IP Library › Granted Patent US 12,626,774
Granted Patent B2
US 12,626,774 · App. 18/744,504 · Granted May 12, 2026

Distributed power supply switching circuit for efuse memory

Inventors: Chuyi Huang (Shanghai, CN); Ying Yan (Shanghai, CN); Shilu Yin (Shanghai, CN)
Assignee: Shanghai Huali Integrated Circuit Corporation
G11C17/16G11C5/063G11C5/147
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,626,774
App. No.
18/744,504
Granted
May 12, 2026
Kind
B2
Abstract

This application provides a distributed power supply switching circuit for an eFuse memory. A distributed power supply domain switching module comprising an internal power supply VDDI, an internal power supply VQR, a first PMOS and a second PMOS. A source of the first PMOS is connected with the internal power supply VDDI, and a gate is connected with the internal power supply VQR. A source of the second PMOS is connected with the internal power supply VQR, and a gate is connected with the internal power supply VDDI. Bulks and drains of the first PMOS and the second PMOS are jointly connected with a node VLS. The distributed power supply domain switching module supplies power to a word line or bit line control module through the node VLS. The circuit of this application can avoiding the risk that the two power supplies are short-circuited.

Claims (12)

1 . A distributed power supply switching circuit for an eFuse memory, at least comprising:

a global internal and external power supply conversion module comprising an external power supply VDD and an external power supply VQPS, the global internal and external power supply conversion module being connected with a signal PD and a signal PS;

a distributed power supply domain switching module comprising an internal power supply VDDI, an internal power supply VQR, a first PMOS and a second PMOS, a source of the first PMOS being connected with the internal power supply VDDI, a gate being connected with the internal power supply VQR; a source of the second PMOS being connected with the internal power supply VQR, a gate being connected with the internal power supply VDDI; bulks and drains of the first PMOS and the second PMOS being jointly connected with a node VLS; and

a word line or bit line control module for eFuse memory, the distributed power supply domain switching module supplying power to the word line or bit line control module for eFuse memory through the node VLS;

when the signal PS switches to a high level, the external power supply VQPS powers on the internal power supply VQR; after the potential of the internal power supply VQR rises to more than V(core)−|Vth|, the first PMOS is turned off; as the potential of the internal power supply VQR rises to more than V(core)+Vth, a P-well of the source of the second PMOS and an N-well of a substrate form a PN junction to conduct until the internal power supply VQR powers on the node VLS to V(prog)−Vth, the second PMOS is turned on, finally the potential of the node VLS rises and remains at V(prog), and the eFuse memory works in a programming mode, where Vth is threshold voltage of the PN junction.

2 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein the node VLS in the distributed power supply domain switching module is interconnected through a metal line to form a global internal power supply.

3 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein when the signal PD is at a low level, the internal power supply VDDI is grounded, and the internal power supply VQR is grounded; when the signal PD is at a high level and the signal PS is at a low level, the potential of the internal power supply VDDI is V(core), and the internal power supply VQR is grounded; when the signal PD is at a high level and the signal PS is at a high level, the potential of the internal power supply VDDI is V(core), and the potential of the internal power supply VQR is V(prog), where V(core) is core voltage and V(prog) is programming voltage.

4 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein the global internal and external power supply conversion module supplies power to the internal power supply VDDI and the internal power supply VQR according to the following mode: when the signal PD is at a high level, power supplied by the external power supplies to the internal power supplies is cut off, and both the internal power supply VDDI and the internal power supply VQR are grounded; when the signal PD is at a low level and the signal PS is at a low level, the external power supply VDD supplies power to the internal power supply VDDI, and the internal power supply VQR is grounded; when the signal PD is at a low level and the signal PS is at a high level, the external power supply VDD supplies power to the internal power supply VDDI, and the external power supply VQPS supplies power to the internal power supply VQR.

5 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein when both the external power supply VDD and the external power supply VQPS have been powered on normally and stabilized, the signal PD switches from a high level to a low level, the signal PS is at a low level, the external power supply VDD powers on the internal power supply VDDI to V(core), the internal power supply VQR remains grounded, the first PMOS is turned on, the second PMOS is turned off, the node VLS remains at the potential of V(core), and the eFuse memory works in a reading mode.

6 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein after the programming is completed, the signal PS switches back from a high level to a low level, power supplied by the external power supply VQPS to the internal power supply VQR is cut off, and the internal power supply VQR is powered down to a low level through an NMOS transistor to ground; after the potential of the internal power supply VQR drops to less than V(core)+|Vth|, the second PMOS is turned off; after the potential of the internal power supply VQR continuously drops to V(core)−|Vth|, the first PMOS is turned on, the potential of the node VLS drops to V(core), and the eFuse memory works in a reading mode.

7 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein the distributed power supply switching circuit is used in a single-channel eFuse memory layout.

8 . The distributed power supply switching circuit for the eFuse memory according to claim 1 , wherein the distributed power supply switching circuit is used in a multiple-channel eFuse memory layout.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 8, 2024
From: HUANG, CHUYI; YAN, YING; YIN, SHILU
To: SHANGHAI HUALI INTEGRATED CIRCUIT CORPORATION
Reel/Frame 067930/0063 →
Priority Claims (1)
CN 202310891126.1 · Jul 19, 2023 · national
Continuity (1)
Related Publication 20250029668A1 · Jan 23, 2025
References Cited (8)
US 6229753B1 · Kono · 2001 [cited by examiner]
US 10826489B1 · Stormes · 2020 [cited by examiner]
US 20030210600A1 · Koo · 2003 [cited by examiner]
US 20100231051A1 · Yarbrough · 2010 [cited by examiner]
US 20110235454A1 · Huang · 2011 [cited by examiner]
US 20110304381A1 · Ku · 2011 [cited by examiner]
US 20150043265A1 · Uvieghara · 2015 [cited by examiner]
US 20190027206A1 · Kim · 2019 [cited by examiner]