Granted Patent B2

US 12,656,544 · App. 18/324,576 · Granted Jun 16, 2026

Inventors: Chen-Hua Yu (Hsinchu, TW); Tsung-Fu Tsai (Changhua City, TW); Chih-Hao Yu (Tainan, TW); Jui Lin Chao (New Taipei City, TW); Szu-Wei Lu (Hsinchu, TW)

Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.

G02B6/12004G02B6/136G02B6/26G02B2006/12121

Abstract

Claims (33)

1 . A method, comprising:

connecting a first photonic package to a substrate, wherein the first photonic package comprises a first waveguide and a first support over the first waveguide, wherein connecting the first photonic package to the substrate comprises attaching the first photonic package to conductive features of the substrate using solder bumps;

connecting a second photonic package to the substrate adjacent the first photonic package, wherein the second photonic package comprises a second waveguide, wherein the first photonic package and the second photonic package are laterally separated by a gap that has a width in the range of 15 μm to 190 μm;

depositing a first quantity of an optical adhesive into the gap; and

curing the first quantity of the optical adhesive, wherein after curing the first quantity of the optical adhesive, the first waveguide is optically coupled to the second waveguide through the first quantity of the optical adhesive, wherein the solder bumps and the conductive features are free of the optical adhesive.

2 . The method of claim 1 , wherein the first support comprises a first recess in a first sidewall of the first support, wherein the first recess extends from a top surface of the first support toward a bottom surface of the first support, wherein the gap comprises the first recess.

3 . The method of claim 2 , wherein the first support comprises a second recess in a second sidewall of the first support.

4 . The method of claim 1 , wherein after curing the first quantity of the optical adhesive, a top surface of the first support is free of the optical adhesive.

5 . The method of claim 1 , wherein the second photonic package comprises a second support over the second waveguide, wherein the second support comprises a third recess in a third sidewall of the second support, wherein the gap comprises the third recess.

6 . The method of claim 1 , wherein the first quantity of optical adhesive is deposited onto a previously-deposited second quantity of the optical adhesive.

7 . The method of claim 1 , wherein, after curing the first quantity of the optical adhesive, the optical adhesive extends on a bottom surface of the first photonic package.

8 . The method of claim 1 , wherein the first waveguide is optically coupled to the second waveguide by an edge coupler.

9 . A system, comprising:

a first photonic package attached to an interconnect structure, wherein the first photonic package comprises a first waveguide adjacent a first sidewall of the first photonic package;

a second photonic package attached to the interconnect structure, wherein the second photonic package comprises a second waveguide adjacent a second sidewall of the second photonic package, wherein the second sidewall faces the first sidewall; and

a glue stack on a top surface of the interconnect structure, wherein the glue stack comprises a plurality of layers of cured optical glue, wherein the glue stack extends from the first sidewall to the second sidewall, wherein the first waveguide is optically coupled to the second waveguide through the glue stack.

10 . The system of claim 9 , wherein a height of the glue stack above the interconnect structure is greater than a height of the first waveguide above the interconnect structure.

11 . The system of claim 9 , wherein the second photonic package comprises a laser diode that is optically coupled to the second waveguide.

12 . The system of claim 9 , wherein a width of the glue stack on the top surface of the interconnect structure is greater than a width between the first sidewall and the second sidewall.

13 . The system of claim 9 , wherein the first photonic package is attached to the interconnect structure by a plurality of solder bumps, wherein each solder bump is separated from the glue stack.

14 . A method comprising:

attaching a first photonic package to a substrate, wherein the first photonic package comprises a first edge coupler;

attaching a second photonic package to the substrate, wherein the second photonic package comprises a second edge coupler, wherein the first photonic package is separated from the second photonic package by a gap;

depositing a first amount of optical glue into the gap;

performing a first curing process on the first amount of optical glue to form a first optical glue layer on the substrate;

depositing a second amount of optical glue into the gap; and

performing a second curing process on the second amount of optical glue to form a second optical glue layer in the gap over the first optical glue layer, wherein the first edge coupler is optically coupled to the second edge coupler through the second optical glue layer.

15 . The method of claim 14 , wherein the first curing process is a UV curing process.

16 . The method of claim 14 , wherein the second optical glue layer extends from a sidewall of the first photonic package to a sidewall of the second photonic package.

17 . The method of claim 14 further comprising forming a plurality of optical glue layers between the first optical glue layer and the second optical glue layer.

18 . The method of claim 14 , wherein the first photonic package comprises a first support and the second photonic package comprises a second support, wherein a width between a sidewall of the first support and a sidewall of the second support is greater than a width of the gap.

19 . The method of claim 14 , wherein the first photonic package is attached to the substrate by conductive connectors, wherein the conductive connectors are free of the first optical glue layer.

20 . The method of claim 1 , wherein the first quantity of the optical adhesive is separated from the substrate.

Assignments (1)

Continuity (2)

References Cited (36)