Pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display
The present disclosure relates to a pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, including a nozzle having a capillary form and having a nozzle tip that is smaller than a top size area of the micro LED chip; a pressure adjustment part that applies negative pressure inside the nozzle to adsorb the micro LED chip to the nozzle tip and applies positive pressure inside the nozzle or removes the negative pressure inside the nozzle to mount the micro LED chip adsorbed to the nozzle tip onto a repair pixel; an imaging part that monitors a position and posture of the micro LED chip adsorbed to the nozzle tip in real time; a moving part that moves the nozzle; and a control part that receives image information from the imaging part, and mounts the micro LED chip onto a repair pixel while controlling the pressure adjustment part and the moving part.
1 . A pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, comprising:
a nozzle having a capillary form and having a nozzle tip that is smaller than a top size area of the micro LED chip;
a pressure adjustment part that applies negative pressure inside the nozzle to adsorb the micro LED chip to the nozzle tip and applies positive pressure inside the nozzle or removes the negative pressure inside the nozzle to mount the micro LED chip adsorbed to the nozzle tip onto a repair pixel;
an imaging part that monitors a position and posture of the micro LED chip adsorbed to the nozzle tip in real time;
a moving part that moves the nozzle;
a control part that receives image information from the imaging part, and mounts the micro LED chip onto the repair pixel while controlling the pressure adjustment part and the moving part; and
a pressing force measurement part that measures a force pressing to the nozzle in order to mount the micro LED chip onto the repair pixel;
wherein the pressing force measurement part measures a bent degree of the nozzle and measures the pressing force based on the measured bent degree of the nozzle.
2 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein an end portion of the nozzle is formed such that its diameter gradually decreases.
3 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the nozzle is formed of any one of glass, metal tube, ceramic, and polymer.
4 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the nozzle tip is coated with a flexible material.
5 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 4 ,
wherein the flexible material is PDMS.
6 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
further comprising a cleaning part that cleans the nozzle tip.
7 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
further comprising an ionizer that removes static electricity from the nozzle tip.
8 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein a face of the nozzle tip of the nozzle disposed to be inclined is processed horizontally on the xy plane.
9 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the nozzle is disposed to be inclined with respect to a substrate, but one intermediate part of the nozzle has a bent form such that an end portion of the nozzle faces the substrate.
10 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 9 ,
wherein the imaging part comprises a first imaging part that obtains an image of the micro LED chip adsorbed to the nozzle tip, in a vertically downward direction from above the nozzle tip, and that monitors the position and posture of the micro LED chip on an xy plane; and
a second imaging part that obtains the image of the micro LED chip adsorbed to the nozzle tip in a horizontal direction, and that monitors the position and posture of the micro LED chip in a z axis direction.
11 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the pressing force measurement part comprises a light emitting part that irradiates light towards the nozzle;
a light receiving part that receives the light reflected from the nozzle; and
a determining part that analyzes a signal of the light received in the light receiving part and measures the bent degree of the nozzle.
12 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the moving part comprises a transfer part that transfers the nozzle in space; and
a posture change part that changes a posture of the nozzle in order to change the posture of the micro LED chip adsorbed to the nozzle tip.
13 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the nozzle is disposed vertically downward towards a substrate, and
the imaging part comprises at least one or more first imaging part disposed at one side of the nozzle, that obtains an image of the micro LED chip adsorbed to the nozzle tip, in a direction inclined with respect to a vertically downward direction, and that monitors the position and posture of the micro LED chip on an xy plane; and
a second imaging part that obtains the image of the micro LED chip adsorbed to the nozzle tip in a horizontal direction, and monitors the position and posture of the micro LED chip in a z axis direction.
14 . The pick-and-place apparatus of micro LED chip for chip-repairing of micro LED display, according to claim 1 ,
wherein the nozzle is disposed to be inclined with respect to a substrate, and
the imaging part comprises a first imaging part that obtains an image of the micro LED chip adsorbed to the nozzle tip, in a vertically downward direction from above the nozzle tip, and that monitors the position and posture of the micro LED chip on an xy plane; and
a second imaging part that obtains the image of the micro LED chip adsorbed to the nozzle tip in a horizontal direction, and monitors the position and posture of the micro LED chip in a z axis direction.