Multiplexer
A multiplexer includes a common terminal, an inductor including a first end connected to the common terminal and a second end, a filter connected to the second end and having a first pass band, a filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band, an inductor connected between a ground and a path that links the second end to the filter, and a capacitor connected between the path and the ground. A resonant frequency of an LC parallel resonance circuit including the inductor and the capacitor is located between the first pass band and the second pass band.
1 . A multiplexer comprising:
a common terminal;
a first inductance element including a first end connected to the common terminal and a second end;
a first acoustic wave filter invariably connected to the second end and having a first pass band;
a second acoustic wave filter connected to the common terminal and having a second pass band located on a higher frequency side relative to the first pass band;
a second inductance element connected between a ground and a path that links the second end to the first acoustic wave filter; and
a capacitance element connected between the path and the ground; wherein
a resonant frequency of a resonance circuit including the second inductance element and the capacitance element is located between the first pass band and the second pass band.
2 . The multiplexer according to claim 1 , further comprising:
a third acoustic wave filter connected to the second end and having a third pass band located on a lower frequency side relative to the second pass band; wherein
resonant frequencies of the resonance circuit are located between the first pass band and the second pass band, and located between the third pass band and the second pass band.
3 . The multiplexer according to claim 2 , wherein the capacitance element is connected between the ground and a path that links a connecting point of the first acoustic wave filter and the third acoustic wave filter to the first acoustic wave filter.
4 . The multiplexer according to claim 1 , wherein the second inductance element and the capacitance element are connected in parallel between the path and the ground.
5 . The multiplexer according to claim 1 , wherein the capacitance element is an acoustic wave resonator.
6 . The multiplexer according to claim 5 , wherein
a resonance circuit including the second inductance element and the acoustic wave resonator has a first resonant frequency and a second resonant frequency;
the first resonant frequency corresponds to an anti-resonant frequency of the acoustic wave resonator;
the second resonant frequency corresponds to a resonant frequency of the acoustic wave resonator;
the first resonant frequency is located between the first pass band and the second pass band; and
the second resonant frequency is located on a lower frequency side relative to the first pass band.
7 . The multiplexer according to claim 1 , wherein the common terminal is connected to an antenna.
8 . The multiplexer according to claim 1 , wherein the first pass band and the second pass band are transmission bands in the Long Term Evolution standard.
9 . The multiplexer according to claim 1 , wherein each of the first inductance element and the second inductance element is a chip inductor, a conductor coil or a conductor wiring line.
10 . The multiplexer according to claim 1 , wherein the capacitance element is one of a chip capacitor, a conductor electrode, or a conductor wiring line.
11 . The multiplexer according to claim 1 , wherein each of the first acoustic wave filter and the second acoustic wave filter includes a piezoelectric substrate and comb-shaped electrodes on the piezoelectric substrate to define interdigital transducer electrodes.
12 . The multiplexer according to claim 11 , wherein each of the interdigital transducer electrodes includes a multilayer structure including a close contact layer and a main electrode layer.
13 . The multiplexer according to claim 12 , further comprising a protection layer on the main electrode layer.
14 . The multiplexer according to claim 11 , wherein the piezoelectric substrate includes a high acoustic velocity support substrate, a low acoustic velocity film, and a piezoelectric film.
15 . The multiplexer according to claim 1 , wherein each of the first acoustic wave filter and the second acoustic wave filter is a bulk acoustic wave filter operable to generate bulk acoustic waves.
16 . The multiplexer according to claim 1 , further comprising a matching circuit including an inductor and a capacitor, and a switch circuit.
17 . A communication device comprising the multiplexer according to claim 1 .
18 . The communication device according to claim 17 , wherein the communication device is a cellular phone.