 1 , wherein the support layer height is greater than the structure height.
3 . The optical device of claim 1 , wherein the optical device structures comprise one or more of titanium dioxide (TiO 2 ), zinc oxide (ZnO), tin dioxide (SnO 2 ), niobium oxide (Nb 2 O 5 ), aluminum-doped zinc oxide (AZO), titanium nitride (TiN), and zirconium dioxide (ZrO 2 ), indium tin oxide (ITO), tantalum pentoxide (Ta 2 O 5 ), fluorine-doped tin oxide (FTO), vanadium (IV) oxide, aluminum oxide (Al 2 O 3 ), cadmium stannate (Cd 2 SnO 4 ), cadmium stannate (tin oxide) (CTO), zinc stannate (tin oxide) (SnZnO 3 ), silicon, silicon nitride (Si 3 N 4 ), silicon oxycarbide (SiOC), silicon oxynitride (SiON), or silicon dioxide (SiO 2 ).
4 . An optical device comprising:
a plurality of optical device structures distributed along a surface of a substrate, wherein each structure of the plurality of optical device structures comprises:
a critical dimension less than 2 microns corresponding to a width or a diameter of a cross section of each structure; and
a structure material having an optical device refractive index between about 1.7 and about 4.0; and
a support layer in contact with the surface of the substrate, wherein the support layer surrounds each optical device structure of the plurality of optical device structures along the surface of the substrate, the support layer comprising:
a support material having a support layer refractive index of about 1.0 to about 1.5; and
a plurality of openings that extend through the support layer to the surface of the substrate, wherein each of the plurality of openings has a refractive index of about 1.0;
wherein a height of the support layer is greater than a height of the plurality of optical device structures, and
wherein the support layer is only disposed between the plurality of optical device structures.
5 . The optical device of claim 4 , wherein the optical device structures comprise one or more of titanium dioxide (TiO 2 ), zinc oxide (ZnO), tin dioxide (SnO 2 ), niobium oxide (Nb 2 O 5 ), aluminum-doped zinc oxide (AZO), titanium nitride (TiN), and zirconium dioxide (ZrO 2 ), indium tin oxide (ITO), tantalum pentoxide (Ta 2 O 5 ), fluorine-doped tin oxide (FTO), vanadium (IV) oxide, aluminum oxide (Al 2 O 3 ), cadmium stannate (Cd 2 SnO 4 ), cadmium stannate (tin oxide) (CTO), zinc stannate (tin oxide) (SnZnO 3 ), silicon, silicon nitride (Si 3 N 4 ), silicon oxycarbide (SiOC), silicon oxynitride (SiON), or silicon dioxide (SiO 2 ).
6 . The optical device of claim 4 , wherein the support material includes SiO 2 , low-k, SiOC, SiCONH, borophosphosilicate glass (BPSG), phosphosilicate glass (PSG), or Si 3 N 4 materials.
7 . The optical device of claim 4 , wherein the substrate includes silicon (Si), silicon dioxide (SiO2), silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), InP, GaAs, GaN, fused silica, quartz, or sapphire.
8 . The optical device of claim 4 , wherein the substrate includes amorphous dielectrics, non-amorphous dielectrics, crystalline dielectrics, silicon dioxide, silicon carbide, polymers, or combinations thereof.
9 . The optical device of claim 1 , wherein the support material includes SiO 2 , low-k, SiOC, SiCONH, borophosphosilicate glass (BPSG), phosphosilicate glass (PSG), or Si 3 N 4 materials.
10 . The optical device of claim 1 , wherein the substrate includes silicon (Si), silicon dioxide (SiO2), silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), InP, GaAs, GaN, fused silica, quartz, or sapphire.
11 . The optical device of claim 1 , wherein the substrate includes amorphous dielectrics, non-amorphous dielectrics, crystalline dielectrics, silicon dioxide, silicon carbide, polymers, or combinations thereof.