Laterally mounted and packaged structure and manufacturing method thereof
A manufacturing method includes performing imposition on at least two discrete double-side packaged structures such that lateral electrical connection structures located on the same side of each of the at least two discrete double-side packaged structures are coplanar; and electrically mounting a first component onto lateral electrical connection structures on the first side, where a double-side packaged structure includes a substrate, the lateral electrical connection structures are formed on the first face and the second face of the substrate, and the first face is opposite to the second face and is adjacent to the first side.
1 . A manufacturing method of a laterally mounted and packaged structure, comprising:
mounting first structures onto a first face of a first substrate;
molding the first face of the first substrate;
mounting second structures onto a second face of the first substrate; wherein each of the first structures is aligned with a respective one of the second structures in a thickness direction of the first substrate;
molding the second face of the first substrate; wherein the second face of the first substrate is opposite to the first face of the first substrate;
splitting the first substrate, the first structures and the second structures in the thickness direction of the first substrate to form at least two discrete double-side packaged structures such that the first substrate is divided into second substrates, each of the first structures is divided into first-face lateral electrical connection structures, each of the second structures is divided into second-face lateral electrical connection structures; wherein each of the at least two discrete double-side packaged structures comprises one second substrate of the second substrates, one first-face lateral electrical connection structure of the first-face lateral electrical connection structures, and one second-face lateral electrical connection structure of the second-face lateral electrical connection structures;
performing imposition on the at least two discrete double-side packaged structures such that the first-face lateral electrical connection structures and the second-face lateral electrical connection structures located on a first side of each of the at least two discrete double-side packaged structures are coplanar; wherein the one first-face lateral electrical connection structure and the one second-face lateral electrical connection structure are respectively formed on a first face and a second face of the one second substrate and are coplanar on the first side of each of the at least two discrete double-side packaged structures, the first face is opposite to the second face on each of the at least two discrete double-side packaged structures, and each of the first face and the second face is adjacent to the first side on each of the at least two discrete double-side packaged structures, and
electrically mounting a first component on the first side of each of the at least two discrete double-side packaged structures to form the laterally mounted and packaged structure, wherein the first component is connected to both of the one first-face lateral electrical connection structure and the one second-face lateral electrical connection structure in each of the at least two discrete double-side packaged structures.
2 . The manufacturing method according to claim 1 , before electrically mounting the first component on the first side of each of the at least two discrete double-side packaged structures to form the laterally mounted and packaged structure, the manufacturing method further comprising:
forming flux layer on the one first-face lateral electrical connection structure and the one second-face lateral electrical connection structure;
wherein electrically mounting the first component on the first side of each of the at least two discrete double-side packaged structures to form the laterally mounted and packaged structure comprises:
soldering the first component onto the flux layer on the first side of each of the at least two discrete double-side packaged structures.
3 . The manufacturing method according to claim 1 , after performing the imposition on the at least two discrete double-side packaged structures such that the first-face lateral electrical connection structures and the second-face lateral electrical connection structures located on the first side of each of the at least two discrete double-side packaged structures are coplanar, the manufacturing method further comprising:
forming a flux layer on lateral electrical connection structures on a second side of each of the at least two discrete double-side packaged structures; and
soldering a second component onto the flux layer on the second side;
wherein the second side is opposite to the first side on each of the at least two discrete double-side packaged structures.
4 . The manufacturing method according to claim 1 , after performing the imposition on the at least two discrete double-side packaged structures such that the first-face lateral electrical connection structures and the second-face lateral electrical connection structures located on the first side of each of the at least two discrete double-side packaged structures are coplanar, the manufacturing method further comprising:
forming a flux layer on lateral electrical connection structures on a second side of each of the at least two discrete double-side packaged structures; and
soldering a second component onto the flux layer on the second side;
wherein the second side is adjacent to the first side on each of the at least two discrete double-side packaged structures.
5 . The manufacturing method according to claim 1 , wherein performing the imposition on the at least two discrete double-side packaged structures such that the first-face lateral electrical connection structures and the second-face lateral electrical connection structures located on the first side of each of the at least two discrete double-side packaged structures are coplanar comprises:
placing the at least two discrete double-side packaged structures into a jig, and performing the imposition by use of the jig such that the one first-face lateral electrical connection structure and the one second-face lateral electrical connection structure located on the first side of each of the at least two discrete double-side packaged structures are coplanar.
6 . The manufacturing method according to claim 5 , wherein
the is second substrates are perpendicular to a work surface of the jig.
7 . The manufacturing method according to claim 5 , after electrically mounting the first component on the first side of each of the at least two discrete double-side packaged structures to form the laterally mounted and packaged structure, the manufacturing method further comprising:
moving the laterally mounted and packaged structure away from the jig, wherein the laterally mounted and packaged structure is formed by being laterally mounted.