Lead frame, method of making lead frame, semiconductor apparatus, and method of making semiconductor apparatus
A lead frame including a die pad having a first surface and a second surface opposite the first surface, a lead having a third surface flush with the first surface and a fourth surface opposite the third surface, and a link portion connecting the die pad and the lead, wherein the link portion includes a first portion that surrounds the die pad between the die pad and the lead in a plan view, wherein the first portion has a fifth surface flush with the first surface and the third surface, and has a sixth surface opposite the fifth surface, wherein the second surface is closer to a plane containing the first surface, the third surface, and the fifth surface than is the fourth surface, and wherein the sixth surface is closer to the plane containing the first surface, the third surface, and the fifth surface than is the second surface.
1 . A lead frame strip including a plurality of discrete separation areas for singulation, comprising:
a die pad portion having a first surface and a second surface opposite to the first surface;
a lead portion having both a third surface flush with the first surface and a fourth surface opposite to the third surface;
a link portion connecting the die pad portion and the lead portion together;
a section bar surrounding the die pad portion, the lead portion, and the link portion in a plan view; and
plating lead portions connecting the section bar to the lead portion and the die pad portion,
wherein the link portion includes a first portion that surrounds the die pad portion between the die pad portion and the lead portion in the plan view,
wherein the first portion has a fifth surface flush with both the first surface and the third surface, and has a sixth surface opposite to the fifth surface,
wherein the second surface is closer to a plane containing the first surface, the third surface, and the fifth surface than is the fourth surface,
wherein the sixth surface is closer to the plane containing the first surface, the third surface, and the fifth surface than is the second surface, and
wherein each point between the die pad portion and the section bar is occupied by the lead portion, the link portion, or one of the plating lead portions, and no vacant through hole exists in any area that is surrounded by the section bar in the plan view.
2 . The lead frame according to claim 1 , comprising a plurality of said lead portions,
wherein the link portion includes a second portion situated between two lead portions, among the plurality of said lead portions, adjacent to each other in the plan view,
wherein the second portion has a seventh surface flush with both the first surface and the third surface, and has an eighth surface opposite to the seventh surface, and
wherein the eighth surface is closer to the plane containing the first surface, the third surface, and the fifth surface than is the second surface.
3 . The lead frame according to claim 1 , further comprising a plating layer disposed on the fourth surface.