Induction-assisted gluing system and method
An inductive gluing sheet is utilized in an induction-assisted adhesive activation method in which the inductive gluing sheet includes a heat-activated adhesive substrate and a conductive substrate embedded therein. When a magnetic field is applied to the conductive substrate through a first surface or a second surface covering the inductive gluing sheet, an electric current is induced in the conductive substrate. The heat created by the electric current transfers to the heat-activated adhesive substrate via conduction and activates the heat-activated adhesive substrate. This allows for direct heating of an adhesive layer through one or more objects and even allows for reversibility of the adhesion setting process.
1 . A method of induction heating of an adhesive layer, comprising:
placing a heat-activated adhesive substrate on a first surface, wherein the heat-activated adhesive substrate comprises a conductive substrate embedded therein, the conductive substrate comprising a continuously metallic structure;
placing a second surface on the heat-activated adhesive substrate;
energizing an induction coil to apply a time-varying magnetic field through the second surface and induce eddy currents in the conductive substrate, thereby heating the conductive substrate and activating the heat-activated adhesive substrate and causing the adhesive substrate to bond the first surface to the second surface;
sensing an electrical impedance of the induction coil; and
modulating at least one of a drive power or a frequency of the induction coil based on the sensed impedance to control heating of the conductive substrate.
2 . The method of claim 1 , wherein the heat-activated adhesive substrate comprises a semi-flexible adhesive.
3 . The method of claim 1 , wherein the conductive substrate is a thin metallic sheet.
4 . The method of claim 1 , wherein the conductive substrate is a porous metallic substrate.
5 . The method of claim 1 , wherein a geometry of the conductive substrate is configured to provide an uncoupling effect between the first surface and the second surface.
6 . The method of claim 1 , wherein after bonding, the first surface and the second surface are separable by energizing the induction coil to reheat the conductive substrate to reactivate the heat-activated adhesive substrate.