Cooling fin arrangement of a cooler, through which fluid can flow, for cooling power electronics
The present invention relates to a cooling fin arrangement ( 1 ) of a cooler, through which fluid can flow, for cooling power electronics ( 200 ). The cooling fin arrangement ( 1 ) comprises at least one cooling fin ( 10 ), which is formed from a wave profile that periodically repeats in a direction of repetition ( 501 ), the direction of repetition ( 501 ) being perpendicular to a flow direction ( 500 ). The invention also relates to a cooler, through which fluid can flow, for cooling power electronics ( 200 ), the cooler comprising a cooling fin arrangement ( 1 ) of this type, and to a power electronic assembly ( 1000 ), comprising power electronics ( 200 ) and a cooler ( 100 ) of this type, through which fluid can flow.
1 . A cooling fin arrangement ( 1 ) of a cooler through which fluid can flow for cooling power electronics ( 200 ), the cooling fin arrangement ( 1 ) comprising at least one cooling fin ( 10 ) which is formed from a wave profile that periodically repeats in a direction of repetition ( 501 ), the direction of repetition ( 501 ) being perpendicular to a flow direction ( 500 ),
wherein the at least one cooling fin ( 10 ) comprises a plurality of cooling fins ( 10 ) which are formed from wave profiles repeating periodically in a direction of repetition ( 501 ) and are arranged next to each other,
wherein a region of the wave profile of a cooling fin ( 10 ) of the plurality of cooling fins ( 10 ) is set at a first angle ( 602 ) relative to a direction ( 502 ) perpendicular to the direction of repetition ( 501 ) and a region of the wave profile of another cooling fin ( 10 ) of the plurality of cooling fins ( 10 ) is set at a second angle ( 603 ) relative to the direction ( 502 ) perpendicular to the direction of repetition ( 501 ), the second angle ( 603 ) being different from the first angle ( 602 ).
2 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein the wave profile repeats an integer or non-integer number of times.
3 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein a cross-section of the at least one cooling fin ( 10 ) has a shape of a meander.
4 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein the wave profile of a cooling fin ( 10 ) of the plurality of cooling fins ( 10 ) is arranged offset in the direction of repetition ( 501 ) from the wave profile of an adjacent cooling fin ( 10 ) of the plurality of cooling fins ( 10 ).
5 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein:
a height ( 604 ) of a cooling fin ( 10 ) of the plurality of cooling fins ( 10 ) is between 2.5 mm and 3.5 mm, and/or
a pitch ( 601 ) of the cooling fin ( 10 ) is between 4 mm and 5 mm and/or
a dimension ( 607 ) of the cooling fin ( 10 ) in a direction ( 502 ) perpendicular to the direction of repetition ( 501 ) is between 1.5 mm and 2.1 mm and/or
a profile thickness ( 605 ) of the cooling fin ( 10 ) is between 0.2 mm and 0.45 mm and/or
a form inclination ( 606 ) of the cooling fin ( 10 ) is between 3 degrees and 8 degrees.
6 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein the plurality of cooling fins ( 10 ) of the cooling fin arrangement ( 1 ) comprises at least a first cooling fin group ( 11 ) for cooling a first power electronics unit ( 210 ) and a second cooling fin group ( 12 ) for cooling a second power electronics unit ( 211 ), the first cooling fin group ( 11 ) and the second cooling fin group ( 12 ) configured such that a temperature of at least one power semiconductor ( 201 ) of the first power electronics unit ( 210 ) assigned to the first cooling fin group ( 11 ) is equal to a temperature of at least one power semiconductor ( 201 ) of the second power electronics unit ( 211 ) assigned to the second cooling fin group ( 12 ).
7 . The cooling fin arrangement ( 1 ) according to claim 6 , wherein the plurality of cooling fins ( 10 ) of the cooling fin arrangement ( 1 ) further comprises a third cooling fin group ( 13 ), and wherein for the first cooling fin group ( 11 ) in the flow direction ( 500 ), an amount of the first angle ( 602 ) and/or an amount of the second angle ( 603 ) is 10 degrees, for the second cooling fin group ( 12 ) in the flow direction ( 500 ), an amount of the first angle ( 602 ) and/or an amount of the second angle ( 603 ) is 15 degrees, and for the third cooling fin group ( 13 ) in the flow direction ( 500 ), an amount of the first angle ( 602 ) and/or an amount of the second angle ( 603 ) is 20 degrees.
8 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein the at least one cooling fin ( 10 ) extends perpendicular to the direction of repetition ( 501 ).
9 . A cooler ( 100 ) through which fluid can flow, for cooling power electronics ( 200 ), comprising a cooling fin arrangement ( 1 ) according to claim 1 .
10 . The cooler ( 100 ) through which fluid can flow according to claim 9 , wherein the plurality of cooling fins ( 10 ) of the cooling fin arrangement ( 1 ) comprises at least a first cooling fin group ( 11 ) for cooling a first power electronics unit ( 210 ) and a second cooling fin group ( 12 ) for cooling a second power electronics unit ( 211 ), the first cooling fin group ( 11 ) and the second cooling fin group ( 12 ) being configured such that a temperature of at least one power semiconductor ( 201 ) of the first power electronics unit ( 210 ) assigned to the first cooling fin group ( 11 ) is equal to a temperature of at least one power semiconductor ( 201 ) of the second power electronics unit ( 211 ) assigned to the second cooling fin group ( 12 ).
11 . The cooler ( 100 ) through which fluid can flow, according to claim 10 , wherein all cooling fins ( 10 ) of the cooling fin arrangement ( 1 ) are formed from a single part.
12 . A power electronics arrangement ( 1000 ), which comprises a cooler ( 100 ) through which fluid can flow according to claim 9 and power electronics ( 200 ), the power electronics ( 200 ) being arranged on the cooler ( 100 ) through which fluid can flow.
13 . The cooling fin arrangement ( 1 ) according to claim 4 , wherein the wave profiles of the plurality of cooling fins ( 10 ) alternately have a first position in the direction of repetition ( 501 ) and a second position in the direction of repetition ( 501 ), and/or wherein an offset ( 600 ) between the wave profiles of adjacent cooling fins ( 10 ) of the plurality of cooling fins ( 10 ) in the direction of repetition ( 501 ) is between 0.8×t/4 and 1.2×t/4, where t is a pitch ( 601 ) of the plurality of cooling fins ( 10 ).
14 . The cooling fin arrangement ( 1 ) according to claim 1 , wherein the wave profiles of the plurality of cooling fins ( 10 ) is set alternately at the first angle ( 602 ) and the second angle ( 603 ) to a direction ( 502 ) perpendicular to the direction of repetition ( 501 ), wherein the first angle ( 602 ) is positive and the second angle ( 603 ) is negative.
15 . The cooling fin arrangement ( 1 ) according to claim 14 , wherein the first angle ( 602 ) and the second angle ( 603 ) have a common magnitude and/or wherein a magnitude of the first angle ( 602 ) and/or a magnitude of the second angle ( 603 ) is/are between 5 degrees and 25 degrees.
16 . The cooling fin arrangement ( 1 ) according to claim 8 , wherein:
a height ( 604 ) of a cooling fin ( 10 ) of the plurality of cooling fins ( 10 ) is between 2.5 mm and 3.5 mm, and/or
a pitch ( 601 ) of the cooling fin ( 10 ) is between 2 mm and 4 mm, and/or
a dimension ( 607 ) of the cooling fin ( 10 ) in a direction ( 502 ) perpendicular to the direction of repetition ( 501 ) is between 3.1 mm and 4.1 mm and/or
a profile thickness ( 605 ) of the cooling fin ( 10 ) is between 0.2 mm and 0.45 mm, and/or
a form inclination ( 606 ) of the cooling fin ( 10 ) is between 3 degrees and 8 degrees.