Circuit, circuit board, and heat sink assembly for retrofitting a lighting system with LED lights
An apparatus for retrofitting a HID lighting system includes using existing components of previously installed HID lighting systems such as its ballasts while replacing some capacitors to adjust the power supplied to a retrofit LED luminaire. Unused ballast drivers are removed, and a self-contained ballast driver assembly is mounted into the electronic control enclosure of the previously installed lighting system. Some of the retrofit LED luminaires include an uplighting lens, an optic, or a diffuser for providing uplight. An aiming bracket and an aiming plate allow for the horizontal aiming angle of a light luminaire to be set.
1 . A circuit board and heat sink assembly comprising:
a circuit board including
a top circuit mounting surface,
a plurality of side mounting tabs, and
a plurality of circuitry components attached to the top circuit mounting surface;
a heat sink attached to the top circuit mounting surface that is in thermal communication with one or more of the plurality of circuitry components; and
a pan for receiving the heat sink that is disposed between the heat sink and the circuit board.
2 . The circuit board and heat sink assembly of claim 1 , further comprising a thermally conducting and electrically insulating material disposed between one or more of the plurality of circuitry components and the heat sink.
3 . The circuit board and heat sink assembly of claim 2 , wherein the thermally conducting and electrically insulating material comprises silicone and alumina.
4 . The circuit board and heat sink assembly of claim 1 , wherein the heat sink is L-shaped.
5 . The circuit board and heat sink assembly of claim 1 , wherein the heat sink is made from aluminum.
6 . The circuit board and heat sink assembly of claim 1 , further comprising a plurality of connectors disposed near a front of the top circuit mounting surface that are in communication with the plurality of circuitry components.
7 . The circuit board and heat sink assembly of claim 1 , wherein the heat sink defines a clip receiving groove at least partially defined by a top ledge, and a bottom catch rib.
8 . The circuit board and heat sink assembly of claim 7 , further comprising at least a first clip that is disposed in the groove and contacting at least one of the plurality of circuitry components.
9 . The circuit board and heat sink assembly of claim 1 , wherein the plurality of side mounting tabs includes a front mounting tab, a rear mounting tab, and an intermediate mounting tab.
10 . The circuit board and heat sink assembly of claim 1 , wherein the pan is fabricated from an electrically insulating material, a thermally insulating material, or both.
11 . The circuit board and heat sink assembly of claim 1 , wherein the pan comprises Polybutylene Terephthalate.