Device and a method for manufacturing the same
The present disclosure provides devices and method of manufacturing the devices. An example device includes a substrate, a first electrode on the substrate, a light-emitting element electrically connected to the first electrode by a first metal wiring, and a second electrode electrically connected to the light-emitting element. The first electrode and the light-emitting element are laterally separated from each other. The light-emitting element is connected to the first metal wiring at a side that faces the substrate.
1 . A device comprising:
a substrate;
a first electrode on the substrate, wherein the first electrode comprises a pad on the substrate and a first contact metal electrically connected to the pad;
a light-emitting element electrically connected to the first electrode by a first metal wiring, wherein the first metal wiring is electrically connected to the first contact metal;
a second electrode electrically connected to the light-emitting element,
wherein the first electrode and the light-emitting element are laterally separated from each other, and
wherein the light-emitting element is connected to the first metal wiring at a side that faces the substrate;
a first dielectric layer including the light-emitting element, wherein a thickness of the first dielectric layer is greater than or equal to a thickness of the light-emitting element;
an adhesive layer on the substrate, wherein a thickness of the pad is less than or equal to a thickness of the adhesive layer; and
a second dielectric layer on the first electrode, wherein at least one of the first dielectric layer or the second dielectric layer is made of a photosensitive transparent resin.
2 . The device of claim 1 , comprising a plurality of light-emitting elements having different thicknesses.
3 . The device of claim 1 , wherein the light-emitting element is a vertical type micro-light-emitting diode (LED).
4 . The device of claim 1 , further comprising:
a third electrode on the substrate;
a repair light-emitting element electrically coupled to the third electrode; and
a fourth electrode electrically connected to the repair light-emitting element,
wherein the repair light-emitting element covers at least a portion of the third electrode.
5 . The device of claim 4 , wherein the second electrode and the fourth electrode are common electrodes.
6 . The device of claim 4 , wherein the second electrode and the fourth electrode are transparent electrodes.
7 . A method of manufacturing a device, comprising:
arranging a light-emitting element on a carrier;
forming a first dielectric layer on the carrier so that the light-emitting element is exposed;
forming a metal wiring on the light-emitting element and the first dielectric layer;
forming an adhesive layer on a substrate having a pad;
bonding the carrier and the substrate,
wherein the metal wiring on the carrier faces the pad and the adhesive layer on the substrate, and
wherein the light-emitting element and the pad are laterally separated from each other;
removing the carrier;
etching the first dielectric layer and the adhesive layer until reaching the pad to form an opening;
depositing a contact metal on the opening so that the pad and the metal wiring are electrically connected each other;
forming a second dielectric layer on at least the first dielectric layer so that the light-emitting element is exposed; and
forming an electrode on the light-emitting element.
8 . The method of claim 7 , wherein the light-emitting element is a vertical type micro-light-emitting diode (LED).
9 . The method of claim 7 , wherein a thickness of the first dielectric layer is greater than or equal to a thickness of the light-emitting element.
10 . The method of claim 7 , wherein the light-emitting element comprises a plurality of light-emitting elements having different thicknesses.
11 . The method of claim 7 , wherein a thickness of the pad is less than or equal to a thickness of the adhesive layer.
12 . The method of claim 7 , wherein arranging the light-emitting element on the carrier comprises:
transferring the light-emitting element provided on a spare substrate to a spare carrier; and
transferring the light-emitting element transferred to the spare carrier to the carrier.
13 . The method of claim 7 , wherein the electrode is a common electrode.
14 . The method of claim 7 , wherein the electrode is a transparent electrode.
15 . The method of claim 7 , wherein at least one of the adhesive layer, the first dielectric layer, or the second dielectric layer is made of a photosensitive transparent resin.
16 . The method of claim 7 , comprising:
prior to forming the second dielectric layer, testing an operation of the light-emitting element;
if the light-emitting element does not operate, cutting the metal wiring connected to the non-operating light-emitting element; and
arranging a repair light-emitting element on a contact metal connected to the cut metal wiring.
17 . The device of claim 1 , wherein the adhesive layer includes a thermoset adhesive or a UV-curable adhesive.