Interconnect substrate, method of making the same, and method of identifying interconnect substrate
An interconnect substrate includes an insulating layer, a dispersion layer, and an interconnect layer, the insulating layer, the dispersion layer, and the interconnect layer being laminated together, wherein the dispersion layer includes a main material and one or more fillers dispersed in the main material, the one or more fillers forming a unique dispersion pattern, and wherein the unique dispersion pattern is identifiable by image recognition from outside of the interconnect substrate.
1 . An interconnect substrate comprising:
an insulating layer;
a dispersion layer; and
an interconnect layer, the insulating layer, the dispersion layer, and the interconnect layer being laminated together,
wherein the dispersion layer includes a main material and one or more fillers dispersed in the main material, the one or more fillers forming a unique dispersion pattern, and
wherein the unique dispersion pattern is identifiable by image recognition from outside of the interconnect substrate.
2 . The interconnect substrate as claimed in claim 1 , wherein the one or more fillers are either non-conductive particles, fibers, or both.
3 . The interconnect substrate as claimed in claim 2 , wherein the dispersion layer includes a plurality of layers, and each of the plurality of layers contains a filler of a different type or shape than a filler contained in one or more other layers of the plurality of layers.
4 . The interconnect substrate as claimed in claim 1 , wherein density of the one or more fillers is non-uniform in a plan view.
5 . The interconnect substrate as claimed in claim 4 , wherein when the dispersion layer is divided into sections of 5 rows and 5 columns having a same area in a plan view, and a section-wise density of the one or more fillers in each section and an average value of section-wise densities of the one or more fillers in all of the sections are calculated, a maximum value and a minimum value of the section-wise densities are outside a range of 30% above and below the average value in at least one of the sections.
6 . The interconnect substrate as claimed in claim 4 , wherein the density of the one or more fillers decreases from one side to an opposite side in a predetermined direction in a plan view of the dispersion layer.
7 . The interconnect substrate as claimed in claim 1 , wherein the main material of the dispersion layer is a material selected from a group consisting of a thermosetting resin including an epoxy-based resin or a phenol-based resin, a thermoplastic resin including a polyimide-based resin or an acrylic-based resin, an elastomer, a precursor thereof, and a copolymer thereof.
8 . The interconnect substrate as claimed in claim 1 , wherein the main material of the dispersion layer is an amorphous thermoplastic resin or a crystalline thermoplastic resin having an amorphous portion.
9 . The interconnect substrate as claimed in claim 1 , wherein the one or more fillers are an inorganic oxide or an inorganic nitride.
10 . The interconnect substrate as claimed in claim 1 , wherein the one or more fillers are an organic substance.