Methods for manufacturing laminated plate and heat generator, and defroster
Provided is a method for manufacturing a laminate that is excellent in adhesion between the copper foil and the resin film while using a polyvinyl acetal resin having low reactivity with the copper foil. This method includes the steps of providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate. The amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).
1 . A method for manufacturing a laminate, comprising:
providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and
attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate,
wherein the amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), and
wherein the treated surface has a density of peaks Spd of 100 mm −2 or more and 26000 mm −2 or less, and wherein the Spd is a value measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 2 μm, and cutoff of an L-filter is not performed.
2 . The method according to claim 1 , wherein the amount of nitrogen is 4.0 atomic % or more and 17.0 atomic % or less.
3 . The method according to claim 1 , wherein the amount of nitrogen is 5.0 atomic % or more and 8.5 atomic % or less.
4 . The method according to claim 3 , wherein the treated surface comprises Si, and has a N/Si ratio being a ratio of N to Si of 1.0 or less when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS).
5 . The method according to claim 1 , wherein the treated surface comprises a nitrogen-containing compound.
6 . The method according to claim 5 , wherein the nitrogen-containing compound is a silane compound having an amino group.
7 . The method according to claim 1 , wherein the treated surface has a developed interfacial area ratio Sdr of 0.50% or more and 9.00% or less and a root mean square height Sq of 0.010 μm or more and 0.200 μm or less, and
wherein the Sdr and Sq are values measured in accordance with ISO 25178 under conditions in which a cutoff wavelength of an S-filter is 0.55 μm, and a cutoff wavelength of an L-filter is 10 μm.
8 . The method according to claim 1 , wherein attachment of the resin film to the copper foil is performed by thermocompression-bonding the resin film and the copper foil at a temperature of 180° C. or less and a pressure of 0.6 MPa or less.
9 . The method according to claim 1 , wherein the resin film has a thickness of 1 μm or more and 1000 μm or less.
10 . A method for manufacturing a heating element, comprising:
providing a laminate manufactured by the method according to claim 1 ,
processing the copper foil of the laminate to form a heating wire having a predetermined pattern, and
attaching or forming an additional polyvinyl acetal resin film on the laminate in which the heating wire is formed, so as to sandwich the heating wire, to form a heating element.
11 . The method according to claim 10 , wherein the predetermined pattern comprises at least one pattern selected from the group consisting of a linear shape, a wavy line shape, a lattice shape, and a net shape.
12 . A defroster comprising a heating element manufactured by the method according to claim 10 .
13 . A method for manufacturing a laminate, comprising:
providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and
attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate,
wherein the amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), and
wherein the treated surface comprises a plurality of roughening particles.
14 . A method for manufacturing a laminate, comprising:
providing a copper foil having on at least one side a treated surface on which an amount of nitrogen is 3.0 atomic % or more and 20.0 atomic % or less, and
attaching or forming a polyvinyl acetal resin film on the treated surface of the copper foil to form a laminate,
wherein the amount of nitrogen is a proportion of N in a total amount of N, O, Si, P, S, Cl, Cr, Ni, Cu, Zn, Mo, Co, W, and Fe when the treated surface is subjected to elemental analysis by X-ray photoelectron spectroscopy (XPS), and
wherein the polyvinyl acetal resin is a polyvinyl butyral resin.