Temporary substrate carriers
Implementations of a substrate carrier may include a frame including an inner perimeter, the inner perimeter configured to be smaller than a perimeter of an organic substrate panel including multiple semiconductor die coupled thereto; and an outer perimeter configured to be larger than the perimeter of the organic substrate panel; wherein an edge of the frame between the inner perimeter and outer perimeter may be configured to rest against the organic substrate panel to prevent warpage during a heating operation.
1 . A substrate carrier comprising:
a frame comprising an inner perimeter, the inner perimeter configured to be smaller than a perimeter of an organic substrate panel comprising multiple semiconductor die coupled thereto; and
an outer perimeter configured to be larger than the perimeter of the organic substrate panel;
wherein an edge of the frame between the inner perimeter and outer perimeter is configured to rest over and against the organic substrate panel to prevent warpage during a heating operation; and
wherein the organic substrate panel is configured to rest against a surface external to the frame when the organic substrate panel is coupled within the frame.
2 . The substrate carrier of claim 1 , wherein the edge of the frame is configured to rest on a largest planar side of the organic substrate panel to which the semiconductor die are coupled.
3 . The substrate carrier of claim 2 , further comprising rotatable projections extending from the frame that are configured to contact the organic substrate panel.
4 . The substrate carrier of claim 3 , wherein the rotatable projections are configured to contact a largest planar side of the organic substrate panel opposite a largest planar side to which the semiconductor die are coupled.
5 . The substrate carrier of claim 1 , wherein the edge of the frame is configured to contact a largest planar side of the organic substrate panel opposite a largest planar side to which the semiconductor die are coupled.
6 . The substrate carrier of claim 5 , further comprising rotatable projections extending from the frame wherein the rotatable projections are configured to contact the largest planar side to which the semiconductor die are coupled.
7 . The substrate carrier of claim 1 , wherein the edge of the frame comprises a shoulder configured to rest against a largest planar side of the organic substrate panel.
8 . A substrate carrier comprising:
a frame comprising an inner surface and an outer surface and a shoulder comprised in the inner surface; and
rotatable projections extending from the frame that are configured to contact the organic substrate panel;
wherein the shoulder of the frame is configured to contact an organic substrate panel comprising multiple semiconductor die coupled thereto in order to prevent warpage during a heating operation.
9 . The substrate carrier of claim 8 , wherein the shoulder of the frame is configured to rest on a largest planar side of the organic substrate panel to which the semiconductor die are coupled.
10 . The substrate carrier of claim 8 , wherein the rotatable projections are configured to contact a largest planar side of the organic substrate panel opposite a largest planar side to which the semiconductor die are coupled.
11 . The substrate carrier of claim 8 , wherein the shoulder of the frame is configured to contact a largest planar side of the organic substrate panel opposite a largest planar side to which the semiconductor die are coupled.
12 . The substrate carrier of claim 11 , further comprising rotatable projections extending from the frame wherein the rotatable projections are configured to contact the largest planar side to which the semiconductor die are coupled.
13 . A substrate carrier comprising:
a first frame comprising an inner surface and an outer surface and a first shoulder comprised in the inner surface;
a second frame comprising an inner surface and an outer surface and a second shoulder comprised in the inner surface; and
two or more couplers holding the first frame to the second frame;
wherein when the two or more couplers hold the first frame to the second frame, the first shoulder of the first frame and the second shoulder of the second frame are configured to contact an organic substrate panel comprising multiple semiconductor die coupled thereto in order to prevent warpage during a heating operation; and
wherein a height of the organic substrate panel is configured to extend beyond an uppermost height of the first frame when the organic substrate panel is coupled between the first frame and the second frame.
14 . The substrate carrier of claim 13 , wherein the first shoulder of the first frame is configured to rest on a largest planar side of the organic substrate panel to which the semiconductor die are coupled.
15 . The substrate carrier of claim 13 , wherein the second shoulder of the second frame is configured to contact a largest planar side of the organic substrate panel opposite a largest planar side to which the semiconductor die are coupled.
16 . The substrate carrier of claim 13 , wherein the two or more couplers are two or more pins.
17 . The substrate carrier of claim 13 , wherein the two or more couplers are two or more clips.
18 . The substrate carrier of claim 13 , wherein the two or more couplers are two or more clamps.
19 . The substrate carrier of claim 13 , wherein the two or more couplers are comprised in the first frame, the second frame, or in both the first frame and the second frame.