IP Library Granted Patent US 12,615,872
Granted Patent B2
US 12,615,872 · App. 18/633,060 · Granted Apr 28, 2026

Image sensor and electronic apparatus

Inventor: Yoshihiko Nagahama (Kanagawa, JP)
Assignee: Sony Semiconductor Solutions Corporation
H10F39/813H10F39/018H10F39/182H10F39/199H10F39/8053H10F39/8063H10F39/809H10F39/811
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Quick Facts
Patent No.
US 12,615,872
App. No.
18/633,060
Granted
Apr 28, 2026
Kind
B2
Abstract

An image sensor comprises a first substrate having a first photoelectric transducer and a second photoelectric transducer formed on the first substrate, a first wiring formed on the first substrate and connected to the first photoelectric transducer and the second photoelectric transducer, a second substrate having a pixel transistor formed on the second substrate, the pixel transistor being connected to the first photoelectric transducer and the second photoelectric transducer, a second wiring formed on the second substrate, and a third wiring formed to penetrate the first substrate and the second substrate and connected to the first wiring and the second wiring.

Claims (28)

1 . An image sensor comprising:

a first substrate having a first photoelectric transducer and a second photoelectric transducer formed in the first substrate;

a first wiring formed in the first substrate and connected to the first photoelectric transducer and the second photoelectric transducer;

a second substrate having a pixel transistor formed in the second substrate, the pixel transistor being connected to the first photoelectric transducer and the second photoelectric transducer;

a second wiring formed in the second substrate; and

a third wiring formed under a set region of the first photoelectric transducer and the second photoelectric transducer in a cross-section view and connected to the first wiring and the second wiring.

2 . The image sensor according to claim 1 ,

wherein the pixel transistor has at least one of an amplification transistor, a reset transistor, and a selection transistor.

3 . The image sensor according to claim 1 ,

wherein the first substrate has a first transfer transistor connected to the first photoelectric transducer and a second transfer transistor connected to the second photoelectric transducer.

4 . The image sensor according to claim 3 ,

wherein the first wiring is connected to a first floating diffusion region connected to the first transfer transistor and a second floating diffusion region connected to the second transfer transistor.

5 . The image sensor according to claim 4 , further comprising:

a third substrate stacked on the second substrate and having a logic circuit configured to process a signal generated by the first photoelectric transducer or the second photoelectric transducer.

6 . An electronic apparatus comprising:

an image sensor;

an optical system configured to guide incident light to the image sensor; and

a processing unit configured to process a signal output from the image sensor,

wherein the image sensor includes

a first substrate having a first photoelectric transducer and a second photoelectric transducer formed in the first substrate;

a first wiring formed in the first substrate and connected to the first photoelectric transducer and the second photoelectric transducer;

a second substrate having a pixel transistor formed in the second substrate, the pixel transistor being connected to the first photoelectric transducer and the second photoelectric transducer;

a second wiring formed in the second substrate; and

a third wiring formed under a set region of the first photoelectric transducer and the second photoelectric transducer in a cross-section view and connected to the first wiring and the second wiring.

7 . The image sensor according to claim 1 , wherein

the third wiring is formed under the set region of the first photoelectric transducer, the second photoelectric transducer, a third photoelectric transducer, and a fourth photoelectric transducer, in the cross-section view.

8 . The electronic apparatus according to claim 6 , wherein

the third wiring is formed under the set region of the first photoelectric transducer, the second photoelectric transducer, a third photoelectric transducer, and a fourth photoelectric transducer, in the cross-section view.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 15, 2024
From: NAGAHAMA, YOSHIHIKO
To: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
Reel/Frame 067105/0957 →
Priority Claims (1)
JP 2018-195638 · Oct 17, 2018 · national
Continuity (2)
Division 17284699
Related Publication 20240258358A1 · Aug 1, 2024
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