Magnetron with controller for monitoring and control
A magnetron structure is described for use in a sputtering apparatus. The magnetron structure comprises a magnetron and a controller rigidly connected to the magnetron. The controller is adapted for at least partly controlling a condition and/or a functioning of the sputtering unit.
1 . A magnetron structure for use in a sputtering apparatus that comprises, when in operation, a vacuum part and an exterior non-vacuum part, the magnetron structure comprising:
a magnetron,
a sensor for sensing sensor signals related to the sputtering apparatus or a sputtering process, and
a controller rigidly connected to the magnetron, the controller comprising a data processor being adapted for receiving and processing the sensor signals from the sensor and being configured for processing the sensor signals into data for monitoring or controlling a status of the sputtering apparatus or components thereof or a status of the sputtering process;
wherein parts removable with a target are distinct from the magnetron structure, the controller being rigidly connected to the magnetron directly, the data processor thus, when in operation, being in the vacuum part of the sputtering apparatus.
2 . The magnetron structure according to claim 1 , wherein the controller further comprises data storage for storing the data related to the at least partly monitoring and/or controlling of a condition and/or a functioning of the sputtering apparatus.
3 . The magnetron structure according to claim 1 , wherein the magnetron is an endblock adapted for supporting a cylindrical magnet bar and sputter target.
4 . The magnetron structure according to claim 1 , wherein the controller further comprises a communication component for interchanging data with a further controller external to a vacuum part of the sputtering apparatus.
5 . The magnetron structure according to claim 4 , wherein the communication component is adapted for performing wireless communication using any of WIFI communication, Bluetooth communication, optical communication, or any EM radiation or for performing wired communication using any of optical fiber communication or electrical communication.
6 . The magnetron structure according to claim 1 , wherein the magnetron further comprises an actuation controller for controlling at least one actuator for adjusting a parameter related to the sputtering process in the sputtering apparatus.
7 . The magnetron structure according to claim 1 , the magnetron structure further comprising a power source for powering the controller, the power source being one of a battery or a power extractor adapted to obtain power from a cooling fluid flow or an electrical powering of a target tubes in the sputtering apparatus.
8 . The magnetron structure according to claim 1 , wherein powering of the controller is based on a wired connection from the exterior non-vacuum part of the sputtering apparatus.
9 . The magnetron structure according to claim 1 , wherein the magnetron comprises a top part for holding the target and a bottom part attachable to the top part, wherein the controller is rigidly connected to the bottom part.
10 . The magnetron structure according to claim 1 ,
wherein the structure comprises a wireless connector including an antenna for transmitting data to the exterior non-vacuum part of the sputtering apparatus.
11 . The magnetron structure according to claim 1 , wherein the data is any or a combination of cooling liquid related information, sputter power related information, magnetics related information, magnetron condition related information or target driving related information.
12 . The magnetron structure according to claim 1 , wherein the controller provides information for facilitating maintenance while being in use, giving information about its status and about the projected moment of required preventive maintenance.
13 . The magnetron structure according to claim 1 , wherein the controller provides information for facilitating maintenance while being in revision to understand the historic data thus facilitating adequate revision and maintenance.
14 . The magnetron structure according to claim 1 , wherein the controller is a microcontroller.
15 . A sputtering apparatus comprising a magnetron structure according to claim 1 and a magnet configuration.
16 . The magnetron structure according to claim 1 , wherein the data is any or a combination of incoming temperature of a cooling liquid, outgoing temperature of the cooling liquid, pressure of the cooling liquid, flow rate of the cooling liquid or resistivity of the cooling liquid, voltage towards the target, voltage on specific parts, electrical current through the system, spectral content or impedance, type of magnet configuration, positioning of the magnet configuration, local positioning, temperature, magnetic strength, temperature close to the target, temperature on specific parts of the magnetron, pressure inside the system, rotation or movement speed, operational lifetime, driving unit electrical current or torque level over time or temperature of the driving unit.
17 . The magnetron structure according to claim 1 , wherein the controller is an integrated circuit.
18 . The magnetron structure according to claim 1 , wherein the controller is an integrated module being at least partly ring-shaped and thereby being tailored to geometries of the magnetron being an endblock for cylindrical targets.
19 . A magnetron structure for use in a sputtering apparatus that comprises, when in operation, a vacuum part and an exterior non-vacuum part, the magnetron structure comprising:
a magnetron,
a sensor for sensing sensor signals related to the sputtering apparatus or a sputtering process, and
a controller rigidly connected to the magnetron, the controller comprising a data processor being adapted for receiving and processing the sensor signals from the sensor and being configured for processing the sensor signals into data for monitoring or controlling a status of the sputtering apparatus or components thereof or a status of the sputtering process;
wherein parts removable with a target are distinct from the magnetron structure, the controller being rigidly connected to the magnetron directly, the data processor thus, when in operation, being in the vacuum part of the sputtering apparatus,
wherein the controller further comprises data storage for storing data over time related to the at least partly monitoring and/or controlling of a condition and/or a functioning of the sputtering apparatus.