Cooling system
View Patent ↗A cooling system includes a first liquid cooling plate, a second liquid cooling plate, a communication structure, a first thermosiphon device, and a second thermosiphon device. The communication structure is disposed between the first liquid cooling plate and the second liquid cooling plate, and connects flow channels in the first liquid cooling plate and the second liquid cooling plate. The first thermosiphon device and the second thermosiphon device are both thermally coupled to the first liquid cooling plate and the second liquid cooling plate. The first thermosiphon device and the second thermosiphon device are located on opposite sides of the communication structure and between the first liquid cooling plate and the second liquid cooling plate.
1 . A cooling system, comprising:
a first liquid cooling plate, the first liquid cooling plate having a first left side flow channel, a first right side flow channel, a first inlet, and a first outlet, the first left side flow channel being connected to the first inlet and the first outlet, the first right side flow channel being connected to the first inlet and the first outlet;
a second liquid cooling plate, the second liquid cooling plate having a second left side flow channel, a second right side flow channel, a second inlet, and a second outlet, the second left side flow channel being connected to the second inlet and the second outlet, the second right side flow channel being connected to the second inlet and the second outlet;
a communication structure, the communication structure being disposed between the first liquid cooling plate and the second liquid cooling plate and connecting the first outlet and the second inlet;
a first thermosiphon device, the first thermosiphon device being located between the first left side flow channel and the second left side flow channel and being thermally coupled to the first liquid cooling plate and the second liquid cooling plate; and
a second thermosiphon device, the second thermosiphon device being located between the first right side flow channel and the second right side flow channel and being thermally coupled to the first liquid cooling plate and the second liquid cooling plate, the first thermosiphon device and the second thermosiphon device being located on opposite sides of the communication structure.
2 . The cooling system according to claim 1 , wherein the communication structure is located inside the first liquid cooling plate and the second liquid cooling plate.
3 . The cooling system according to claim 1 , wherein the communication structure has a connecting flow channel, and the connecting flow channel extends parallel to the first liquid cooling plate and the second liquid cooling plate.
4 . The cooling system according to claim 1 , wherein the second liquid cooling plate is located above the first liquid cooling plate in a direction of gravity.
5 . The cooling system according to claim 1 , wherein the first left side flow channel and the first right side flow channel are both a U-shaped flow channel.
6 . The cooling system according to claim 5 , wherein the first left side flow channel comprises two sections in sequence, and a flow resistance of the first left side flow channel between the two sections is less than a flow resistance of either of the two sections.
7 . The cooling system according to claim 6 , wherein the first left side flow channel comprises a cavity section between the two sections, there are fins in the two sections, and there is no fin in the cavity section.
8 . The cooling system according to claim 1 , wherein the first left side flow channel and the first right side flow channel are symmetrical in structure.
9 . The cooling system according to claim 1 , wherein two sheets are disposed in the first left side flow channel, each sheet is bent to form a plurality of channels which extends parallel to a flow direction of the first left side flow channel, the two sheets are adjacently arranged in the flow direction, and the channels of the two sheet are misaligned.
10 . The cooling system according to claim 1 , wherein the first thermosiphon device comprises a condenser, an evaporator, and two transfer tubes, each transfer tube is connected to the condenser and the evaporator, and the first thermosiphon device is thermally coupled to the first liquid cooling plate and the second liquid cooling plate through the condenser.