Radio-frequency module and communication device
A radio-frequency module includes amplifiers and, a transformer including a primary coil and a secondary coil, an antenna connection terminal, an inductor disposed in series between one end of the secondary coil and the antenna connection terminal, and a capacitor connected between a path connecting the one end of the secondary coil and the inductor and a ground. One end of the primary coil is connected to an output end of the amplifier, another end of the primary coil is connected to an output end of the amplifier, another end of the secondary coil is connected to the ground, and the secondary coil and the inductor are coupled to each other via magnetic field coupling.
1 . A radio-frequency module comprising:
a first amplifier and a second amplifier;
a transformer including a primary coil and a secondary coil;
an output terminal;
a first inductor disposed in series between one end of the secondary coil and the output terminal; and
a first capacitor connected between a path connecting the one end and the first inductor and a ground,
wherein one end of the primary coil is connected to an output end of the first amplifier,
wherein another end of the primary coil is connected to an output end of the second amplifier,
wherein another end of the secondary coil is connected to the ground, and
wherein the secondary coil and the first inductor are coupled to each other via magnetic field coupling.
2 . The radio-frequency module according to claim 1 ,
wherein the first capacitor is connected to a first node on the path, and
wherein there are no inductors connected between the first node and the first capacitor and between the first capacitor and the ground.
3 . The radio-frequency module according to claim 1 ,
wherein the secondary coil and the first inductor are coupled to each other in opposite polarity via magnetic field coupling.
4 . The radio-frequency module according to claim 1 ,
wherein, in bandpass characteristics of a radio-frequency signal from the one end of the secondary coil to the output terminal, an attenuation pole corresponding to LC series resonance that occurs due to a mutual inductance component generated by magnetic field coupling between the secondary coil and the first inductor and the first capacitor is formed.
5 . The radio-frequency module according to claim 1 , further comprising:
a module substrate,
wherein the secondary coil is a planar coil formed in the module substrate, and the first inductor is a chip inductor disposed on the module substrate, or
wherein the first inductor is a planar coil formed in the module substrate, and the transformer is a planar coil formed in the module substrate, or
wherein the first inductor is a planar coil formed in the module substrate, and the transformer is a chip transformer disposed on the module substrate, or
wherein the first inductor is a chip inductor formed on the module substrate, the transformer is a chip transformer disposed on the module substrate, and the first inductor and the transformer are disposed on the module substrate so as to be adjacent to each other.
6 . A radio-frequency module comprising:
a first amplifier and a second amplifier;
a transformer including a primary coil and a secondary coil;
an output terminal;
a first inductor disposed in series between one end of the secondary coil and the output terminal; and
a first capacitor connected between a path connecting the one end and the first inductor and a ground,
wherein one end of the primary coil is connected to an output end of the first amplifier,
wherein another end of the primary coil is connected to an output end of the second amplifier,
wherein another end of the secondary coil is connected to the ground,
wherein the secondary coil and the first inductor are disposed so as to be adjacent to each other, and
wherein, assuming the first inductor is viewed in a direction of a winding axis of the secondary coil, the secondary coil and the first inductor at least partially overlap each other, and, assuming the secondary coil is viewed in a direction of a winding axis of the first inductor, the first inductor and the secondary coil at least partially overlap each other.
7 . The radio-frequency module according to claim 6 ,
wherein the first capacitor is connected to a first node on the path, and
wherein there are no inductors connected between the first node and the first capacitor and between the first capacitor and the ground.
8 . The radio-frequency module according to claim 6 ,
wherein the secondary coil and the first inductor are coupled to each other in opposite polarity via magnetic field coupling.
9 . The radio-frequency module according to claim 6 ,
wherein, in bandpass characteristics of a radio-frequency signal from the one end of the secondary coil to the output terminal, an attenuation pole corresponding to LC series resonance that occurs due to a mutual inductance component generated by magnetic field coupling between the secondary coil and the first inductor and the first capacitor is formed.
10 . The radio-frequency module according to claim 6 , further comprising:
a module substrate,
wherein the secondary coil is a planar coil formed in the module substrate, and the first inductor is a chip inductor disposed on the module substrate, or
wherein the first inductor is a planar coil formed in the module substrate, and the transformer is a planar coil formed in the module substrate, or
wherein the first inductor is a planar coil formed in the module substrate, and the transformer is a chip transformer disposed on the module substrate, or
wherein the first inductor is a chip inductor formed on the module substrate, the transformer is a chip transformer disposed on the module substrate, and the first inductor and the transformer are disposed on the module substrate so as to be adjacent to each other.
11 . A radio-frequency module comprising:
a first amplifier and a second amplifier;
an output terminal;
a first LC series circuit including a first inductor and a first capacitor connected in series with each other;
a second LC series circuit including a second inductor and a second capacitor connected in series with each other;
a first matching network including a third inductor and a third capacitor; and
a second matching network including a fourth inductor and a fourth capacitor,
wherein the first LC series circuit is connected between a first path connecting an output end of the first amplifier and the output terminal and a ground,
wherein the second LC series circuit is connected between a second path connecting an output end of the second amplifier and the output terminal and the ground,
wherein the first matching network is connected to the first path,
wherein the second matching network is connected to the second path, and
wherein the first inductor and the second inductor are coupled to each other via magnetic field coupling.
12 . The radio-frequency module according to claim 11 ,
wherein the first inductor and the second inductor are disposed so as to be adjacent to each other, and
wherein a winding axis of the first inductor and a winding axis of the second inductor are parallel to each other.
13 . The radio-frequency module according to claim 11 ,
wherein the third inductor is disposed in series between a first node, on the first path, to which the first LC series circuit is connected and the output end of the first amplifier,
wherein the third capacitor is connected between a path connecting the output end of the first amplifier and the third inductor and the ground,
wherein the fourth inductor is disposed in series between a second node, on the second path, to which the second LC series circuit is connected and the output end of the second amplifier, and
wherein the fourth capacitor is connected between a path connecting the output end of the second amplifier and the fourth inductor and the ground.
14 . The radio-frequency module according to claim 13 , further comprising:
a fifth inductor disposed between the first inductor and the second inductor and having both ends connected to the ground.
15 . The radio-frequency module according to claim 14 , further comprising:
a module substrate,
wherein the first inductor and the second inductor are disposed so that respective winding axes are perpendicular to a main surface of the module substrate, and
wherein the fifth inductor is a ground coil formed in or on the module substrate so as to be adjacent to the first inductor and the second inductor and surround the first inductor and the second inductor assuming the main surface of the module substrate is viewed in plan.
16 . The radio-frequency module according to claim 12 ,
wherein the third inductor is disposed in series between a first node, on the first path, to which the first LC series circuit is connected and the output end of the first amplifier,
wherein the third capacitor is connected between a path connecting the output end of the first amplifier and the third inductor and the ground,
wherein the fourth inductor is disposed in series between a second node, on the second path, to which the second LC series circuit is connected and the output end of the second amplifier, and
wherein the fourth capacitor is connected between a path connecting the output end of the second amplifier and the fourth inductor and the ground.
17 . The radio-frequency module according to claim 16 , further comprising:
a fifth inductor disposed between the first inductor and the second inductor and having both ends connected to the ground; and
a module substrate,
wherein the first inductor and the second inductor are disposed so that respective winding axes are perpendicular to a main surface of the module substrate, and
wherein the fifth inductor is a ground coil formed in or on the module substrate so as to be adjacent to the first inductor and the second inductor and surround the first inductor and the second inductor assuming the main surface of the module substrate is viewed in plan.
18 . A communication device comprising:
a signal processing circuit configured to process a radio-frequency signal; and
the radio-frequency module according to claim 1 configured to transmit the radio-frequency signal between the signal processing circuit and an antenna.
19 . A communication device comprising:
a signal processing circuit configured to process a radio-frequency signal; and
the radio-frequency module according to claim 6 configured to transmit the radio-frequency signal between the signal processing circuit and an antenna.
20 . A communication device comprising:
a signal processing circuit configured to process a radio-frequency signal; and
the radio-frequency module according to claim 11 configured to transmit the radio-frequency signal between the signal processing circuit and an antenna.