Granted Patent B2

US 12,632,088 · App. 17/521,325 · Granted May 19, 2026

Inventors: Baekeun Cho (Suwon-si, KR); Hyunggwang Kang (Suwon-si, KR); Myunghoon Kwak (Suwon-si, KR); Bohyeon Kim (Suwon-si, KR)

Assignee: Samsung Electronics Co., Ltd.

G06F1/1652G06F1/1624H05K7/20954H04M1/0237H04M1/0241H04M1/0268H04M2250/12

Abstract

Claims (63)

1 . An electronic device comprising:

a housing;

a plate slidable from the housing in a first direction and a second direction opposite to the first direction;

a flexible display including a bendable area that can be inserted into an internal space of the housing;

a sensor circuit;

at least one temperature sensor disposed on the housing;

a memory storing one or more heat-related execution policies; and

a processor operatively coupled to the sensor circuit, the at least one temperature sensor, and the memory,

wherein the memory stores instructions that, when executed by the processor, cause the electronic device to:

obtain, via the at least one temperature sensor, information related to a first temperature in a first state in which the bendable area of the flexible display is inserted into the internal space of the housing,

in case that the first temperature is higher than a first designated temperature, control at least one heating element to a first execution policy, and

in response to detecting via the sensor circuit that a state of the electronic device has changed from the first state to a second state in which the bendable area of the flexible display is drawn out from the internal space of the housing, control the at least one heating element operating according to the first execution policy to operate according to a second execution policy,

wherein the second execution policy comprises a policy having a higher performance than the first execution policy.

2 . The electronic device of claim 1 , wherein the at least one heating element comprises at least one of an application processor (AP), communication circuitry, a charging circuit, a battery, or a connection terminal.

3 . The electronic device of claim 2 ,

wherein, based on the at least one heating element being the AP, the first execution policy comprises a policy for at least one of reducing a maximum clock of a central processor unit (CPU) included in the AP, reducing a maximum clock of a graphics processing unit (GPU) included in the AP, or reducing a frame per second (FPS), and a second execution policy comprises a policy for at least one of increasing the maximum clock of the CPU to be higher than a maximum clock of the first execution policy, increasing the maximum clock of the GPU to be higher than the maximum clock of the first execution policy, or increasing the FPS to be higher than an FPS of the first execution policy,

wherein, based on the at least one heating element being the communication circuitry, the first execution policy comprises a policy for at least one of reducing a data transfer rate or reducing power, and the second execution policy comprises a policy for at least one of increasing the data transfer rate to be higher than a data transfer rate of the first execution policy, or increasing the power to be higher than the power of the first execution policy, and

wherein, based on the at least one heating element being at least one of the charging circuit, the battery, or the connection terminal, the first execution policy comprises a policy for lowering a charging current and the second execution policy comprises a policy for increasing the charging current to be higher than a charging current of the first execution policy.

4 . The electronic device of claim 1 ,

wherein the instructions, when executed by the processor, further cause the electronic device to:

obtain information related to a second temperature through the at least one temperature sensor in the second state, and

in case that the second temperature is higher than a second designated temperature, control the at least one heating element to operate according to a third execution policy, and

wherein the third execution policy comprises a policy having a lower performance than the second execution policy and a higher performance than the first execution policy.

5 . The electronic device of claim 1 , wherein the instructions, when executed by the processor, further cause the electronic device to, in response to detecting the electronic device changing from the first state to the second state, identify a grip state of the electronic device.

6 . The electronic device of claim 5 , wherein the instructions, when executed by the processor, further cause the electronic device to identify the grip state of the electronic device based on one of at least one grip sensor connected to a heat discharge path of the at least one heating element or the at least one temperature sensor disposed in the heat discharge path of the at least one heating element.

7 . The electronic device of claim 6 ,

wherein the instructions, when executed by the processor, further cause the electronic device to:

in response to identifying that the state of the electronic device is the grip state, control the at least one heating element operating according to the first execution policy to operate according to a third execution policy, and

in response to identifying that the state of the electronic device is not the grip state, control the at least one heating element operating according to the first execution policy to operate according to the second execution policy, and

wherein the third execution policy comprises a policy for changing performance at designated time intervals within a designated performance range and controlling the at least one heating element to operate with the changed performance.

8 . The electronic device of claim 7 , wherein the instructions, when executed by the processor, further cause the electronic device to:

identify a surface temperature of the electronic device through the at least one temperature sensor in the heat discharge path of the at least one heating element, and

control the at least one heating element to operate according to the third execution policy until the identified surface temperature of the electronic device reaches a third designated temperature.

9 . The electronic device of claim 1 , wherein the instructions, when executed by the processor, further cause the electronic device to, while the at least one heating element operates according to the first execution policy, control the flexible display to display a notification message related to an execution policy controlled based on a state of the electronic device or a notification message for inducing use of the electronic device in the second state.

10 . A method of controlling a temperature according to a state of an electronic device comprising a flexible display, the method comprising:

obtaining, via at least one temperature sensor, information related to a first temperature in a first state in which a bendable area of a flexible display is inserted into an internal space of a housing;

in case the first temperature is higher than a first designated temperature, controlling at least one heating element to a first execution policy; and

in response to detecting via a sensor circuit that a state of the electronic device has changed from the first state to a second state in which the bendable area of the flexible display is drawn out from the internal space of the housing, controlling the at least one heating element operating according to the first execution policy to operate according to a second execution policy,

wherein the second execution policy comprises a policy having a higher performance than the first execution policy.

11 . The method of claim 10 , further comprising:

while the electronic device is in the second state, obtaining information related to a second temperature through the at least one temperature sensor; and

in case that the second temperature is higher than a second designated temperature, control the at least one heating element to operate according to a third execution policy,

wherein the third execution policy comprises a policy having a lower performance than the second execution policy and a higher performance than the first execution policy.

12 . The method of claim 10 , further comprising:

in response to detecting a change in the state of the electronic device from the first state to a second state, identifying whether the electronic device is in a grip state.

13 . The method of claim 12 , further comprising identifying the electronic device as being in the grip state based on one of at least one grip sensor connected to a heat discharge path of the at least one heating element or the at least one temperature sensor disposed in the heat discharge path of the at least one heating element.

14 . The method of claim 13 , further comprising:

in response to identifying that the state of the electronic device is the grip state, controlling the at least one heating element operating according to the first execution policy to operate according to a third execution policy; and

in response to identifying that the state of the electronic device is not the grip state, controlling the at least one heating element operating according to the first execution policy to operate according to a second execution policy,

wherein the third execution policy comprises a policy for changing performance at designated time intervals within a designated performance range and controlling the at least one heating element to operate with the changed performance.

15 . The method of claim 14 , wherein the controlling of the at least one heating element to operate according to the third execution policy comprises:

identifying a surface temperature of the electronic device through the at least one temperature sensor in the heat discharge path of the at least one heating element; and

controlling the at least one heating element to operate according to the third execution policy until the identified surface temperature of the electronic device reaches a third designated temperature.

16 . The method of claim 10 , further comprising, in response to the at least one heating element operating according to the first execution policy, displaying a notification message related to an execution policy controlled based on the state of the electronic device or displaying a notification message for inducing use of the electronic device in a second state.

17 . The method of claim 10 ,

wherein, based on the at least one heating element being an application processor (AP), the first execution policy comprises a policy for at least one of reducing a maximum clock of a central processor unit (CPU) included in the AP, reducing a maximum clock of a graphics processing unit (GPU) included the in AP, or reducing a frame per second (FPS), and a second execution policy comprises a policy for at least one of increasing the maximum clock of the CPU to be higher than a maximum clock of the first execution policy, increasing the maximum clock of the GPU to be higher than the maximum clock of the first execution policy, or increasing the FPS to be higher than an FPS of the first execution policy,

wherein, based on the at least one heating element being communication circuitry, the first execution policy comprises a policy for at least one of reducing a data transfer rate or reducing power, and the second execution policy comprises a policy for at least one of increasing the data transfer rate to be higher than a data transfer rate of the first execution policy, or increasing the power to be higher than the power of the first execution policy, and

wherein, based on the at least one heating element being at least one of a charging circuit, a battery, or a connection terminal, the first execution policy comprises a policy for lowering a charging current and the second execution policy comprises a policy for increasing the charging current to be higher than a charging current of the first execution policy.

18 . A non-transitory computer-readable medium storing instructions executable by a processor of an electronic device, wherein execution of the instructions by the processor causes the processor to perform a plurality of operations comprising:

obtaining, via at least one temperature sensor, information related to a first temperature in a first state in which a bendable area of a flexible display is inserted into an internal space of a housing;

in case the first temperature is higher than a first designated temperature, controlling at least one heating element to a first execution policy; and

in response to detecting via a sensor circuit that a state of the electronic device has changed from the first state to a second state in which the bendable area of the flexible display is drawn out from the internal space of the housing, controlling the at least one heating element operating according to the first execution policy to operate according to a second execution policy,

wherein the second execution policy comprises a policy having a higher performance than the first execution policy.

Assignments (1)

Priority Claims (2)

Continuity (2)

References Cited (21)