Circuit board, display apparatus, and method for manufacturing circuit board
View Patent ↗Disclosed is a circuit board, including: a first circuit board, a second circuit board and a conductive portion. The first circuit board includes a first substrate, a wire group and a substrate connection pad. A first wire group includes a first wire and a second wire disposed on two sides of the first substrate. A first substrate connection pad is electrically connected to the second wire via a via hole. The second circuit board includes a second substrate, a wire and a relay connection pad, wherein the wire and the relay connection pad are disposed on the second substrate. One end of the wire is electrically connected to a first relay connection pad.
1 . A circuit board, comprising a first circuit board, at least one second circuit board and at least one conductive portion, wherein
the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate; and
the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, the second substrate is disposed on the first side of the first substrate, one end of each of the at least two wires is electrically connected to a first relay connection pad in the at least one relay connection pad, and the first relay connection pad is electrically connected to the first substrate connection pad via a first conductive portion in the at least one conductive portion.
2 . The circuit board according to claim 1 , wherein the first substrate connection pad comprises at least two substrate connection terminals disposed on the first side of the first substrate; wherein the at least two substrate connection terminals comprise a first substrate connection terminal electrically connected to the first wire, and a second substrate connection terminal disposed at the first via hole, the second substrate connection terminal being electrically connected to the second wire.
3 . The circuit board according to claim 2 , wherein the second substrate connection terminal comprises a conductive structure surrounding the first via hole and a metal layer covering the conductive structure and the first via hole, wherein the conductive structure is disposed on the first substrate, and the conductive structure and the first wire are at the same layer.
4 . The circuit board according to claim 1 , wherein the at least two wires comprise a third wire disposed on a third side of the second substrate and a fourth wire disposed on a fourth side of the second substrate, wherein the third side and the fourth side are two opposite sides of the second substrate, and the third side is a side of the second substrate facing the first substrate; and
the second substrate is provided with a second via hole, wherein the first relay connection pad is electrically connected to the fourth wire via the second via hole.
5 . The circuit board according to claim 4 , wherein the second via hole has a number of at least two; the first relay connection pad comprises relay connection terminals disposed at the second via holes; and the third wire and the fourth wire are respectively electrically connected to two of the relay connection terminals at the second via holes.
6 . The circuit board according to claim 5 , wherein each of the relay connection terminals comprises a first conductive layer disposed on a hole wall of the second via hole, and second conductive layers extending from openings of the second via hole to the second substrate, the first conductive layer being connected to the second conductive layers.
7 . The circuit board according to claim 6 , wherein the first conductive portion is in contact with the first substrate connection pad, and the first conductive portion is at least partially filled in the second via hole.
8 . The circuit board according to claim 1 , wherein the at least two wires comprise a fifth wire disposed on a third side of the second substrate or a fourth side of the second substrate; wherein the third side and the fourth side are two opposite sides of the second substrate, the third side is a side of the second substrate facing the first substrate, and the fifth wire is electrically connected to the first relay connection pad.
9 . The circuit board according to claim 1 , wherein the wire group has a number of at least two; and the conductive portion has a number of at least two;
the first circuit board further comprises a second substrate connection pad disposed on the first substrate, a second wire group in the at least two wire groups comprises a sixth wire disposed on the first side of the first substrate and a seventh wire disposed on the second side of the first substrate, wherein the sixth wire is electrically connected to the second substrate connection pad, the first substrate is provided with a third via hole, and the seventh wire is electrically connected to the second substrate connection pad via the third via hole; and
the second circuit board further comprises a second relay connection pad disposed on the second substrate, wherein the other end of each of the at least two wires is electrically connected to the second relay connection pad, and the second relay connection pad is electrically connected to the second substrate connection pad via a second conductive portion in the at least two conductive portions.
10 . The circuit board according to claim 1 , wherein the first circuit board comprises a first insulation layer disposed on the first side of the first substrate, and an eighth wire disposed between the first insulation layer and the first substrate, wherein the first insulation layer is provided with a fourth via hole, and the eighth wire is electrically connected to the first substrate connection pad via the fourth via hole.
11 . The circuit board according to claim 1 , wherein at least one of the substrate connection pad and the relay connection pad is a ball-grid-array connection pad.
12 . The circuit board according to claim 1 , wherein the first substrate and the second substrate are both flexible substrates.
13 . A display apparatus, comprising a display panel and a circuit board, wherein the display panel is electrically connected to the circuit board, the circuit board comprises a first circuit board, at least one second circuit board and at least one conductive portion, wherein
the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate; and
the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, the second substrate is disposed on the first side of the first substrate, one end of each of the at least two wires is electrically connected to a first relay connection pad in the at least one relay connection pad, and the first relay connection pad is electrically connected to the first substrate connection pad via a first conductive portion in the at least one conductive portion.
14 . The display apparatus according to claim 13 , wherein the display panel comprises a base substrate, a light-emitting structure layer disposed on the base substrate, and a touch electrode layer disposed on the light-emitting structure layer, wherein the touch electrode layer is electrically connected to the circuit board.
15 . The display apparatus according to claim 13 , wherein the at least two wires comprise a third wire disposed on a third side of the second substrate and a fourth wire disposed on a fourth side of the second substrate, wherein the third side and the fourth side are two opposite sides of the second substrate, and the third side is a side of the second substrate facing the first substrate; and
the second substrate is provided with a second via hole, wherein the first relay connection pad is electrically connected to the fourth wire via the second via hole.
16 . The display apparatus according to claim 15 , wherein the second via hole has a number of at least two; the first relay connection pad comprises relay connection terminals disposed at the second via holes; and the third wire and the fourth wire are respectively electrically connected to two of the relay connection terminals at the second via holes.
17 . The display apparatus according to claim 16 , wherein each of the relay connection terminals comprises a first conductive layer disposed on a hole wall of the second via hole, and second conductive layers extending from openings of the second via hole to the second substrate, the first conductive layer being connected to the second conductive layers.
18 . A method for manufacturing a circuit board, comprising:
providing a first circuit board, wherein the first circuit board comprises a first substrate, at least one wire group and at least one substrate connection pad, wherein a first wire group in the at least one wire group comprises a first wire disposed on a first side of the first substrate and a second wire disposed on a second side of the first substrate, the at least one substrate connection pad is disposed on the first side of the first substrate, the first wire is electrically connected to a first substrate connection pad in the at least one substrate connection pad, the first substrate is provided with a first via hole, the first substrate connection pad is electrically connected to the second wire via the first via hole, and the first side and the second side are two opposite sides of the first substrate;
providing a second circuit board, wherein the second circuit board comprises a second substrate, at least two wires and at least one relay connection pad, wherein the least two wires and the at least one relay connection pad are disposed on the second substrate, and one end of each of the at least two wires is electrically connected to the first relay connection pad in the at least one relay connection pad; and
stacking the second circuit board on the first circuit board, and electrically connecting the first relay connection pad to the first substrate connection pad via at least one conductive portion, wherein the second substrate is disposed on the first side of the first substrate.
19 . The display apparatus according to claim 13 , wherein the first substrate connection pad comprises at least two substrate connection terminals disposed on the first side of the first substrate; wherein the at least two substrate connection terminals comprise a first substrate connection terminal electrically connected to the first wire, and a second substrate connection terminal disposed at the first via hole, the second substrate connection terminal being electrically connected to the second wire.
20 . The display apparatus according to claim 19 , wherein the second substrate connection terminal comprises a conductive structure surrounding the first via hole and a metal layer covering the conductive structure and the first via hole, wherein the conductive structure is disposed on the first substrate, and the conductive structure and the first wire are at the same layer.