IP Library Granted Patent US 12,626,640
Granted Patent B2
US 12,626,640 · App. 18/620,536 · Granted May 12, 2026

Systems and methods for configuring a display device and display system

Inventors: Ian Kyles (West Linn, OR); Clive David Beech (Plymouth, GB)
Assignee: Snap Inc.
G09G3/32H10H29/142G09G2370/00
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,626,640
App. No.
18/620,536
Filed
Mar 28, 2024
Granted
May 12, 2026
Kind
B2
Art Unit
2625
USPC
345/206
Abstract

Displays, systems, and methods may be utilized in applications including, but not limited to, projectors, head-up displays, and augmented reality (AR), mixed reality (MR), and virtual reality (VR) systems or devices, such as headsets or other near-eye devices or systems. Tiled or Tile-able displays and methods, in accordance with the present invention, provide displays of varying sizes, and as such, a Tiled or Tile-able display is configured to accommodate the display size needed for various wearable and mobile devices that require or incorporate displays.

Claims (73)

1 . A display device, comprising:

a plurality of tiles arranged in an array on a printed circuit board (PCB), the PCB configured to electrically couple the plurality of tiles, each tile comprising:

an illumination die comprising at least one illuminating element; and

a tile-able backplane die comprising:

pixel logic circuitry at least one of arranged on, embedded in, integrated into, formed on, deposited onto or coupled to a first area of a backplane die; and

input/output logic circuitry at least one of arranged on, embedded in, integrated into, formed on, deposited onto or coupled to a second area of the backplane die;

wherein the illumination die is coupled to a front surface of the tile-able backplane die such that the first area is aligned with at least one illuminating element in the illumination die; and

wherein each respective tile is coupled to the printed circuit board through a plurality of openings in a back surface of the respective tile-able backplane die, the plurality of openings in the back surface aligned with the second area of the backplane die.

2 . The display device of claim 1 , wherein:

the first area comprises a first strip area; and

the second area comprises a second strip area.

3 . The display device of claim 1 , wherein:

the first area comprises a plurality of first strip areas; and

the second area comprises a plurality of second strip areas alternating with the plurality of first strip areas.

4 . The display device of claim 1 , wherein the PCB electrically couples the plurality of tiles in series.

5 . The display device of claim 1 , wherein image or video data is being sent to the input/output logic circuitry of a tile for display in a next frame while image or video data for a current frame is being displayed on the illumination die of the tile.

6 . The display device of claim 1 , wherein:

each tile of the plurality of tiles has a corresponding tile address;

the PCB comprises a master controller coupled to at least one of the tiles in the plurality of tiles;

the master controller sends data to the tile to which it is coupled, the data having a header including a tile address identifier;

the backplane device of a tile identifies tile data in the data received from the master controller, the tile data being a subset of the data sent from the master controller; and

the backplane device of the tile associated with the tile address identifier stores the tile data at a memory component in, or associated with, the tile.

7 . The display device of claim 6 , wherein:

the master controller receives data from a first device of a first format; and

the master controller converts the data to a second format that can be read or processed by the backplane device of a tile.

8 . The display device of claim 7 , wherein:

the first device is a device that outputs image data.

9 . The display device of claim 7 , wherein:

each illumination element of an illumination die is coupled to a first storage device and a second storage device.

10 . A display system comprising:

a pixel array of pixels, each pixel having at least one illuminating element in an illumination die, each illumination element of a pixel being electrically coupled to pixel circuitry in a tile-able backplane die of a tile, the tile-able backplane die comprising:

pixel drive and logic circuitry on a first area of the backplane die comprising:

a receiving pixel memory device;

an active pixel memory device electrically coupled to the receiving pixel memory device;

logic function circuitry coupled to the active pixel memory device;

a latch coupled to the logic function circuitry; and

a current drive device coupled to the latch, wherein the current drive device drives operation of each pixel of the pixel array; and

tile controller circuitry on a second area of the backplane die comprising circuitry configured to:

receive a serial data stream;

extract image data or video data from the serial data stream according to when an address of the tile is in the data stream;

decode the image or video data after it has been extracted from the data stream;

control writing of the image or video data to the receiving pixel memory device; and

write the image data or video data that has been extracted and subsequently decoded to a data bus corresponding to or associated with a column that includes or contains one or more pixels of the pixel array, the column being identified as a destination for writing the image data or video data;

wherein the illumination die is coupled to a front surface of the tile-able backplane die such that the first area is aligned with at least one illuminating element in the illumination die,

wherein the tile-able backplane die comprises a plurality of openings in a back surface of the tile-able backplane die, the plurality of openings configured to receive the serial data stream from a tile array controller.

11 . The display system of claim 10 , wherein:

the first area comprises a first strip area; and

the second area comprises a second strip area.

12 . The display system of claim 10 , wherein:

the control logic circuitry writes a respective plurality of portions of the image data or video data that has been extracted and subsequently decoded to each of a plurality of data buses corresponding to or associated with a plurality of columns that each include or contain one or more pixels of the pixel array, each column being identified as a destination for writing a respective one of the plurality of portions of the image data or video data;

the first area comprises a plurality of first strip areas; and

the second area comprises a plurality of second strip areas alternating with the plurality of first strip areas.

13 . The display system of claim 10 , wherein the at least one illuminating element of a pixel comprises three illuminating elements generating three colors of light.

14 . The display system of claim 10 , wherein the tile controller circuitry is configured to output a ROW/WRITE signal to a row of the pixels that have been identified to receive the extracted and subsequently decoded data.

15 . The display system of claim 14 , wherein the tile controller circuitry is configured to output a LOAD output signal that initiates transfer of data from the receiving pixel memory device to the active pixel memory device.

16 . The display system of claim 15 , further comprising:

a time-varying value (TVV) generator, wherein after the data has been transferred to the active pixel memory device, a display cycle begins, wherein during the display cycle, the TVV generator provides a changing value or voltage on a TVV bus which the pixel circuitry combines with the value or voltage in the active pixel memory device, and produces a time-varying voltage that is used to modulate a current driver device electrically coupled to a master pixel of the pixel array.

17 . The display system of claim 10 , wherein the at least one illuminating element of a pixel comprises at least one LED.

18 . The display system of claim 17 , wherein the at least one LED is at least one microLED.

19 . A method, comprising:

transmitting serial data from a master controller to one or more tiles in a plurality of tiles via a printed circuit board, the data having a header including a tile address, the tile address being associated with a first tile of the plurality of tiles;

receiving the serial data at a tile controller of the first tile, the tile controller comprising a backplane, the backplane comprising:

a first area comprising a plurality of first strip areas;

a second area comprising a plurality of second strip areas alternating with the plurality of first strip areas;

pixel logic circuitry at least one of arranged on, embedded in, integrated into, formed on, deposited onto or coupled to the first area, the pixel logic circuitry being coupled to one or more illumination elements in an illumination die coupled to a front surface of the backplane; and

input/output logic circuitry at least one of arranged on, embedded in, integrated into, formed on, deposited onto or coupled to the second area, the input/output logic circuitry being coupled to the printed circuit board through a plurality of openings in a back surface of the backplane aligned with the second area; and

at the tile controller of the first tile:

recognizing the tile address in the header of the serial data;

identifying tile data as a subset of the serial data received from the master controller; and

storing the tile data at a memory component in, or associated with, the first tile.

20 . The method of claim 19 , further comprising:

receiving, at the master controller, image data of a first format; and

converting, at the master controller, the image data from the first format to a serial format to arrive at the serial data.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2024
From: KYLES, IAN; BEECH, CLIVE DAVID
To: COMPOUND PHOTONICS U.S. CORPORATION
Reel/Frame 066940/0473 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 28, 2024
From: COMPOUND PHOTONICS U.S. CORPORATION
To: SNAP INC.
Reel/Frame 066940/0505 →
Continuity (3)
Continuation 17817528 · Aug 4, 2022
Provisional Application 63229642 · Aug 5, 2021
Related Publication 20240242663A1 · Jul 18, 2024
References Cited (70)
US 6791382B1 · Ting · 2004 [cited by examiner]
US 20020163513A1 · Tsuji · 2002 [cited by applicant]
US 20050078104A1 · Matthies et al. · 2005 [cited by applicant]
US 20060077193A1 · Thielemans · 2006 [cited by examiner]
US 20090322649A1 · Hamer · 2009 [cited by examiner]
US 20140326295A1 · Moslehi · 2014 [cited by examiner]
US 20150301781A1 · Ekkaia · 2015 [cited by examiner]
US 20170025593A1 · Bower · 2017 [cited by examiner]
US 20180323180A1 · Cok · 2018 [cited by examiner]
US 20190155556A1 · Tsujita et al. · 2019 [cited by applicant]
US 20200090574A1 · Sakariya et al. · 2020 [cited by applicant]
US 20210166619A1 · Kim et al. · 2021 [cited by applicant]
US 20210217740A1 · Lee · 2021 [cited by applicant]
US 20210225268A1 · Peng et al. · 2021 [cited by applicant]
US 20210313298A1 · Archer · 2021 [cited by examiner]
US 20220122520A1 · Cok et al. · 2022 [cited by applicant]
US 20220209066A1 · Tan et al. · 2022 [cited by applicant]
US 20220230582A1 · Cok et al. · 2022 [cited by applicant]
US 20220236571A1 · Popovich et al. · 2022 [cited by applicant]
US 20220254952A1 · Fabien et al. · 2022 [cited by applicant]
US 20220352412A1 · Brodoceanu · 2022 [cited by examiner]
US 20220415698A1 · Huang · 2022 [cited by examiner]
US 20230040711A1 · Kyles et al. · 2023 [cited by applicant]
US 20230213700A1 · Ward et al. · 2023 [cited by applicant]
US 20230222955A1 · Sakariya et al. · 2023 [cited by applicant]
US 20230238398A1 · Choi · 2023 [cited by examiner]
CN 110390907A · 2019 [cited by applicant]
CN 113035128A · 2021 [cited by applicant]
CN 113066788A · 2021 [cited by applicant]
CN 121531876A · 2026 [cited by applicant]
JP 2003031853A · 2003 [cited by applicant]
JP 2010199428A · 2010 [cited by applicant]
JP 2012511811A · 2012 [cited by applicant]
JP 2015194515A · 2015 [cited by applicant]
JP 2017161634A · 2017 [cited by applicant]
JP 2018530792A · 2018 [cited by applicant]
JP 2018206986A · 2018 [cited by applicant]
JP 2025108576A · 2025 [cited by applicant]
KR 100881142B1 · 2009 [cited by applicant]
WO WO2016200882A1 · 2016 [cited by applicant]
WO WO2021142243A1 · 2021 [cited by applicant]
WO WO2023015257A1 · 2023 [cited by applicant]
WO WO2023015257A9 · 2024 [cited by applicant]
“Chinese Application Serial No. 202280053280.5, Office Action mailed Nov. 20, 2024”, W/English Translation, 14 pgs. [cited by applicant]
“Chinese Application Serial No. 202280053280.5, Response filed Feb. 21, 2025 to Office Action mailed Nov. 20, 2024”, W/English Claims, 12 pgs. [cited by applicant]
“Chinese Application Serial No. 202280053280.5, Voluntary Amendment filed Jun. 20, 2024”, W/English Claims, 10 pgs. [cited by applicant]
“European Application Serial No. 22765358.1, Notification Regarding Rule 164 and Article 94(3) EPC mailed Oct. 22, 2024”, 15 pgs. [cited by applicant]
“European Application Serial No. 22765358.1, Voluntary Amendment filed Mar. 5, 2024”, 91 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Notification of Reasons for Refusal mailed Dec. 24, 2024”, w/ English translation, 9 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Notification of Reasons for Rejection mailed Jun. 25, 2024”, w/ English machine translation, 10 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Notification of Reasons for Rejection mailed Sep. 24, 2024”, w/ English machine translation, 7 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Response filed Mar. 13, 2025 to Notification of Reasons for Refusal malled Dec. 24, 2024”, w/ current English claims, 14 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Response filed Sep. 24, 2024 to Notification of Reasons for Rejection mailed Jun. 25, 2024”, w/ English claims, 19 pgs. [cited by applicant]
“Japanese Application Serial No. 2024-506998, Response Filed Dec. 13, 2024 toNotification of Reasons for Rejection mailed Sep. 24, 2024”, w/ English Claims, 14 pgs. [cited by applicant]
“Korean Application Serial No. 10-2024-7007225, Notice of Preliminary Rejection mailed Feb. 14, 2025”, W/English Translation, 4 pgs. [cited by applicant]
“Korean Application Serial No. 10-2024-7007225, Notice of Preliminary Rejection mailed Jul. 25, 2024”, w/ English translation, 10 pgs. [cited by applicant]
“Korean Application Serial No. 10-2024-7007225, Response filed Sep. 25, 2024 to Notice of Preliminary Rejection mailed Jul. 25, 2024”, 9 pgs. [cited by applicant]
“U.S. Appl. No. 17/817,528, Non Final Office Action mailed Oct. 4, 2023”, 10 pgs. [cited by applicant]
“U.S. Appl. No. 17/817,528, Notice of Allowance mailed Jan. 11, 2024”, 11 pgs. [cited by applicant]
“U.S. Appl. No. 17/817,528, Response filed Nov. 14, 2023 to Non Final Office Action mailed Oct. 4, 2023”, 9 pgs. [cited by applicant]
“International Application Serial No. PCT/US2022/074542, International Preliminary Report on Patentability mailed Feb. 15, 2024”, 11 pgs. [cited by applicant]
“International Application Serial No. PCT/US2022/074542, International Search Report mailed Jan. 5, 2023”, 6 pgs. [cited by applicant]
“International Application Serial No. PCT/US2022/074542, Invitation to Pay Additional Fees mailed Nov. 11, 2022”, 9 pgs. [cited by applicant]
“International Application Serial No. PCT/US2022/074542, Written Opinion mailed Jan. 5, 2023”, 9 pgs. [cited by applicant]
“Chinese Application Serial No. 202280053280.5, Office Action mailed Jun. 19, 2025”, w/ English translation, 8 pgs. [cited by applicant]
“Chinese Application Serial No. 202280053280.5, Response filed Aug. 1, 2025 to Office Action mailed Jun. 19, 2025”, W/English Claims, 12 pgs. [cited by applicant]
“European Application Serial No. 22765358.1, Response Filed Jan. 17, 2025 to Notification Regarding Rule 164 and Article 94(3) EPC mailed Oct. 22, 2024”, 19 pgs. [cited by applicant]
“Korean Application Serial No. 10-2024-7007225, Notice of Preliminary Rejection mailed Feb. 14, 2025”, w/ English Claims, 11 pgs. [cited by applicant]
“European Application Serial No. 25194372.6, Response filed Dec. 31, 2025 to Extended European Search Report mailed Nov. 14, 2025”, 65 pgs. [cited by applicant]
“Japanese Application Serial No. 2025-066253, Notification of Reasons for Rejection mailed Feb. 3, 2026”, W/English Translation, 8 pgs. [cited by applicant]