Transformer device and semiconductor device
A transformer device includes: a planar first coil; a first insulation layer being provided above the first coil; an intermediate layer being provided above the first insulation layer; a second insulation layer being provided above the intermediate layer; a planar second coil being provided above the second insulation layer and facing the first coil; and a pad having conductivity being provided above the second insulation layer and being connected to one end side of the second coil. The pad is disposed at a position at least partially overlapping the intermediate layer in plan view. The intermediate layer has hardness higher than hardness of the first insulation layer and the second insulation layer.
1 . A transformer device comprising:
a planar first coil;
a first insulation layer being provided above the first coil;
an intermediate layer being provided above the first insulation layer;
a second insulation layer being provided above the intermediate layer;
a planar second coil being provided on an upper surface of the second insulation layer and facing the first coil; and
a pad having conductivity being provided above the second insulation layer and being connected to one end side of the second coil, wherein
the pad is disposed at a position at least partially overlapping the intermediate layer in plan view,
the intermediate layer has hardness higher than hardness of the first insulation layer and the second insulation layer, and
the intermediate layer covers an entire upper surface and side surface of the first insulation layer.
2 . The transformer device according to claim 1 , wherein
the first insulation layer and the second insulation layer are each an organic insulation layer.
3 . The transformer device according to claim 1 , wherein
the first insulation layer and the second insulation layer contain polyimide.
4 . The transformer device according to claim 1 , wherein
the intermediate layer is a conductor.
5 . The transformer device according to claim 4 , wherein
the intermediate layer contains aluminum or copper.
6 . The transformer device according to claim 2 , further comprising:
an inorganic insulation layer being provided on an upper surface of the first insulation layer, wherein
at least a part of the intermediate layer is provided on an upper surface of the inorganic insulation layer, and
thickness of the inorganic insulation layer is 1 μm or less.
7 . The transformer device according to claim 6 , wherein
the inorganic insulation layer covers an upper surface and side surface of the first insulation layer.
8 . The transformer device according to claim 2 , wherein
organic insulation layers of three or more layers including the first insulation layer and the second insulation layer are stacked in upper and lower directions between the first coil and the second coil.
9 . The transformer device according to claim 1 , wherein
insulation layers of three or more layers including the first insulation layer and the second insulation layer are stacked in upper and lower directions between the first coil and the second coil, and
the intermediate layer has hardness higher than hardness of each of the insulation layers of the three or more layers.
10 . The transformer device according to claim 1 , wherein
a partial region of the intermediate layer in plan view enters inside of the first insulation layer from an upper side of the first insulation layer.
11 . The transformer device according to claim 1 , further comprising:
a third insulation layer being provided above the first coil and below the first insulation layer, wherein
the third insulation layer has hardness higher than hardness of the first insulation layer, and
a partial region of the intermediate layer in plan view penetrates the first insulation layer and comes in contact with the third insulation layer.
12 . The transformer device according to claim 1 , wherein
a hole penetrating in upper and lower directions is provided in the intermediate layer.
13 . The transformer device according to claim 1 , wherein
the first insulation layer and the second insulation layer each have thickness of 5 μm or more.
14 . The transformer device according to claim 1 , wherein
the intermediate layer is a nonmagnetic layer.
15 . A transformer device comprising:
a planar first coil;
a first insulation layer being provided above the first coil;
an intermediate layer being provided above the first insulation layer;
a second insulation layer being provided above the intermediate layer;
a planar second coil being provided on an upper surface of the second insulation layer and facing the first coil; and
a pad having conductivity being provided above the second insulation layer and being connected to one end side of the second coil, wherein
the pad is disposed at a position at least partially overlapping the intermediate layer in plan view,
the first insulation layer and the second insulation layer are each an organic insulation layer,
the intermediate layer is a metal layer or a glass layer, and
the intermediate layer covers an entire upper surface and side surface of the first insulation layer.
16 . The transformer device according to claim 15 , wherein
the first insulation layer and the second insulation layer contain polyimide.
17 . The transformer device according to claim 15 , wherein
the intermediate layer contains aluminum or copper.
18 . The transformer device according to claim 15 , further comprising:
an inorganic insulation layer being provided on an upper surface of the first insulation layer, wherein
at least a part of the intermediate layer is provided on an upper surface of the inorganic insulation layer, and
thickness of the inorganic insulation layer is 1 μm or less.
19 . The transformer device according to claim 18 , wherein
the inorganic insulation layer covers an upper surface and side surface of the first insulation layer.
20 . The transformer device according to claim 15 , wherein
organic insulation layers of three or more layers including the first insulation layer and the second insulation layer are stacked in upper and lower directions between the first coil and the second coil.
21 . The transformer device according to claim 15 , wherein
insulation layers of three or more layers including the first insulation layer and the second insulation layer are stacked in upper and lower directions between the first coil and the second coil, and
the intermediate layer has hardness higher than hardness of each of the insulation layers of the three or more layers.
22 . The transformer device according to claim 15 , wherein
a partial region of the intermediate layer in plan view enters inside of the first insulation layer from an upper side of the first insulation layer.
23 . The transformer device according to claim 15 , further comprising:
a third insulation layer being provided above the first coil and below the first insulation layer, wherein
the third insulation layer has hardness higher than hardness of the first insulation layer, and
a partial region of the intermediate layer in plan view penetrates the first insulation layer and comes in contact with the third insulation layer.
24 . The transformer device according to claim 15 , wherein
a hole penetrating in upper and lower directions is provided in the intermediate layer.
25 . The transformer device according to claim 15 , wherein
the first insulation layer and the second insulation layer each have thickness of 5 μm or more.
26 . The transformer device according to claim 15 , wherein
the intermediate layer is a nonmagnetic layer.
27 . A semiconductor device comprising:
the transformer device according to claim 1 ; and
a semiconductor circuit being electrically connected to the first coil or the second coil.
28 . The semiconductor device according to claim 27 , wherein
the transformer device and the semiconductor circuit are formed in an identical chip.
29 . A semiconductor device comprising:
the transformer device according to claim 15 ; and
a semiconductor circuit being electrically connected to the first coil or the second coil.
30 . The semiconductor device according to claim 29 , wherein
the transformer device and the semiconductor circuit are formed in an identical chip.