Flow velocity increasing device and apparatus for depositing thin film including the same
A flow velocity increasing device of an apparatus for depositing a thin film includes a device body disposed within the chamber and a flow velocity increasing hole portion formed in the device body and tapered in a direction of gas passage so that a flow velocity of passed gas is faster than that externally.
1 . An apparatus for depositing a thin film, the apparatus comprising:
a chamber having a gas injection portion including a source gas nozzle, a reactant gas nozzle, and a purge gas nozzle, and a gas discharge port;
a vacuum pump connected to the chamber; and
a flow velocity increasing device disposed within the chamber,
wherein the flow velocity increasing device includes:
a device body disposed within the chamber;
a flow velocity increasing hole portion formed in the device body and tapered in a direction of gas passage and configured to cause a flow velocity of passed gas to be faster than that externally to increase a circulating power of the passed gas to enhance uniform thin film deposition in at least one of enclosed regions or stepped surfaces of an object;
a holder disposed in the chamber and configured to hold an object to be deposited;
an object rotating unit connected to the holder and configured to rotate the holder so that the object to be deposited rotates; and
an object revolving unit connected to the holder and configured to revolve the holder so that the object to be deposited revolves.
2 . The apparatus of claim 1 , wherein in the flow velocity increasing hole portion,
a gas inlet through which gas flows in and a gas outlet through which gas flows out are formed, and
a flow velocity increasing portion connecting the gas inlet and the gas outlet and having a smaller cross-sectional area than the gas inlet and the gas outlet is formed.
3 . The apparatus of claim 1 , wherein an inner surface of the flow velocity increasing portion is inwardly convex, and a front end of the device body disposed around the gas inlet is curved.
4 . The apparatus of claim 1 , wherein the flow velocity increasing hole has a length direction disposed on an extension of a direction in which a gas is injected through the gas injection portion.
5 . The apparatus of claim 1 , further comprising:
a device driving unit connected to the device body and configured to move a position of the device body so that a position of the flow velocity increasing hole portion is moved; and
a device tilting unit connected to the device body and configured to tilt the device body so that the flow velocity increasing hole portion is tilted.
6 . The apparatus of claim 1 , further comprising:
an object driving unit connected to the holder and moving a position of the holder so that the object to be deposited is moved; and
an object tilting unit connected to the holder and tilting the holder so that the object to be deposited is tilted.
7 . The apparatus of claim 1 , wherein the device body is provided in plural and the plurality of device bodies are arranged not to interfere with each other in a gas passage direction through the flow velocity increasing hole portion.
8 . The apparatus of claim 1 , further comprising:
a gas distribution unit disposed between the gas injection portion and the flow velocity increasing device to distribute a gas injected through the gas injection portion,
wherein the gas distribution unit includes:
a distribution housing communicating with the gas injection portion and having a gas accommodating space therein; and
a plurality of distribution holes formed at a rear end of the distribution housing disposed to be adjacent to the flow velocity increasing device and spaced apart from each other at a predetermined interval.
9 . An apparatus for depositing a thin film, the apparatus comprising:
a source gas supply tank supplying a source gas;
a reactant gas supply tank supplying a reactant gas;
a purge gas supply tank supplying purge gas;
a chamber having a gas injection portion including a source gas nozzle connected to the source gas supply tank, a reactant gas nozzle connected to the reactant gas supply tank, and a purge gas nozzle connected to the purge gas supply tank, and a gas discharge port;
a vacuum pump connected to the chamber;
a flow velocity increasing device disposed within the chamber,
wherein the flow velocity increasing device includes:
a device body disposed within the chamber; and
a flow velocity increasing hole portion formed in the device body and tapered in a direction of gas passage and configured to cause a flow velocity of passed gas to be faster than that externally to increase a circulating power of the passed gas to enhance uniform thin film deposition in at least one of enclosed regions or stepped surfaces of an object;
a holder disposed in the chamber and configured to hold an object to be deposited;
an object rotating unit connected to the holder and configured to rotate the holder so that the object to be deposited rotates; and
an object revolving unit connected to the holder and configured to revolve the holder so that the object to be deposited revolves.
10 . The apparatus of claim 9 , wherein in the flow velocity increasing hole portion,
a gas inlet through which gas flows in and a gas outlet through which gas flows out are formed, and
a flow velocity increasing portion connecting the gas inlet and the gas outlet and having a smaller cross-sectional area than the gas inlet and the gas outlet is formed, and
wherein an inner surface of the flow velocity increasing portion is inwardly convex, and a front end of the device body disposed around the gas inlet.