Granted Patent B2

US 12,658,596 · App. 18/832,373 · Granted Jun 16, 2026

Inventors: Nathan McKay Monroe (Cambridge, MA); Ruonan Han (Winchester, MA)

Assignee: Massachusetts Institute of Technology

H01Q15/22H01Q15/24H01Q21/065

Abstract

Claims (80)

1 . A semiconductor device, comprising:

a semiconductor substrate; and

a plurality of metal layers, including a top metal layer which is exposed;

wherein the top metal layer is formed as a plurality of patch antennas, wherein each patch antenna is a rectangle having two sets of parallel sides and comprises three contact points, a first contact point (P 1 ); a second contact point (P 2 ) disposed at a midpoint of a first side; and a third contact point (P 3 ) disposed at a midpoint of a second side, opposite the first side, and wherein the first contact point (P 1 ) is disposed at a midpoint of a side that is perpendicular to the first side and the second side; and wherein a plurality of storage elements and a one bit phase shifter is disposed in the semiconductor substrate beneath each respective patch antenna, wherein the plurality of storage elements stores a plurality of phase states that are supplied to the one bit phase shifter, and wherein the one bit phase shifter comprises two field effect transistors (FETs), wherein a first transistor includes a gate and a source and a drain, wherein one of the source or drain is in electrical contact with the first contact point (P 1 ) and the other of the source or drain is in electrical contact with the second contact point (P 2 ) and the gate is in electrical contact with a control signal provided by the storage elements; and wherein a second transistor includes a gate and a source and a drain, wherein one of the source or drain is in electrical contact with the first contact point (P 1 ) and the other of the source or drain is in electrical contact with the third contact point (P 3 ) and the gate is in electrical contact with a signal that is a complement of the control signal.

2 . The semiconductor device of claim 1 , wherein the plurality of storage elements disposed beneath each respective patch antenna contains at least 1000 phase states.

3 . The semiconductor device of claim 1 , wherein the plurality of patch antennas are arranged as a grid having a first number of rows and a second number of columns.

4 . The semiconductor device of claim 1 , wherein each storage element of the plurality of storage elements comprises a shift register.

5 . The semiconductor device of claim 4 , wherein the semiconductor device has two modes: a load mode wherein all shift registers in the semiconductor device are arranged in series and data are loaded sequentially into all shift registers, and a cyclic mode wherein an output of each shift register is provided to an input of that shift register.

6 . The semiconductor device of claim 1 , wherein the plurality of storage elements comprises a random access memory (RAM).

7 . A reflectarray comprising a plurality of the semiconductor devices of claim 1 , arranged in a tiled array.

8 . The reflectarray of claim 7 , wherein a spacing between two adjacent patch antennas disposed on a same semiconductor device is within 20% of a spacing between two adjacent patch antennas disposed on different semiconductor devices.

9 . The reflectarray of claim 7 , wherein the plurality of semiconductor devices are soldered onto a printed circuit board and wire bonding is used to connect signals between adjacent semiconductor devices.

10 . The reflectarray of claim 9 , wherein some of the signals are duplicated such that isolated wirebond open circuits have no impact on operation.

11 . A terahertz imaging system, comprising:

the reflectarray of claim 9 ;

a transceiver, comprising a transmitter, a directional coupler, a mixer and a receiver; and

a waveguide;

wherein terahertz waves generated by the transmitter are transmitted through the directional coupler and through the waveguide to an opening at a distal end of the waveguide, where the terahertz waves are directed toward the reflectarray; and wherein waves reflected from an object are focused toward the distal end of the waveguide by the reflectarray, and travel through the waveguide, the directional coupler and the mixer before reaching the receiver.

12 . A method of performing a sweep over a frequency range using the terahertz imaging system of claim 11 , comprising:

computing a phase state for each patch antenna in the reflectarray at a plurality of frequencies within the frequency range;

storing the computed phase states in the storage elements associated with each respective patch antenna;

using the transmitter to transmit a plurality of frequencies in the frequency range; and

changing the phase state provided to each patch antenna to accommodate the frequency transmitted by the transmitter.

13 . A method of reducing sidelobes associated with quantization error using the terahertz imaging system of claim 11 , comprising:

calculating a first set of phase values for each patch antenna in the reflectarray, based on frequency;

quantizing the first set of phase values to obtain a first set of phase states;

adding a constant phase offset to each phase value in the first set of phase values to generate a second set of phase values;

quantizing the second set of phase values to obtain a second set of phase states;

using the first set of phase states during a first integration;

using the second set of phase states during a second integration; and

summing or averaging results from the integrations.

14 . The method of claim 13 , further comprising:

adding the constant phase offset to each phase value in the second set of phase values to generate a third set of phase values;

quantizing the third set of phase values to obtain a third set of phase states;

adding the constant phase offset to each phase value in the third set of phase values to generate a fourth set of phase values;

quantizing the fourth set of phase values to obtain a fourth set of phase states;

using the third set of phase states during a third integration;

using the fourth set of phase states during a fourth integration; and

including the third integration and fourth integration in the summing or averaging.

15 . A method of reducing reflections associated with passive structures using the terahertz imaging system of claim 11 , comprising:

calculating a first set of phase states for each patch antenna in the reflectarray;

performing a first integration using the first set of phase states;

inverting each phase state in the first set of phase states to create a second set of phase states for each patch antenna in the reflectarray;

performing a second integration using the second set of phase states; and

subtracting results of the second integration from results of the first integration, so that reflections associated with passive structures are cancelled.

16 . A terahertz imaging system, comprising:

a reflectarray comprising a plurality of semiconductor devices, arranged in a tiled array, wherein each semiconductor device comprises:

a semiconductor substrate; and

a plurality of metal layers, including a top metal layer which is exposed;

wherein the top metal layer is formed as a plurality of patch antennas, and wherein a plurality of storage elements and a one bit phase shifter is disposed in the semiconductor substrate beneath each respective patch antenna, wherein the plurality of storage elements stores a plurality of phase states that are supplied to the one bit phase shifter;

a transceiver, comprising a transmitter, a directional coupler, a mixer and a receiver; and

a waveguide;

wherein terahertz waves generated by the transmitter are transmitted through the directional coupler and through the waveguide to an opening at a distal end of the waveguide, where the terahertz waves are directed toward the reflectarray; and wherein waves reflected from an object are focused toward the distal end of the waveguide by the reflectarray, and travel through the waveguide, the directional coupler and the mixer before reaching the receiver.

17 . A method of performing a sweep over a frequency range using the terahertz imaging system of claim 16 , comprising:

computing a phase state for each patch antenna in the reflectarray at a plurality of frequencies within the frequency range;

storing the computed phase states in the storage elements associated with each respective patch antenna;

using the transmitter to transmit a plurality of frequencies in the frequency range; and

changing the phase state provided to each patch antenna to accommodate the frequency transmitted by the transmitter.

18 . A method of reducing sidelobes associated with quantization error using the terahertz imaging system of claim 16 , comprising:

calculating a first set of phase values for each patch antenna in the reflectarray, based on frequency;

quantizing the first set of phase values to obtain a first set of phase states;

adding a constant phase offset to each phase value in the first set of phase values to generate a second set of phase values;

quantizing the second set of phase values to obtain a second set of phase states;

using the first set of phase states during a first integration;

using the second set of phase states during a second integration; and

summing or averaging results from the integrations.

19 . The method of claim 18 , further comprising:

adding the constant phase offset to each phase value in the second set of phase values to generate a third set of phase values;

quantizing the third set of phase values to obtain a third set of phase states;

adding the constant phase offset to each phase value in the third set of phase values to generate a fourth set of phase values;

quantizing the fourth set of phase values to obtain a fourth set of phase states;

using the third set of phase states during a third integration;

using the fourth set of phase states during a fourth integration; and

including the third integration and fourth integration in the summing or averaging.

20 . A method of reducing reflections associated with passive structures using the terahertz imaging system of claim 16 , comprising:

calculating a first set of phase states for each patch antenna in the reflectarray;

performing a first integration using the first set of phase states;

inverting each phase state in the first set of phase states to create a second set of phase states for each patch antenna in the reflectarray;

performing a second integration using the second set of phase states; and

subtracting results of the second integration from results of the first integration, so that reflections associated with passive structures are cancelled.

Assignments (1)

Continuity (2)

References Cited (25)