Gas distribution assemblies for semiconductor devices
Gas distribution assemblies for semiconductor devices are described. The gas distribution assemblies include a backplate, a faceplate, a counterbored hole, and at least one orifice. The at least one orifice includes, for example, at least one straight orifice, or at least two angled orifices. Some embodiments of the gas distribution assemblies provide for reduced plasma damage in a processing chamber. Some embodiments of the gas distribution assemblies provide for reduced jetting on a substrate in a processing chamber. Methods of reducing plasma damage in gas distribution assemblies are also described.
1 . A gas distribution assembly for a semiconductor device, the gas distribution assembly comprising:
a backplate having a top surface and a bottom surface defining a thickness, and an opening extending through the thickness;
a faceplate having a top surface and a bottom surface defining a thickness, the top surface of the faceplate spaced a distance from and facing the bottom surface of the backplate, the faceplate and the backplate connected by at least one o-ring;
a first counterbored hole extending through a top portion of the thickness of the faceplate;
at least two angled orifices extending through a bottom portion of the thickness of the faceplate; and
a second counterbored hole comprising a pair of counterbored holes, each of the pair of counterbored holes extending from a bottom of each of the at least two angled orifices through a bottom portion of the thickness of the faceplate, wherein the at least two angled orifices independently define a gas hole that allows gas to pass through the orifices towards the at least one o-ring, have a diameter in a range of from 0.2 mm to 1 mm, and have a height in a range of from 1 mm to 5 mm.
2 . The gas distribution assembly of claim 1 , wherein the opening in the top surface of the backplate has a diameter in a range of from 1.2 mm to 2 mm.
3 . The gas distribution assembly of claim 1 , wherein the backplate comprises a metallic material.
4 . The gas distribution assembly of claim 3 , wherein the metallic material is aluminum (Al).
5 . The gas distribution assembly of claim 1 , wherein the faceplate comprises a ceramic material.