IP Library › Granted Patent US 12,646,874
Granted Patent B2
US 12,646,874 · App. 18/291,161 · Granted Jun 2, 2026

Printed circuit board arrangement

Inventors: Marc Genau (Lübbecke, DE); Rainer Bussmann (Bad Essen, DE)
Assignee: HARTING ELECTRONICS GMBH
H01R12/716H01R12/721H01R13/506H01R13/518
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Quick Facts
Patent No.
US 12,646,874
App. No.
18/291,161
Granted
Jun 2, 2026
Kind
B2
Abstract

A printed circuit board assembly is provided having a first printed circuit board with at least two contact openings, at least two printed circuit board contact elements, each of which has a plug end and a connection end, the plug end being plugged into the contact opening in the first printed circuit board, a second printed circuit board with at least two contact openings, wherein the connection ends of the printed circuit board contact elements are secured to a contact opening in the second printed circuit board, and a plastic housing which is mounted on the first printed circuit board and in which the printed circuit board contact elements are movably mounted.

Claims (14)

1 . A printed circuit board arrangement, comprising:

a first printed circuit board with at least two contact openings;

at least two printed circuit board contact elements, the printed circuit board contact elements each having a plug-in end and a connection end, wherein the plug-in end is plugged into a respective one of the contact openings of the first printed circuit board;

a second printed circuit board with at least two contact openings, wherein each connection end of the printed circuit board contact elements is screwed on a respective one of the contact openings of the second printed circuit board; and

a plastic housing assembled on the first printed circuit board, wherein the printed circuit board contact elements are displaceably mounted in the plastic housing.

2 . The printed circuit board arrangement as claimed in claim 1 , wherein the first and the second printed circuit boards are arranged parallel to each other.

3 . The printed circuit board arrangement as claimed in claim 1 , wherein a direction of displacement of the printed circuit board contact elements in the plastic housing is oriented parallel to a normal vector of the printed circuit board plane of the printed circuit boards.

4 . The printed circuit board arrangement as claimed in claim 1 , wherein each contact opening of the first printed circuit board is formed from an essentially circular through-opening with an edge region, wherein the edge region comprises electrically conductive material or is made therefrom.

5 . The printed circuit board arrangement as claimed in claim 1 , wherein the printed circuit board contact elements are mounted in the plastic housing so that the printed circuit board contact elements cannot twist.

6 . The printed circuit board arrangement as claimed in claim 1 , wherein laterally protruding fastening lugs are integrally formed on the plastic housing and the first printed circuit board has screw openings correlating therewith such that the plastic housing can be screwed rigidly on the first printed circuit board.

7 . The printed circuit board arrangement as claimed in claim 1 , wherein the plastic housing has prongs which can be plugged into openings provided therefor of the first printed circuit board.

8 . The printed circuit board arrangement as claimed in claim 7 , wherein the prongs in each case have a cross-shaped cross-section.

9 . The printed circuit board arrangement as claimed in claim 1 , wherein the plug-in end of each printed circuit board plug connector has at least two axial slots.

10 . The printed circuit board arrangement as claimed in claim 1 , wherein the second printed circuit board is displaceable relative to the first printed circuit board and parallel thereto.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 23, 2024
From: GENAU, MARC; BUSSMANN, RAINER
To: HARTING ELECTRONICS GMBH
Reel/Frame 066212/0985 →
Priority Claims (1)
DE 10 2021 119 087.8 · Jul 23, 2021 · national
Continuity (1)
Related Publication 20240332837A1 · Oct 3, 2024
References Cited (37)
US 3812381A · Guyton · 1974 [cited by applicant]
US 8690586B2 · Schneider · 2014 [cited by examiner]
US 9039433B2 · Barthelmes · 2015 [cited by examiner]
US 9219325B2 · Endo · 2015 [cited by examiner]
US 11056807B2 · Hoyack · 2021 [cited by examiner]
US 11316290B2 · Kliever · 2022 [cited by examiner]
US 11901654B2 · Hoyack · 2024 [cited by examiner]
US 20030232541A1 · Meister · 2003 [cited by applicant]
US 20090120668A1 · Fjelstad et al. · 2009 [cited by applicant]
US 20100081309A1 · Voli · 2010 [cited by examiner]
US 20110104911A1 · Sypolt et al. · 2011 [cited by applicant]
US 20120178313A1 · Asano et al. · 2012 [cited by applicant]
US 20140087592A1 · Endo et al. · 2014 [cited by applicant]
US 20150289375A1 · Ozaki et al. · 2015 [cited by applicant]
US 20150325963A1 · Chen · 2015 [cited by examiner]
US 20160353573A1 · Chen et al. · 2016 [cited by applicant]
US 20180301830A1 · Hoyack et al. · 2018 [cited by applicant]
US 20200329562A1 · Hsieh et al. · 2020 [cited by applicant]
US 20200395695A1 · Benzin · 2020 [cited by applicant]
US 20210203095A1 · Kliever · 2021 [cited by applicant]
US 20210289651A1 · Klanke et al. · 2021 [cited by applicant]
US 20220328988A1 · Wang et al. · 2022 [cited by applicant]
CN 109479382A · 2019 [cited by applicant]
CN 111758189A · 2020 [cited by applicant]
CN 112954893A · 2021 [cited by applicant]
DE 10206106A1 · 2002 [cited by applicant]
DE 102017120357A1 · 2019 [cited by applicant]
DE 102018105784A1 · 2019 [cited by applicant]
DE 112012002122B4 · 2020 [cited by applicant]
DE 102020211008A1 · 2021 [cited by applicant]
EP 3399597A2 · 2018 [cited by applicant]
EP 3794684A1 · 2021 [cited by applicant]
WO WO2020167603A1 · 2020 [cited by applicant]
WO WO2021013297A1 · 2021 [cited by applicant]
International Preliminary Report on Patentability, dated Jan. 18, 2024, for International Patent Application No. PCT/DE2022/100490. (8 pages). [cited by applicant]
European Patent Office, International Search Report and Written Opinion for International Application No. PCT/DE2022/100490, mailed Oct. 21, 2022, 14 pages (with English translation of International Search Report). [cited by applicant]
German Patent Office, Office Action for German application No. 10 2021 119 087.8 dated Mar. 11, 2022, 5 pages. [cited by applicant]