IP Library › Granted Patent US 12,658,962
Granted Patent B2
US 12,658,962 · App. 18/470,694 · Granted Jun 16, 2026

Wearable device and communication method thereof

Inventors: Chun-Yih Wu (Taoyuan City, TW); Ta-Chun Pu (Taoyuan City, TW); Yen-Liang Kuo (Taoyuan City, TW)
Assignee: HTC Corporation
H04B1/385H04B1/40H04B2001/3861
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Quick Facts
Patent No.
US 12,658,962
App. No.
18/470,694
Granted
Jun 16, 2026
Kind
B2
Abstract

A wearable device includes a carrier element, a wearable element, a SIP (System-In-Package) IC (Integrated Circuit), a first antenna element, and a second antenna element. The wearable element is connected to the carrier element. The SIP IC includes a first transceiver and a second transceiver. The SIP IC is disposed on the carrier element. The first antenna element is coupled to the first transceiver. The first antenna element is integrated with the SIP IC. The second antenna element is coupled to the second transceiver. The second antenna element is integrated with the carrier element.

Claims (40)

1 . A wearable device, comprising:

a carrier element;

a wearable element, connected to the carrier element;

a SIP (System-In-Package) IC (Integrated Circuit), comprising a first transceiver, a second transceiver, and a third transceiver, wherein the SIP IC is disposed on the carrier element;

a first antenna element, coupled to the first transceiver, wherein the first antenna element is integrated with the SIP IC;

a second antenna element, coupled to the second transceiver, wherein the second antenna element is integrated with the carrier element; and

a third antenna element, coupled to the third transceiver, wherein the third antenna element is integrated with the wearable element;

wherein the third antenna element comprises a first radiation metal piece and a second radiation metal piece, and the SIP IC is positioned between the first radiation metal piece and the second radiation metal piece;

wherein the first antenna element comprises an antenna array disposed on a top of the SIP IC; and

wherein the antenna array is in contact with the SIP IC.

2 . The wearable device as claimed in claim 1 , wherein the wearable device is a smart ring with a communication function.

3 . The wearable device as claimed in claim 1 , wherein the carrier element is a ring platform element.

4 . The wearable device as claimed in claim 1 , wherein the carrier element is made of a metal material.

5 . The wearable device as claimed in claim 1 , wherein the wearable element is a ring support element.

6 . The wearable device as claimed in claim 1 , wherein the wearable element is made of a metal material or a non-metal material.

7 . The wearable device as claimed in claim 1 , wherein the SIP IC is implemented with a multilayer circuit board.

8 . The wearable device as claimed in claim 1 , wherein the first antenna element covers a first frequency band, and the first frequency band is from 60 GHz to 500 GHz.

9 . The wearable device as claimed in claim 1 , wherein the second antenna element covers a second frequency band, and the second frequency band is from 300 GHz to 500 GHz.

10 . The wearable device as claimed in claim 9 , wherein the second antenna element comprises:

a radar waveguide array, formed in the carrier element.

11 . The wearable device as claimed in claim 10 , wherein the radar waveguide array comprises a plurality of waveguides parallel with each other.

12 . The wearable device as claimed in claim 11 , wherein a distance between any two adjacent waveguides is from 0.5 to 0.8 wavelength of the second frequency band.

13 . The wearable device as claimed in claim 1 , wherein the SIP IC further comprises a processor.

14 . The wearable device as claimed in claim 13 , wherein the second antenna element receives a sense signal, the processor generates a notification signal according to the sense signal, and the first antenna element transmits the notification signal outwardly.

15 . The wearable device as claimed in claim 1 , wherein the third antenna element covers an NFC (Near Field Communication) frequency band.

16 . The wearable device as claimed in claim 1 , wherein the third antenna element comprises:

a radiation coil, disposed in the wearable element.

17 . The wearable device as claimed in claim 1 , wherein the antenna array comprises a plurality of antenna units, and the antenna units are arranged to form a square shape.

18 . The wearable device as claimed in claim 17 , wherein a total number of the antenna units is a perfect square number.

19 . A communication method, comprising the steps of:

providing a wearable device, wherein the wearable device comprises a carrier element, a wearable element, a SIP IC, a first antenna element, a second antenna element, and a third antenna element, wherein the wearable element is connected to the carrier element, wherein the SIP IC comprises a first transceiver, a second transceiver, and a third transceiver, and wherein the SIP IC is disposed on the carrier element;

coupling the first antenna element to the first transceiver;

integrating the first antenna element with the SIP IC;

coupling the second antenna element to the second transceiver;

integrating the second antenna element with the carrier element;

coupling the third antenna element to the third transceiver; and

integrating the third antenna element with the wearable element;

wherein the third antenna element comprises a first radiation metal piece and a second radiation metal piece, and the SIP IC is positioned between the first radiation metal piece and the second radiation metal piece;

wherein the first antenna element comprises an antenna array disposed on a top of the SIP IC; and

wherein the antenna array is in contact with the SIP IC.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2023
From: WU, CHUN-YIH; PU, TA-CHUN; KUO, YEN-LIANG
To: HTC CORPORATION
Reel/Frame 064986/0810 →
Priority Claims (1)
TW 112129097 · Aug 2, 2023 · national
Continuity (1)
Related Publication 20250047316A1 · Feb 6, 2025
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