IP Library Granted Patent US 12,620,719
Granted Patent B2
US 12,620,719 · App. 18/625,964 · Granted May 5, 2026

Planar transparent antenna structure

Inventors: Bing-Syun Li (Hsinchu City, TW); Li-Yang Tsai (Luodong Township, TW); Kuang-Hui Shih (Tainan City, TW); Ruo-Lan Chang (New Taipei City, TW); Kung-Ching Chu (Taipei City, TW); Wei-Chung Chen (Zhunan Township, TW)
Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
H01Q9/285H01Q1/38
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Quick Facts
Patent No.
US 12,620,719
App. No.
18/625,964
Granted
May 5, 2026
Kind
B2
Abstract

A planar transparent antenna structure is provided. The planar transparent antenna structure includes a dielectric substrate, a radiation conductive layer and a ground conductive layer. The dielectric substrate has a first surface and a second surface. The radiation conductive layer is disposed on the first surface of the dielectric substrate. The ground conductive layer is disposed on the second surface of the dielectric substrate. The radiation conductive layer and the ground conductive layer are composed of a plurality of wires connected in a mesh manner. Each of the wires is composed of a plurality of grid lines connected in a mesh manner.

Claims (32)

1 . A planar transparent antenna structure, comprising:

a dielectric substrate, having a first surface and a second surface;

a radiation conductive layer, disposed on the first surface of the dielectric substrate; and

a ground conductive layer, disposed on the second surface of the dielectric substrate;

wherein the radiation conductive layer and the ground conductive layer are composed of a plurality of wires interlaced and connected with each other, and each of the wires interlaced and connected with each other is composed of a plurality of grid lines interlaced and connected with each other to form a two-levels metal mesh.

2 . The planar transparent antenna structure according to claim 1 , wherein a spacing among the wires is less than 1/20 of a dielectric wavelength of the dielectric substrate.

3 . The planar transparent antenna structure according to claim 1 , wherein a width of each of the wires is greater than a sum of a width of each of the grid lines and a spacing among the grid lines.

4 . The planar transparent antenna structure according to claim 1 , wherein a width of each of the grid lines is 5 to 100 um.

5 . The planar transparent antenna structure according to claim 1 , wherein a spacing among of the grid lines is 100 to 300 um.

6 . The planar transparent antenna structure according to claim 1 , wherein the wires are substantially parallel or perpendicular to each other.

7 . The planar transparent antenna structure according to claim 1 , wherein the grid lines are substantially parallel or perpendicular to each other.

8 . The planar transparent antenna structure according to claim 1 , wherein each of the wires includes a plurality of through holes.

9 . The planar transparent antenna structure according to claim 8 , wherein sizes of the through holes are not identical.

10 . The planar transparent antenna structure according to claim 1 , wherein the wires are interlaced and connected to form a plurality of triangles.

11 . The planar transparent antenna structure according to claim 1 , wherein an edge of the radiation conductive layer is a circular structure.

12 . The planar transparent antenna structure according to claim 1 , wherein spacings among the wires are not identical.

13 . A planar transparent antenna structure, comprising:

a dielectric substrate, having a first surface and a second surface;

a radiation conductive layer, disposed on the first surface of the dielectric substrate; and

a ground conductive layer, disposed on the second surface of the dielectric substrate;

wherein the radiation conductive layer and the ground conductive layer are composed of a plurality of wires interlaced and connected with each other, each of the wires interlaced and connected with each other has a plurality of holes, and the wires having the holes are interlaced and connected with each other.

14 . The planar transparent antenna structure according to claim 13 , wherein a spacing among the wires is less than 1/20 of a dielectric wavelength of the dielectric substrate.

15 . The planar transparent antenna structure according to claim 13 , wherein a width of each of the holes is 100 to 300 um.

16 . The planar transparent antenna structure according to claim 13 , wherein a spacing among the holes is 5 to 100 um.

17 . The planar transparent antenna structure according to claim 13 , wherein a width of each of the wires is larger than a width of each of the holes.

18 . The planar transparent antenna structure according to claim 13 , wherein each of the holes is circle.

19 . A planar transparent antenna structure, comprising:

a dielectric substrate, having a first surface and a second surface;

a radiation conductive layer, disposed on the first surface of the dielectric substrate; and

a ground conductive layer, disposed on the second surface of the dielectric substrate;

wherein the radiation conductive layer and the ground conductive layer have a plurality of openings arranged in an array and a plurality of grid lines, and the grid lines are distributed between the openings arranged in the array.

20 . The planar transparent antenna structure according to claim 19 , wherein a width of each of the openings is less than 1/20 of a dielectric wavelength of the dielectric substrate.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 4, 2024
From: LI, BING-SYUN; TSAI, LI-YANG; SHIH, KUANG-HUI; CHANG, RUO-LAN; CHU, KUNG-CHING; CHEN, WEI-CHUNG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 067003/0639 →
Priority Claims (1)
TW 113102792 · Jan 24, 2024 · national
Continuity (2)
Provisional Application 63457428 · Apr 6, 2023
Related Publication 20240339758A1 · Oct 10, 2024
References Cited (18)
US 4609923A · Boan · 1986 [cited by examiner]
US 7847753B2 · Ishibashi · 2010 [cited by examiner]
US 8786516B2 · Parsche · 2014 [cited by examiner]
US 20200203830A1 · Tsuchiya et al. · 2020 [cited by applicant]
US 20240128639A1 · Kim · 2024 [cited by examiner]
CN 111864341A · 2020 [cited by applicant]
CN 112911049A · 2021 [cited by applicant]
CN 114039216A · 2022 [cited by applicant]
CN 114101978A · 2022 [cited by applicant]
EP 2526589B1 · 2014 [cited by applicant]
FR 2955430A1 · 2011 [cited by examiner]
JP 2017175540A · 2017 [cited by applicant]
KR 101060424B1 · 2011 [cited by applicant]
KR 20210081027A · 2021 [cited by examiner]
TW 202215709A · 2022 [cited by applicant]
TW 202245330A · 2022 [cited by applicant]
WO WO2020071316A1 · 2020 [cited by applicant]
Taiwanese Office Action and Search Report for Taiwanese Application No. 113102792, dated Mar. 6, 2025. [cited by applicant]