Fiber-to-casing bonding
Methods and tools for deploying cables, such as fiber optic cable, downhole in well using adhesive to adhere the cable to an inside surface of a casing.
1 . A method of installing a cable downhole in a well, comprising:
a) deploying a spool of cable down a casing in a well so that said cable unwinds and lies against an interior wall of said casing;
b) applying an epoxy resin and a hardener against said cable, wherein said epoxy resin is applied to said cable using an inline resin applicator at a surface during said deploying step a) and said hardener is applied after said cable is fully deployed; and
c) hardening said epoxy resin so that said cable is affixed against said interior wall.
2 . The method of claim 1 , wherein said cable comprises at least a fiber-optic cable, a wireline, or a combination of one or more wirelines and fiber-optic cables.
3 . A method of installing a cable downhole in a well, comprising:
a) deploying a spool of cable down a casing in a well so that said cable unwinds and lies against an interior wall of said casing;
b) applying an epoxy resin and optionally a hardener against said cable; and
c) hardening said epoxy resin so that said cable is affixed against said interior wall;
wherein said deploying step uses a tool, said tool comprising:
i) a housing having a front end and a back end;
ii) said housing containing said spool that is configured to unwind said cable from said spool as said tool is deployed;
iii) said housing having a cable port for egress of said cable at said back end;
iv) two or more pressors attached to said housing and configured for outward bias of said pressors and said egressed cable against said interior wall;
v) said housing containing an adhesive tank containing said epoxy resin;
vi) said adhesive tank having an outlet fluidly connected to a first feed line;
vii) said first feed line depositing said epoxy resin onto said egressed cable at or behind said pressors.
4 . The method of claim 3 , wherein said cable comprises at least a fiber-optic cable, a wireline, or a combination of one or more wirelines and fiber-optic cables.
5 . The method of claim 3 , said housing further comprising a sensor package for measuring data selected from one or more of temperature data, pressure data, flow data, depth data, strain data and position data.
6 . The method of claim 5 , said housing comprising a communication package for wireless or optical or electrical communication of said data to a surface processor.
7 . The method of claim 3 , said hardener is selected from one or more of a UV light source, a temperature, oxygen, a chemical hardener or combinations thereof.
8 . The method of claim 3 , wherein said cable port is off-center so as to place said sensor cable directly against said casing.
9 . The method of claim 3 , wherein said housing remains in said well after said deploying step and dissolves over time.
10 . A method of installing a cable downhole in a well, comprising:
a) deploying a spool of cable down a casing in a well so that said cable unwinds and lies against an interior wall of said casing;
b) applying an epoxy resin and a hardener against said cable; and
c) hardening said epoxy resin so that said cable is affixed against said interior wall;
wherein said deploying step uses a tool, said tool comprising:
i) a housing having a front end and a back end;
ii) said housing containing said spool, said spool configured to unwind said cable from said spool as said tool is deployed;
iii) said housing having a cable port for egress of said cable at said back end;
iv) two or more pressors attached to said housing and configured for outward bias of said pressors and said egressed cable against said interior wall;
v) said housing containing an adhesive tank containing said epoxy resin and a hardener tank containing said hardener;
vi) said adhesive tank having an outlet fluidly connected to a first feed line and said hardener tank having an outlet fluidly connected to said first feed line or a second feed line;
vii) said first feed line depositing mixed epoxy resin and hardener onto said egressed sensor cable at or behind said pressors, or said first feed line and said second feed line depositing separate epoxy resin and hardener onto said egressed sensor cable at or behind said pressors.
11 . The method of claim 10 , wherein said cable comprises at least a fiber-optic cable, a wireline, or a combination of one or more wirelines and fiber-optic cables.
12 . The method of claim 10 , said housing further comprising a sensor package for measuring data selected from one or more of temperature data, pressure data, flow data, depth data, strain data and position data.
13 . The method of claim 12 , said housing comprising a communication package for wireless or optical or electrical communication of said data to a surface processor.
14 . The method of claim 10 , wherein said hardener is a chemical hardener.
15 . The method of claim 10 , wherein said cable port is off-center so as to place said cable directly against said casing.
16 . The method of claim 10 , wherein said housing remains in said well after said deploying step and dissolves over time.