Granted Patent B2

US 12,630,692 · App. 18/002,399 · Granted May 19, 2026

Inventors: Takumi Kataishi (Aichi, JP); Yuko Kimura (Aichi, JP)

Assignee: Fuji Polymer Industries Co., Ltd.

C08K5/01C08J5/18C08K9/06C08J2383/07C08K2201/001

Abstract

Claims (25)

1 . A silicone gel composition comprising the following components:

A. 100 parts by mass of an organopolysiloxane that is curable by an addition reaction;

B. 0.01 to 10 parts by mass of an unsaturated hydrocarbon compound having one alkenyl group per molecule;

C. an addition reaction curing catalyst in a catalytic amount; and

a thermally conductive filler,

wherein a thermal curing temperature is 70° C. to 150° C.,

the component A includes components A1 and A2, with the component A2 including both components A2-1 and A2-2 as follows:

A1. an organopolysiloxane having two or more alkenyl groups per molecule;

A2. an organohydrogenpolysiloxane having two or more Si—H groups per molecule;

A2-1. an organohydrogenpolysiloxane having two Si—H groups per molecule; and

A2-2. an organohydrogenpolysiloxane having three or more Si—H groups per molecule; and

the silicone gel composition comprises:

50 to 300 parts by mass of the component A2-1; and

0.1 to 100 parts by mass of the component A2-2 with respect to 100 parts by mass of the component A1.

2 . The silicone gel composition according to claim 1 , wherein the unsaturated hydrocarbon compound is at least one selected from the group consisting of an α-olefin that is liquid at 25° C. and does not volatilize or decompose at 100° C. and α-methylstyrene.

3 . The silicone gel composition according to claim 1 , wherein the unsaturated hydrocarbon compound is 1-decene.

4 . The silicone gel composition according to claim 1 , wherein a ratio of a number of Si—H groups bonded to silicon atoms in the component A to a total number of alkenyl groups bonded to silicon atoms in the component A and alkenyl groups bonded to silicon atoms in the component B is 0.5 or more and 2.0 or less.

5 . The silicone gel composition according to claim 1 , wherein the component A1 is a linear dimethylpolysiloxane having vinyl groups at both ends of a molecular chain.

6 . The silicone gel composition according to claim 1 , wherein a content of the thermally conductive filler is 400 to 3000 parts by mass with respect to 100 parts by mass of the component A.

7 . The silicone gel composition according to claim 1 , wherein the thermally conductive filler includes at least two types of thermally conductive fillers with different average particles sizes.

8 . The silicone gel composition according to claim 7 , wherein at least one of the at least two types of the thermally conductive fillers is surface treated with R a Si(OR′) 4-a , where R represents a substituted or unsubstituted organic group having 8 to 12 carbon atoms, R′ represents an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1.

9 . A silicone gel sheet comprising:

the silicone gel composition according to claim 1 ,

wherein the silicone gel composition is molded into a sheet and the sheet is cured.

10 . The silicone gel sheet according to claim 9 , wherein an oil bleeding rate of the silicone gel sheet is 0.5% or less, which is measured after the silicone gel sheet is compressed to a thickness that is 60% of its original thickness, and allowed to stand for 24 hours in an atmosphere of 80° C.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (27)