Optoelectronic component, network device, and method for manufacturing optoelectronic component
An optoelectronic component includes an optical module and a host circuit board. The optical module includes a module circuit board and a gold finger that is located on a first surface of the module circuit board. The host circuit board includes a conductive elastomer corresponding to the gold finger and that is located on a first surface of the host circuit board. The module circuit board is located on the host circuit board, the first surface of the module circuit board and the first surface of the host circuit board face each other, and the gold finger is in contact with the conductive elastomer.
1 . An optoelectronic component comprising:
a host circuit board comprising:
a first host circuit board surface; and
a conductive sheet located on the first host circuit board surface;
an optical module comprising:
a first end;
a second end;
a module circuit board located on the host circuit board and comprising:
a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface; and
a second module circuit board surface;
a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface; and
an air duct located between and passing through the first end and the second end; and
a heat sink located on the second module circuit board surface.
2 . The optoelectronic component of claim 1 , further comprising a thermally conductive layer disposed between the module circuit board and the heat sink.
3 . The optoelectronic component of claim 1 , further comprising:
a plurality of first rows of gold fingers on the first module circuit board surface; and
a plurality of second rows of conductive sheets on the first host circuit board surface, wherein each of the first rows is in contact with one of the second rows.
4 . The optoelectronic component of claim 1 , wherein the host circuit board further comprises a connector, wherein the connector is located between the module circuit board and the host circuit board, and wherein the conductive sheet extends out of the connector and be in contact with the gold finger.
5 . The optoelectronic component of claim 1 , wherein the module circuit board further comprises a module circuit board end adjacent to the second end, and wherein the gold finger is located proximate to the second end.
6 . The optoelectronic component of claim 1 , wherein the optical module is an optical receiving component, an optical sending component, an optical transceiver component, or an optical forwarding component.
7 . A network device comprising:
an optoelectronic component comprising:
a host circuit board comprising:
a first host circuit board surface; and
a conductive sheet located on the first host circuit board surface;
an optical module comprising:
a first end;
a second end;
a module circuit board located on the host circuit board and comprising:
a first module circuit board surface, wherein the first module circuit board surface faces the first host circuit board surface; and
a second module circuit board surface;
a gold finger in contact with the conductive sheet, wherein the gold finger is located on the first module circuit board surface; and
an air duct located between and passing through the first end and the second end; and
a heat sink located on the second module circuit board surface.
8 . The network device of claim 7 , further comprising a thermally conductive layer disposed between the module circuit board and the heat sink.
9 . The network device of claim 7 , if further comprising:
a plurality of first rows of gold fingers on the first module circuit board surface; and
a plurality of second rows of conductive sheets on the first host circuit board surface, wherein each of the first rows is in contact with one of the second rows.
10 . The network device of claim 7 , wherein the host circuit board further comprises a connector, wherein the connector is located between the module circuit board and the host circuit board, and wherein the conductive sheet extends out of the connector and is in contact with the gold finger.
11 . The network device of claim 7 , wherein the module circuit board further comprises a module circuit board end, and wherein the gold finger is located proximate to the module circuit board end.
12 . The network device of claim 7 , wherein the optical module is an optical receiving component, an optical sending component, an optical transceiver integral component, or an optical forwarding component.
13 . A method for manufacturing an optoelectronic component and comprising:
installing a gold finger on a first module circuit board surface of a module circuit board of an optical module that extends from a first end to a second end;
installing a heat sink on a second module circuit board surface of the module circuit board;
installing a conductive sheet on a first host circuit board surface of a host circuit board;
installing the optical module on the first host circuit board surface so that the first module circuit board surface faces the first host circuit board surface, and so that the gold finger is in contact with the conductive sheet; and
disposing an air duct on the optical module so that the air duct is located between and passes through a first end of the optical module and a second end of the optical module.
14 . The method of claim 13 , further comprising installing a thermally conductive layer between the second module circuit board surface and the heat sink.
15 . The method of claim 13 , further comprising:
installing a connector on a second host circuit board surface of the host circuit board so that the conductive sheet is located in the connector and extends out of the connector; and
further installing the optical module on the connector so that the gold finger is in contact with the connector.
16 . The method of claim 13 , further comprising:
installing a plurality of first rows of gold fingers on the first module circuit board surface;
installing a plurality of second rows of conductive sheets on the first host circuit board surface; and
contacting each of the first rows with one of the second rows.
17 . The method of claim 13 , further comprising installing the gold finger proximate to a module circuit board end of the module circuit board that is adjacent to the second end.
18 . The method of claim 13 , wherein the optical module comprises an optical receiving component or an optical sending component.
19 . The method of claim 13 , wherein the optical module comprises an optical transceiver component.
20 . The method of claim 13 , wherein the optical module comprises an optical forwarding component.