IP Library Granted Patent US 12,625,017
Granted Patent B2
US 12,625,017 · App. 18/353,040 · Granted May 12, 2026

Dual heat path temperature sensor

Inventors: Wanfeng Huang (Fremont, CA); Hongling Chen (San Jose, CA); Ali M. Amin (Sunnyvale, CA); James C. Clements (Campbell, CA)
Assignee: Apple Inc.
G01K17/16G01K7/06G01K1/143
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,625,017
App. No.
18/353,040
Granted
May 12, 2026
Kind
B2
Abstract

A temperature sensing system includes absolute temperature sensor(s) and/or thermopiles that form concentric geometries and are uniform in height. In some examples, the temperature sensing system can determine internal body temperature and/or ambient temperature based at least on a thermal gradient associated with the inner thermopile, a thermal gradient associated with the outer thermopile, a lateral temperature difference between the inner and the outer thermopiles, and an absolute temperature. In some examples, the temperature sensing system can determine the internal body temperature and/or ambient temperature using at least four absolute temperature sensors forming a concentric structure.

Claims (32)

1 . An electronic device, comprising:

a thermal sensing system comprising:

a sensing surface, wherein the sensing surface comprises an inner thermopile associated with a first heat path and an outer thermopile associated with a second heat path, wherein the inner thermopile is same in height as the outer thermopile, and wherein the inner thermopile and the outer thermopile form concentric geometries; and

a first absolute temperature sensor configured to measure a first absolute temperature; and

a processor communicatively coupled to the thermal sensing system and configured to compute an ambient temperature or body temperature using a first temperature gradient associated with the first heat path, a second temperature gradient associated with the second heat path, a lateral temperature difference between the inner thermopile and the outer thermopile, and the first absolute temperature.

2 . The electronic device of claim 1 , wherein the processor is configured to compute the ambient temperature or the body temperature using the first temperature gradient associated with the first heat path, the second temperature gradient associated with the second heat path, and at least two absolute temperatures.

3 . The electronic device of claim 1 , wherein the first absolute temperature sensor is configured to measure the first absolute temperature at a first surface of the inner thermopile, wherein the thermal sensing system comprises a second absolute temperature sensor configured to measure a second absolute temperature at a first surface of the outer thermopile.

4 . The electronic device of claim 3 , wherein the processor is configured to compute the lateral temperature difference between the inner thermopile and the outer thermopile using the first absolute temperature and the second absolute temperature.

5 . The electronic device of claim 1 , wherein the processor is configured to compute the lateral temperature difference between the inner thermopile and the outer thermopile using a surface thermopile disposed between the inner thermopile and the outer thermopile.

6 . The electronic device of claim 1 , wherein the processor is configured to compute the ambient temperature using the first temperature gradient, the second temperature gradient, the lateral temperature difference between the inner thermopile and the outer thermopile, a first surface area of the first heat path exposed to the ambient temperature, a second surface area of the second heat path exposed to the ambient temperature, a first resistance associated with the first heat path, and a second resistance associated with the second heat path.

7 . The electronic device of claim 1 , wherein the sensing surface comprises glass or a printed circuit board.

8 . The electronic device of claim 1 , wherein the inner thermopile comprises a first set of metal fillings and the outer thermopile comprises a second set of metal fillings different from the first set of metal fillings.

9 . The electronic device of claim 8 , wherein the first set of metal fillings comprises copper and constantan and the second set of metal fillings comprises chromel and constantan.

10 . The electronic device of claim 1 , wherein the thermal sensing system comprises a passivation layer disposed on the sensing surface, wherein the passivation layer comprises epoxy, silicon nitride, glass, a polymer material, a ceramic material, a composite material, or any combination thereof.

11 . The electronic device of claim 1 , wherein the thermal sensing system comprises a thermal insulation layer disposed a threshold distance from the outer thermopile.

12 . The electronic device of claim 1 , wherein the concentric geometries comprise concentric cylinders.

13 . A dual heat flux sensor, comprising:

a sensing glass comprising an inner thermopile and an outer thermopile, wherein the inner thermopile and the outer thermopile are uniform in height and form concentric geometries;

a plurality of vias in the sensing glass comprising a plurality of first vias from a first surface of the sensing glass to a second surface of the sensing glass and a plurality of second vias from the first surface of the sensing glass to the second surface of the sensing glass, wherein the inner thermopile is formed from a first set of conductive materials filling the plurality of first vias and the outer thermopile is formed from a second set of conductive materials filling the plurality of second vias; and

sensing circuitry configured to measure a temperature gradient associated with the inner thermopile and a second temperature gradient associated with the outer thermopile.

14 . The dual heat flux sensor of claim 13 , wherein a diameter of the dual heat flux sensor is at least 1.5 times greater than a diameter of the outer thermopile.

15 . The dual heat flux sensor of claim 13 , wherein a diameter of the dual heat flux sensor is between 9 millimeters and 12 millimeters.

16 . The dual heat flux sensor of claim 13 , wherein a height of the dual heat flux sensor is less than 4 millimeters.

17 . The dual heat flux sensor of claim 13 , wherein the dual heat flux sensor comprises a housing coupled to the sensing glass, wherein the housing comprises a cavity disposed beneath the sensing glass, and wherein the cavity comprises air.

18 . The dual heat flux sensor of claim 17 , wherein the cavity comprises a height between 0.5 millimeters and 2.5 millimeters.

19 . The dual heat flux sensor of claim 13 , comprising a glass layer different from the sensing glass and disposed beneath the sensing glass.

20 . A system, comprising:

a first absolute temperature sensor configured to measure a first absolute temperature at a first surface of an inner thermopile;

a second absolute temperature sensor configured to measure a second absolute temperature at a first surface of an outer thermopile, wherein the inner thermopile is same in height as the outer thermopile, and wherein the inner thermopile and the outer thermopile form concentric geometries;

a third absolute temperature sensor configured to measure a third absolute temperature at a second surface of the inner thermopile;

a fourth absolute temperature sensor configured to measure a fourth absolute temperature at a second surface of the outer thermopile; and

a processor communicatively coupled to the first absolute temperature sensor, the second absolute temperature sensor, the third absolute temperature sensor, and the fourth absolute temperature sensor and configured to compute an ambient temperature or an internal body temperature using the first absolute temperature, the second absolute temperature, the third absolute temperature, and the fourth absolute temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 8, 2023
From: HUANG, WANFENG; CHEN, HONGLING; AMIN, ALI M.; CLEMENTS, JAMES C.
To: APPLE INC.
Reel/Frame 064527/0692 →
Continuity (2)
Provisional Application 63371820 · Aug 18, 2022
Related Publication 20240060832A1 · Feb 22, 2024
References Cited (91)
US 4138878A · Holmes et al. · 1979 [cited by applicant]
US 4197738A · Degenne · 1980 [cited by applicant]
US 4567365A · Degenne · 1986 [cited by applicant]
US 5294200A · Rall · 1994 [cited by applicant]
US 6278051B1 · Peabody · 2001 [cited by applicant]
US 9664569B2 · Mittleman et al. · 2017 [cited by applicant]
US 9704209B2 · Proud et al. · 2017 [cited by applicant]
US 9976908B2 · Jarboe et al. · 2018 [cited by applicant]
US 10060803B2 · Nakagawa et al. · 2018 [cited by applicant]
US 10098548B2 · Abreu · 2018 [cited by applicant]
US 10227063B2 · Abreu · 2019 [cited by applicant]
US 10670546B2 · Rud et al. · 2020 [cited by applicant]
US 11313741B2 · Lupo et al. · 2022 [cited by applicant]
US 20050043631A1 · Fraden · 2005 [cited by applicant]
US 20060056487A1 · Kuroda et al. · 2006 [cited by applicant]
US 20060071323A1 · Martin et al. · 2006 [cited by applicant]
US 20090219969A1 · Yamamoto · 2009 [cited by applicant]
US 20110118608A1 · Lindner et al. · 2011 [cited by applicant]
US 20110273378A1 · Alameh et al. · 2011 [cited by applicant]
US 20120128024A1 · Tsuchida · 2012 [cited by examiner]
US 20120134386A1 · Bender et al. · 2012 [cited by applicant]
US 20130331728A1 · Sun · 2013 [cited by examiner]
US 20140278201A1 · Shimizu · 2014 [cited by applicant]
US 20150104206A1 · Okada · 2015 [cited by applicant]
US 20150258544A1 · Stern et al. · 2015 [cited by applicant]
US 20150308906A1 · Durrer et al. · 2015 [cited by applicant]
US 20160178443A1 · Emadi et al. · 2016 [cited by applicant]
US 20160238463A1 · Bieberich et al. · 2016 [cited by applicant]
US 20170147017A1 · Ishii et al. · 2017 [cited by applicant]
US 20170258329A1 · Marsh · 2017 [cited by applicant]
US 20170311812A1 · Husheer · 2017 [cited by applicant]
US 20170320463A1 · Saitou et al. · 2017 [cited by applicant]
US 20180313699A1 · Vaiana et al. · 2018 [cited by applicant]
US 20190049317A1 · Tsuchimoto · 2019 [cited by applicant]
US 20190117155A1 · Cross et al. · 2019 [cited by applicant]
US 20190388031A1 · Haber et al. · 2019 [cited by applicant]
US 20200085310A1 · Zahner et al. · 2020 [cited by applicant]
US 20210028340A1 · Taniguchi · 2021 [cited by applicant]
US 20210223817A1 · Ishii et al. · 2021 [cited by applicant]
US 20210404883A1 · Rahmani · 2021 [cited by examiner]
US 20220000375A1 · Meisal · 2022 [cited by applicant]
US 20220026284A1 · Clements et al. · 2022 [cited by applicant]
US 20230098236A1 · Tadele et al. · 2023 [cited by applicant]
US 20230099531A1 · Tadele et al. · 2023 [cited by applicant]
US 20230099638A1 · Clements et al. · 2023 [cited by applicant]
CN 109632144A · 2019 [cited by applicant]
CN 111867456A · 2020 [cited by applicant]
CN 112189129A · 2021 [cited by applicant]
CN 112771357A · 2021 [cited by applicant]
DE 102004059730A1 · 2005 [cited by applicant]
EP 0003271A1 · 1979 [cited by applicant]
EP 2099264A1 · 2009 [cited by applicant]
EP 2458356A2 · 2012 [cited by applicant]
EP 3064917A1 · 2016 [cited by examiner]
EP 3431946A1 · 2019 [cited by applicant]
EP 4155699A1 · 2023 [cited by applicant]
GB 1182937A · 1970 [cited by applicant]
JP 2009192431A · 2009 [cited by applicant]
JP 5368715B2 · 2013 [cited by applicant]
JP 202122615A · 2021 [cited by applicant]
JP WO2020184511A1 · 2021 [cited by applicant]
WO 1999019702A1 · 1999 [cited by applicant]
WO 2014194077A2 · 2014 [cited by applicant]
WO WO2015088024A1 · 2015 [cited by examiner]
WO WO2016067952A1 · 2016 [cited by examiner]
WO 2016116481A1 · 2016 [cited by applicant]
WO 2021059391A1 · 2021 [cited by applicant]
Computer translation of WO_2016067952_A1 (Year: 2025). [cited by examiner]
Computer translation of WO_2015088024_A1 (Year: 2025). [cited by examiner]
Extended European Search Report received for European Patent Application No. 22197480.1, mailed on May 25, 2023, 12 pages. [cited by applicant]
Extended European Search Report received for European Patent Application No. 22197502.2, mailed on Feb. 23, 2023, 9 pages. [cited by applicant]
Extended European Search Report received for European Patent Application No. 22197505.5, mailed on May 30, 2023, 12 pages. [cited by applicant]
Partial European Search Report received for European Patent Application No. 22197480.1, mailed on Feb. 20, 2023, 7 pages. [cited by applicant]
Partial European Search Report received for European Patent Application No. 22197505.5, mailed on Feb. 23, 2023, 7 pages. [cited by applicant]
Tamura et al., “Current Developments in Wearable Thermometers”, Advanced Biomedical Engineering, vol. 7, 2018, pp. 88-99. [cited by applicant]
Yousef et al., “Vertical Thermopiles Embedded in a Polyimide-Based Flexible Printed Circuit Board”, Journal of Microelectromechanical Systems, vol. 16, No. 6, Dec. 2007, pp. 1341-1348. [cited by applicant]
Final Office Action received for U.S. Appl. No. 17/930,057, mailed on Dec. 1, 2025, 10 pages. [cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 17/930,057, mailed on Jun. 23, 2025, 11 pages. [cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 17/930,041, mailed on Apr. 24, 2025, 16 pages. [cited by applicant]
Corrected Notice of Allowability received for U.S. Appl. No. 17/930,041, mailed on Oct. 23, 2025, 2 pages. [cited by applicant]
Final Office Action received for U.S. Appl. No. 17/930,053, mailed on Jul. 17, 2025, 20 pages. [cited by applicant]
Advisory Action received for U.S. Appl. No. 17/930,053, mailed on Nov. 26, 2025, 3 pages. [cited by applicant]
Kitamura, et al., “Development of a New Method for the Noninvasive Measurement of Deep Body Temperature Without a Heater”, Medical Engineering & Physics, vol. 32, No. 1, 2010, pp. 1-6. [cited by applicant]
Search Report received for Chinese Patent Application No. 202211165123.1, mailed on Jul. 10, 2025, 6 pages (3 pages of English Translation and 3 pages of Official Copy). [cited by applicant]
Search Report received for Chinese Patent Application No. 202211162589.6, mailed on Jul. 5, 2025, 7 pages (4 pages of English Translation and 3 pages of Official Copy). [cited by applicant]
Search Report received for Chinese Patent Application No. 202211163270.5, mailed on Jun. 14, 2025, 7 pages (4 pages of English Translation and 3 pages of Official Copy). [cited by applicant]
Restriction Requirement received for U.S. Appl. No. 17/930,057, mailed on Apr. 30, 2025, 7 pages. [cited by applicant]
Notice of Allowance received for U.S. Appl. No. 17/930,041, mailed on Jul. 7, 2025, 8 pages. [cited by applicant]
Extended European Search Report received for European Patent Application No. 23191664.4, mailed on Jan. 26, 2024, 8 pages. [cited by applicant]
Non-Final Office Action received for U.S. Appl. No. 17/930,053, mailed on Feb. 13, 2025, 24 pages. [cited by applicant]
Restriction Requirement received for U.S. Appl. No. 17/930,057, mailed on Dec. 27, 2024, 7 pages. [cited by applicant]