Embedded magnetic component device including vented channels and multilayer windings
A device includes an insulating substrate including a cavity and a magnetic core in the cavity. The insulating substrate includes a first opening and a second opening that connect the cavity to an exterior of the insulated substrate. The first opening and the second opening are provided on a same side of the magnetic core.
1 . An embedded magnetic component device comprising:
an insulating substrate including a side node located on an edge of the insulating substrate and including a cavity; and
a magnetic core in the cavity, wherein
the insulating substrate includes a first opening and a second opening that connect the cavity to an exterior of the insulated substrate, and
the first opening and the second opening are provided on a same side of the magnetic core.
2 . The embedded magnetic component device of claim 1 , wherein the first opening and the second opening are provided along a same edge of the insulating substrate.
3 . The embedded magnetic component device of claim 1 , wherein the side node includes an electrically conductive material.
4 . The embedded magnetic component device of claim 1 , wherein a cover is disposed over a first end of the side node.
5 . The embedded magnetic component device of claim 1 , further comprising an encapsulant provided on the insulating substrate.
6 . A method of manufacturing an embedded magnetic component device, the method comprising:
forming a cavity in an insulating substrate;
forming a first channel between the cavity and a first edge of the insulating substrate;
forming a second channel between the cavity and the first edge of the insulating substrate;
installing a magnetic core in the cavity;
forming an electrically conductive hole in the insulating substrate;
forming a cover on the insulating substrate that covers the electrically conductive hole; and
cutting the insulating substrate and the cover along a line that passes through the electrically conductive hole.