Supporting unit and apparatus for treating substrate
Provided is a supporting unit supporting a substrate. The supporting unit may include: a plate; heating elements provided to the plate and controlling a temperature of a substrate, wherein the heating elements are arranged to control temperatures of different areas of the substrate; and a power supply module supplying power to the heating element, and the power supply module may be configured to continuously supply the power to at least two heating elements of the heating elements.
1 . A supporting unit supporting a substrate, comprising:
a plate;
heating elements in the plate, the heating elements being configured to control a temperature of a substrate, the heating elements being arranged to control temperatures of different areas of the substrate; and
a power supply module configured to supply power to the heating elements,
wherein the power supply module is configured to always supply the power to at least two heating elements of the heating elements,
wherein the power supply module including:
a power supply configured to generate the power;
power supply lines connected to power supply stages for the heating elements;
power return lines connected to power return stages of the heating elements;
each of the heating elements do not share a same one of the power supply lines and power return lines;
supply switches installed in the power supply lines, respectively;
return switches installed in the power return lines, respectively;
a first input unit configured to receive a first control signal for controlling the supply switches from a controller;
a second input unit configured to receive a second control signal for controlling the return switch from the controller;
a determination unit that is configured to receive the control signal received by the second input unit and outputs an On signal again when the received signals include at least two On signals; and
a gate unit configured to receive the signal output by the determination unit and the signal input into the first input unit, and
wherein the gate unit includes AND gates corresponding to the supply switches, respectively, and the AND gates receive the signal input into the first input unit and an output signal output by the determination unit.
2 . The supporting unit of claim 1 , wherein a rectifier is installed at a rear stage of the heating elements.
3 . An apparatus for treating a substrate, the apparatus comprising:
a chamber defining a treating space in which a substrate is treated therein; and
a support configured to support and heat the substrate in the treating space,
wherein the support includes a plate,
heating elements provided to the plate and heating the substrate, wherein the heating elements are arranged to control temperatures of different areas of the substrate, and
a power supply module configured to supply power to the heating elements, and
the power supply module is configured to always supply the power to at least two heating elements of the heating elements,
wherein the power supply module including:
a power supply configured to generate the power;
power supply lines connected to power supply stages for the heating elements;
power return lines connected to power return stages of the heating elements;
each of the heating elements do not share a same one of the power supply lines and power return lines;
supply switches installed in the power supply lines, respectively;
return switches installed in the power return lines, respectively;
a first input unit configured to receive a first control signal for controlling the supply switches from a controller;
a second input unit configured to receive a second control signal for controlling the return switch from the controller;
a determination unit that is configured to receive the control signal received by the second input unit and outputs an On signal again when the received signals include at least two On signals; and
a gate unit configured to receive the signal output by the determination unit and the signal input into the first input unit, and
wherein the gate unit includes AND gates corresponding to the supply switches, respectively, and the AND gates receive the signal input into the first input unit and an output signal output by the determination unit.
4 . An apparatus for treating a substrate, the apparatus comprising:
a chamber defining a treating space in which a substrate is treated therein;
a support configured to support the substrate in the treating space;
a plasma source configured to generate plasma for treating the substrate in the treating space; and
a controller,
wherein the supporting includes a plate,
heating elements in the plate and configured to heat the substrate, the heating elements are being arranged to control temperatures of different areas of the substrate, and
a power supply module configured to supply power to the heating elements, and
the power supply module is configured to continuously always supply the power to at least two heating elements of the heating elements,
wherein
the power supply module includes,
a power supply configured to generate power applied to the heating elements,
power supply lines connected to power supply stages of the heating elements,
power return lines connected to power return stages of the heating elements,
supply switches installed in the power supply lines, respectively,
return switches installed in the power return lines, respectively,
a first input unit configured to receive a first control signal for controlling the supply switches from the controller,
a second input unit configured to receive a second control signal for controlling the return switches from the controller,
a determination unit configured to receive the control signal received by the second input unit and outputs an On signal again when the received signals include at least two On signals, and
a gate unit configured to receive the signal output by the determination unit and the signal input by the first input unit,
each of the heating elements is connected to any one of the power supply lines and any one of the power return lines, and
the heating elements do not share a same power supply line and power return line.