Thermally decoupled signal transmission lines
A thermally decoupled signal transmission line includes a first segment and a second segment. Each of the first and second segments has an elongated body including a signal conductor, at least one reference plane, and a dielectric interposed between the signal conductor and the at least one reference plane. The first segment and second segments abut at a joint. At the joint, the dielectric in at least one of the first and second segments thermally and electrically insulates the signal conductor in the first segment from the signal conductor in the second segment.
1 . A thermally decoupled signal transmission line, comprising:
a first segment and a second segment, wherein:
each of the first and second segments has an elongated body including a signal conductor, at least one reference plane, and a dielectric interposed between the signal conductor and the at least one reference plane;
the first segment and second segments abut at a joint; and
the dielectric in at least one of the first and second segments thermally and electrically insulates the signal conductor in the first segment from the signal conductor in the second segment.
2 . The thermally decoupled signal transmission line of claim 1 , wherein each of the first and second segments includes multiple reference planes.
3 . The thermally decoupled signal transmission line of claim 1 , wherein the dielectric is a high-permittivity dielectric.
4 . The thermally decoupled signal transmission line of claim 1 , wherein the joint comprises a butt joint.
5 . The thermally decoupled signal transmission line of claim 1 , wherein the joint comprises a lap joint.
6 . The thermally decoupled signal transmission line of claim 1 , further comprising a mechanical fixture that retains the first and second segments in fixed relation.
7 . The thermally decoupled signal transmission line of claim 6 , wherein the mechanical fixture includes at least one of a connector and a clamp.
8 . A high-performance computing environment, comprising:
an enclosure including a plurality of temperature zones;
a processor disposed in one of the plurality of temperature zones; and
a thermally decoupled signal transmission line in accordance with claim 1 ,
wherein the thermally decoupled signal transmission line is coupled to the processor and spans at least two of the temperature zones.
9 . The high-performance computing environment of claim 8 , wherein the processor comprises a quantum processor.
10 . A method, comprising:
providing a first segment and a second segment of a thermally decoupled signal transmission line, wherein each of the first and second segments has an elongated body including a signal conductor, at least one reference plane, and a dielectric interposed between the signal conductor and the at least one reference plane;
assembling the first segment and second segments to abut at a joint, such that the dielectric in at least one of the first and second segments thermally and electrically insulates the signal conductor in the first segment from the signal conductor in the second segment; and
retaining the first and second segments in fixed relation.
11 . The method of claim 10 , wherein the providing includes providing first and second segments each including multiple reference planes.
12 . The method of claim 10 , wherein the dielectric is a high-permittivity dielectric.
13 . The method of claim 10 , wherein the assembling includes assembling the first and second segments in a butt joint.
14 . The method of claim 10 , wherein the assembling includes assembling the first and second segments in a lap joint.
15 . The method of claim 10 , wherein the retaining includes retaining the first and second segments in fixed relation with a mechanical fixture.
16 . The method of claim 15 , wherein the mechanical fixture includes at least one of a connector and a clamp.
17 . The method of claim 10 , further coupling the thermally decoupled signal transmission line to a processor of a high-performance computer including an enclosure having a plurality of temperature zones such that the thermally decoupled signal transmission line spans at least two of the temperature zones.
18 . The method of claim 17 , wherein the coupling includes coupling the thermally decoupled signal transmission line to a quantum processor.