Systems and methods for testing optical communication devices
A test system for a device under test (DUT) includes an arm to hold the DUT, the arm having a predetermined heat capacity to act as a heat sink for the DUT; spring pins each to secure the DUT pins to pads on a test board, each pin supporting a 90 gigahertz bandwidth; and an actuator coupled to the arm to align the DUT over a test board on a horizontal X-axis and a vertical Y-axis, the actuator providing a compressive Z-axis force on the DUT to electrically couple the DUT to the test board.
1 . A test system for a device under test (DUT), comprising:
an arm to hold the DUT, the arm having a predetermined heat capacity to act as a heat sink for the DUT;
spring pins each to secure the DUT pins to pads on a test board, each pin supporting at least a 90 gigahertz bandwidth, wherein the spring pin comprises a top plunger element defining an electrical contact at one end, and a plunger at an opposed end; and
an actuator coupled to the arm to align the DUT over a test board on a horizontal X-axis and a vertical Y-axis, the actuator providing a compressive Z-axis force on the DUT to electrically couple the DUT to the test board.
2 . The system of claim 1 , wherein the spring pin comprises a top plunger element defining an electrical contact at one end, and a plunger at an opposed end.
3 . The system of claim 1 , wherein the actuator comprises a micro-positioner.
4 . The system of claim 1 , wherein the actuator comprises a video camera for optical placement of the DUT.
5 . The system of claim 4 , comprising means for positioning the arm based on a video feedback loop.
6 . The system of claim 1 , wherein the DUT comprises a laser device and wherein the arm comprises a predetermined heat capacity to cool the DUT during testing.
7 . The system of claim 1 , comprising test signal generator coupled to at least one of the pins to provide an input stimulus.
8 . The system of claim 1 , wherein the DUT comprises a Transmitter Optical Sub Assembly (TOSA), a Receiver Optical Sub Assembly (ROSA), or a Bi-Directional Optical Sub Assembly (BOSA).
9 . The system of claim 1 , wherein the DUT comprises a ball-grid-array (BGA) device.
10 . The system of claim 1 , comprising a force sensor to detect the Z-axis force on the DUT and the test board.
11 . A method to test for a device under test (DUT), comprising:
securing the DUT to an arm having a predetermined heat capacity to act as a heat sink for the DUT;
moving the arm to align the DUT over a test board on a horizontal X-axis and a vertical Y-axis with an actuator;
positioning the arm based on a video feedback loop; and
applying a compressive Z-axis force on the DUT to electrically couple the DUT to a test board with flexible pins to secure the DUT pins to pads on the test board, each pin supporting at least a 90 gigahertz bandwidth.
12 . The method of claim 11 , wherein the spring pin comprises a top plunger element defining an electrical contact at one end, a plunger at an opposed end.
13 . The method of claim 11 , wherein the actuator comprises a micro-positioner.
14 . The method of claim 11 , wherein the actuator comprises a video camera coupled to the actuator, comprising performing computer vision for optical placement of the DUT over the test board.
15 . The method of claim 14 , comprising positioning the arm based on a video feedback loop.
16 . The method of claim 11 , wherein the arm comprises a predetermined heat capacity to cool the DUT.