Capacitor module having a bus bar with a portion thereof in a sealing resin
A capacitor module that includes: a case defining an interior space; a sealing resin in the interior space; one or more capacitors in the sealing resin; a first bus bar and a second bus bar each having a contact portion that is in contact with an electrode of the one or more capacitors, a buried portion in the sealing resin and extending from the contact portion, and an exposed portion that extends from the first buried portion outside the sealing resin, wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are filled with the sealing resin or include one or more protrusions surrounded by the sealing resin.
1 . A capacitor module comprising:
a case defining an interior space and having an opening at a position opposed to a bottom surface thereof;
a sealing resin in the interior space of the case;
one or more capacitors in the sealing resin in the interior space of the case, each of the one or more capacitors having a first electrode and a second electrode;
a first bus bar having a first contact portion that is in contact with the first electrode of the one or more capacitors, a first buried portion in the sealing resin and extending from the first contact portion, and a first exposed portion that extends from the first buried portion outside the sealing resin; and
a second bus bar having a second contact portion that is in contact with the second electrode of the one or more capacitors, a second buried portion in the sealing resin and extending from the second contact portion, and a second exposed portion that extends from the second buried portion outside the sealing resin,
wherein at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion define one or more through holes that are completely filled with the sealing resin or include one or more protrusions having a periphery completely surrounded by the sealing resin,
wherein the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion including the one or more through holes or the one or more protrusions extends in a direction from the bottom surface of the case toward the opening,
wherein the one or more through holes or the one or more protrusions extend in a direction parallel to the opening of the case, and
wherein at least one of the first exposed portion and the second exposed portion extends in the direction parallel to the opening of the case, and extends over the one or more capacitor elements with the sealing resin therebetween.
2 . The capacitor module according to claim 1 , wherein the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion include the one or more through holes.
3 . The capacitor module according to claim 1 , wherein the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion include the one or more protrusions.
4 . The capacitor module according to claim 3 , wherein a first protrusion of the one or more protrusions is a bent end portion of the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion.
5 . The capacitor module according to claim 4 , wherein the one or more protrusions includes a second protrusion extending in a width direction from the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion.
6 . The capacitor module according to claim 1 , wherein the at least one of the first contact portion, the second contact portion, the first buried portion, and the second buried portion includes at least one of the through holes or the protrusions for each of the one or more capacitors.
7 . The capacitor module according to claim 1 , wherein the first buried portion and the second buried portion each include a through hole of the one or more through holes.
8 . The capacitor module according to claim 1 , wherein the first buried portion includes the one or more through holes.
9 . The capacitor module according to claim 1 , wherein the first contact portion and the second contact portion each include a through hole of the one or more through holes.
10 . The capacitor module according to claim 1 , wherein the first buried portion and the second buried portion each include a protrusion of the one or more protrusions.
11 . The capacitor module according to claim 10 , wherein a first protrusion of the one or more protrusions is a bent end portion of the first buried portion, and a second protrusion of the one or more protrusions is a bent end portion of the second buried portion.
12 . The capacitor module according to claim 11 , wherein the one or more protrusions includes a third protrusion extending in a width direction from the first buried portion, and a fourth protrusion extending in a width direction from the second buried portion.