Security wire over stitch bond
An electronic device includes a package structure, a conductive terminal exposed outside the package structure, a semiconductor die in the package structure, and a bond wire having contiguous first and second portions. The first portion has a first end and a second end, the first end connected to the semiconductor die by a first bond and the second end connected to the conductive terminal by a second bond. The second portion has a first end and a second end, the first end of the second portion connected to the second end of the first portion, and the second end of the second portion connected to the conductive terminal by a third bond.
1 . An electronic device, comprising:
a package structure;
a conductive terminal exposed outside the package structure;
a semiconductor die in the package structure; and
a bond wire enclosed by the package structure and having contiguous first and second portions, the first portion having a first end and a second end, the first end of the first portion connected to the semiconductor die by a first bond, the second end of the first portion connected to the conductive terminal by a second bond, the second portion having a first end and a second end, the first end of the second portion connected to the second end of the first portion, and the second end of the second portion connected to the conductive terminal by a third bond, wherein a loop formed by the second portion encircles a gap and the gap becomes narrower towards the third bond.
2 . The electronic device of claim 1 , wherein the third bond extends on the second end of the first portion.
3 . The electronic device of claim 1 , wherein the second bond is a stitch bond or a wedge bond.
4 . The electronic device of claim 1 , wherein the first bond is a ball bond.
5 . The electronic device of claim 1 , wherein the third bond is a stitch bond.
6 . The electronic device of claim 1 , wherein the third bond is spaced apart from the second end of the first portion.
7 . The electronic device of claim 6 , wherein the second bond is a stitch bond or a wedge bond.
8 . The electronic device of claim 7 , wherein the third bond is a stitch bond.
9 . The electronic device of claim 6 , wherein the first bond is a ball bond.
10 . The electronic device of claim 6 , wherein the third bond is a stitch bond.
11 . The electronic device of claim 1 , further comprising a die attach pad attached to the semiconductor die.
12 . The electronic device of claim 1 , wherein the second bond is in contact with the third bond.
13 . The electronic device of claim 1 , wherein the first end of the second portion is in contact with the second end of the second portion.
14 . The electronic device of claim 1 , wherein the second portion is configured to improve connection strength between the bond wire and the conductive terminal.