Optoelectronic package structure and method of manufacturing the same
An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.
1 . An optoelectronic package structure, comprising:
a carrier;
a photonic component laterally adjacent to the carrier;
an electronic component connected to the photonic component and the carrier;
a circuit layer disposed between and electrically connected to the photonic component and the electronic component; and
a processing unit disposed over the circuit layer and electrically connected to the electronic component through the circuit layer.
2 . The optoelectronic package structure of claim 1 , wherein the photonic component has a side facing the electronic component, and the side is configured to be connected to an optical component.
3 . The optoelectronic package structure of claim 1 , wherein the photonic component overhangs the electronic component.
4 . The optoelectronic package structure of claim 1 , wherein the electronic component overhangs the carrier.