IP Library Granted Patent US 12,645,199
Granted Patent B2
US 12,645,199 · App. 18/288,997 · Granted Jun 2, 2026

Numerical control device and numerical control method

Inventors: Seiji Uozumi (Tokyo, JP); Nobuyuki Sumi (Tokyo, JP); Shun Kayashima (Tokyo, JP)
Assignee: MITSUBISHI ELECTRIC CORPORATION
G05B19/4099G05B19/182G05B2219/49007G05B2219/49018
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Quick Facts
Patent No.
US 12,645,199
App. No.
18/288,997
Granted
Jun 2, 2026
Kind
B2
Abstract

An NC device includes an additive manufacturing execution unit that controls an additive manufacturing process for producing a shaped object by stacking layers of a material melted, a subtractive manufacturing execution unit that controls a subtractive manufacturing process for cutting the shaped object using a tool, a status analysis unit that analyzes a machining status of the shaped object based on sensor data obtained by monitoring of the machining status of the shaped object produced by a combination of the additive and subtractive manufacturing processes, a production process change unit that outputs, to the additive and subtractive manufacturing execution units, a switching command that commands switching a production process, based on the analysis of the machining status, and a process condition generation unit that determines a process condition to be used in a production process after switching, based on a process condition used before the switching.

Claims (39)

1 . A numerical control device comprising:

additive manufacturing execution circuitry to control an additive manufacturing machine that performs an additive manufacturing process in which a shaped object is produced by stacking layers of a material melted by emission of a beam from a first machining head;

subtractive manufacturing execution circuitry to control a subtractive manufacturing machine that performs a subtractive manufacturing process in which the shaped object is cut using a tool disposed on a second machining head;

status analysis circuitry to receive sensor data obtained by monitoring of a machining status of the shaped object, and to analyze the machining status of the shaped object based on the sensor data, the shaped object being produced by a combination of two production processes, the two production processes being the additive manufacturing process and the subtractive manufacturing process;

production process change circuitry to generate a switching command that commands switching with respect to which of the two production processes is to be performed, based on a result of analysis of the machining status, and to output the switching command to the additive manufacturing execution circuitry and to the subtractive manufacturing execution circuitry; and

process condition generation circuitry to determine, upon switching between the two production processes, a second process condition to be used in a second production process based on a first process condition that has been used in a first production process, the first production process being a production process performed before the switching, of the two production processes, the second production process being a production process to be performed after the switching, of the two production processes, wherein

a moving direction on a machining path to be used in the second production process is opposite to a moving direction on a machining path used in the first production process.

2 . The numerical control device according to claim 1 , wherein

the second production process uses a machining path including an offset portion, the offset portion being a path generated by offsetting, in three-dimensional space, a machining path used in the first production process.

3 . The numerical control device according to claim 2 , wherein

when the first production process is the additive manufacturing process, and the second production process is the subtractive manufacturing process,

the process condition generation circuitry sets,

for the offset portion, an offset amount that allows removal of an amount of deviation from a desired value of a height or a width of the shaped object, experienced in the first production process.

4 . The numerical control device according to claim 1 , wherein

the sensor data includes a value of load torque exerted on a scanning shaft of the subtractive manufacturing machine.

5 . The numerical control device according to claim 1 , wherein

when the first production process is the additive manufacturing process, and the second production process is the subtractive manufacturing process,

the second process condition includes a scanning speed of the second machining head and a spindle rotation speed, and

the process condition generation circuitry determines the scanning speed of the second machining head and the spindle rotation speed based on a volume of the shaped object to be removed in the second production process.

6 . The numerical control device according to claim 1 , wherein

when the first production process is the subtractive manufacturing process, and the second production process is the additive manufacturing process,

the second process condition includes a scanning speed, laser output power, and an amount of supply of the material, each of the first machining head, and

the process condition generation circuitry determines the scanning speed, the laser output power, and the amount of supply of the material, each of the first machining head, based on a volume of the shaped object to be added in the second production process.

7 . The numerical control device according to claim 1 , wherein

the status analysis circuitry

estimates a welding status or a shape condition of the shaped object based on the sensor data, and

the production process change circuitry

determines whether to continue the first production process or to output a switching command, based on a result of estimation performed by the status circuitry.

8 . The numerical control device according to claim 1 , wherein

the sensor data includes data of at least one of a height, a width, or a temperature of a specific layer of the shaped object.

9 . The numerical control device according to claim 1 , wherein

the sensor data includes a value of load torque exerted on material supply circuitry that supplies the material.

10 . A numerical control method comprising:

controlling an additive manufacturing machine that performs an additive manufacturing process in which a shaped object is produced by stacking layers of a material melted by emission of a beam from a first machining head;

controlling a subtractive manufacturing machine that performs a subtractive manufacturing process in which the shaped object is cut using a tool disposed on a second machining head;

receiving sensor data obtained by monitoring of a machining status of the shaped object, and analyzing the machining status of the shaped object based on the sensor data, the shaped object being produced by a combination of two production processes, the two production processes being the additive manufacturing process and the subtractive manufacturing process;

performing switching with respect to which of the two production processes is to be performed, based on a result of analysis of the machining status; and

determining, upon switching between the two production processes, a second process condition to be used in a second production process based on a first process condition that has been used in a first production process, the first production process being a production process performed before the switching, of the two production processes, the second production process being a production process to be performed after the switching, of the two production processes, wherein

a moving direction on a machining path to be used in the second production process is opposite to a moving direction on a machining path used in the first production process.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2023
From: UOZUMI, SEIJI; SUMI, NOBUYUKI; KAYASHIMA, SHUN
To: MITSUBISHI ELECTRIC CORPORATION
Reel/Frame 065398/0655 →
Continuity (1)
Related Publication 20240231312A1 · Jul 11, 2024
References Cited (48)
US 6471800B2 · Jang · 2002 [cited by examiner]
US 10520923B2 · Connor · 2019 [cited by examiner]
US 10611085B1 · Janson · 2020 [cited by examiner]
US 11097484B1 · Snyder · 2021 [cited by examiner]
US 11422532B2 · Connor · 2022 [cited by examiner]
US 11491718B2 · Sealy · 2022 [cited by examiner]
US 11565468B1 · Snyder · 2023 [cited by examiner]
US 20080286139A1 · Abe et al. · 2008 [cited by applicant]
US 20120225076A1 · Peeper et al. · 2012 [cited by applicant]
US 20130015596A1 · Mozeika et al. · 2013 [cited by applicant]
US 20140163717A1 · Das · 2014 [cited by examiner]
US 20160144429A1 · Mizutani · 2016 [cited by applicant]
US 20170297323A1 · Yamazaki et al. · 2017 [cited by applicant]
US 20190361426A1 · Connor · 2019 [cited by examiner]
US 20200096971A1 · Connor · 2020 [cited by examiner]
US 20200166909A1 · Noone · 2020 [cited by examiner]
US 20200264589A1 · Reinhart · 2020 [cited by examiner]
US 20210107108A1 · Aizawa et al. · 2021 [cited by applicant]
US 20210197491A1 · Hollander · 2021 [cited by examiner]
US 20220043430A1 · Iriguchi · 2022 [cited by examiner]
US 20220342385A1 · Connor · 2022 [cited by examiner]
US 20220379380A1 · Sanders · 2022 [cited by examiner]
US 20230101500A1 · Iriguchi · 2023 [cited by examiner]
US 20230251626A1 · Connor · 2023 [cited by examiner]
CN 104950820A · 2015 [cited by applicant]
JP 2002115004A · 2002 [cited by applicant]
JP 2006124733A · 2006 [cited by applicant]
JP 2008307895A · 2008 [cited by applicant]
JP 2013006269A · 2013 [cited by applicant]
JP 2016009351A · 2016 [cited by applicant]
JP 201698411A · 2016 [cited by applicant]
JP 2016127833A · 2016 [cited by applicant]
JP 2017194942A · 2017 [cited by applicant]
JP 2018176582A · 2018 [cited by applicant]
JP 6626788B2 · 2019 [cited by applicant]
JP 202164128A · 2021 [cited by applicant]
Zhao et al., “Shape and Performance Controlled Advanced Design for Additive Manufacturing: A Review of Slicing and Path Planning”, Jun. 2018, Journal of Manufacturing Science and Engineering Jan. 2020, vol. 142 (Year: 2… [cited by examiner]
Rahman et al., “Review of Intelligence for Additive and Subtractive Manufacturing: Current Status and Future Prospect”, Dec. 2022, Micromachines 2023, 14, 508. (Year: 2022). [cited by examiner]
Osman et al., “Optimal Process Planning for Hybrid Additive and Subtractive Manufacturing”, Jul. 2021, Journal of Manufacturing Science and Engineering Jun. 2023, vol. 145. (Year: 2021). [cited by examiner]
Grzesik, W., “Hybrid Additive and Subtractive Manufacturing Processes and Systems: A Review”, Feb. 2018, Journal of Machine Engineering, 2018, vol. 18, No. 4, 5-24. (Year: 2018). [cited by examiner]
Liu et al., “Topology optimization for hybrid additive-subtractive manufacturing”, Apr. 2016, Struct Multidisc Optim (2017) 55:1281-1299. (Year: 2016). [cited by examiner]
Li et al., “A novel 6-axis hybrid additive-subtractive manufacturing process: Design and case studies”, Sep. 2017, Journal of Manufacturing Processes 33 (2018) 150-160. (Year: 2017). [cited by examiner]
Flynn et al., “Hybrid additive and subtractive machine tools—Research and industrial developments”, Jun. 2015, International JournalofMachine Tools&Manufacture 101(2016)79-101. (Year: 2015). [cited by examiner]
Bai et al., “Adaptive Process Planning for Additive/Subtractive Hybrid Manufacturing of Overhang Features”, Oct. 2021, Journal of Manufacturing Science and Engineering Feb. 2023, vol. 145. (Year: 2021). [cited by examiner]
Chen et al., “Process planning for hybrid additive and subtractive manufacturing to integrate machining and directed energy deposition”, 2019, Procedia Manufacturing 34, 205-213. (Year: 2019). [cited by examiner]
International Search Report and Written Opinion mailed on Jul. 20, 2021, received for PCT Application PCT/JP2021/017515, filed on May 7, 2021, 11 pages including English Translation. [cited by applicant]
Office Action issued Aug. 20, 2024 in corresponding Japanese Patent Application No. 2023-518588, 11pp. [cited by applicant]
Office Action mailed on Mar. 23, 2026 for the corresponding Chinese patent application No. 202180097031.1 and an English machine translation thereof, 19pp. [cited by applicant]