Liquid-cooling heat dissipation device
View Patent ↗A liquid-cooling heat dissipation device which comprises a cooling plate, a heat dissipator having a working liquid therein, and at least two conduits connecting the cold plate to the heat dissipator is described. A surface of the cooling plate is configured to contact a heat-generating component, thereby transferring the heat generated by the heat-generating component to the cooling plate and conducting the heat away to the heat dissipator via a working liquid.
1 . A liquid-cooling heat dissipation device, including:
a cooling plate;
a heat dissipator having a working liquid therein, wherein a bottom portion of the heat dissipator comprises a fan device;
and wherein a surface of the cooling plate is configured to contact a heat-generating component; and a first conduit connected to the cooling plate and the heat dissipator; a second conduit connected to the cooling plate and the heat dissipator; wherein the first and second conduits are configured to transport the working liquid; and a carriage device mounted on the fan device, wherein the carriage device is a L-shaped bracket having an underplate and a lateral plate, and a placement space is formed between the underplate, the lateral plate, and a side of the fan device for holding the first and second conduits in the placement space.
2 . The liquid-cooling heat dissipation device according to claim 1 , wherein the heat dissipator is connected to at least the first conduit by an elbow union.
3 . The liquid-cooling heat dissipation device according to claim 1 , wherein a portion of the cooling plate comprises a liquid inlet and a liquid outlet; wherein the first conduit connects the heat dissipator to the liquid inlet, and the wherein second conduit connects the liquid outlet to the heat dissipater, thereby forming a circulation loop, so as to allow the working liquid to circulate between the heat dissipator and the cooling plate.
4 . The liquid-cooling heat dissipation device according to claim 3 , wherein the heat dissipator is connected to the first conduit by a first elbow union.
5 . The liquid-cooling heat dissipation device according to claim 4 , wherein the heat dissipater is connected to the second conduit by a second elbow union.
6 . The liquid-cooling heat dissipation device according to claim 4 , wherein a shield covers the first elbow union, and a bottom portion of the shield comprises a water-absorbing element.
7 . The liquid-cooling heat dissipation device according to claim 1 , wherein the heat-generating component comprises a central processing unit (CPU) or a graphic chip processor.