IP Library Granted Patent US 12,699,666
Granted Patent B2
US 12,699,666 · App. 18/044,257 · Granted Aug 4, 2026

Hybrid bus communication circuit

Inventors: Nadim Khlat (Cugnaux, FR); Christopher Truong Ngo (Queen Creek, AZ); Alexander Wayne Hietala (Phoenix, AZ)
Assignee: Qorvo US, Inc.
G06F13/362G06F13/4282H04L12/40195
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Quick Facts
Patent No.
US 12,699,666
App. No.
18/044,257
Filed
Mar 7, 2023
Granted
Aug 4, 2026
Kind
B2
Art Unit
2184
USPC
710/110
Abstract

A hybrid bus communication circuit is provided. The hybrid bus communication circuit includes at least two different types of communication buses. The hybrid bus communication circuit also includes a hybrid bridge circuit and several multi-bus slave circuits each coupled to the two different types of communication buses. In a non-limiting example, each of the multi-bus slave circuits may communicate timing critical information via a first type communication bus and non-timing critical information via a second type communication bus. The hybrid bridge circuit is configured to receive a configuration command via the first type communication bus and, accordingly, configure a configuration parameter(s) in any of the multi-bus slave circuits via the second type communication bus. As such, it is possible to make time constrained configuration changes in any of the multi-bus slave circuits without interfering with the timing critical communication conducted via the first type communication bus.

Claims (54)

1 . A hybrid bus communication circuit comprising:

a first type communication bus comprising multiple wires and configured to carry timing critical information;

a second type communication bus and a third type communication bus each consisting of a single wire and having a slower data rate than the first type communication bus, wherein the second type communication bus is configured to carry timing constrained information less time-sensitive than the timing critical information and the third type communication bus is configured to carry non-timing critical information less time-sensitive than the timing constrained information;

a master circuit coupled exclusively to the first type communication bus;

a hybrid bridge circuit coupled to the first type communication bus, the second type communication bus, and the third type communication bus; and

a plurality of multi-bus slave circuits each coupled to the master circuit via the first type communication bus and coupled to the hybrid bridge circuit via the second type communication bus;

a plurality of single-bus slave circuits coupled to the hybrid bridge circuit via the third type communication bus; and

wherein the hybrid bridge circuit and each of the plurality of multi-bus slave circuits can initiate communication over the second type communication bus via a bus contention mechanism and the hybrid bridge circuit is configured to:

receive a configuration command from the master circuit via the first type communication bus;

determine one or more configuration parameters based on the received configuration command; and

configure the determined one or more configuration parameters in at least one selected multi-bus slave circuit among the plurality of multi-bus slave circuits via the second type communication bus.

2 . The hybrid bus communication circuit of claim 1 , wherein the master circuit is configured to:

provide the configuration command to the hybrid bridge circuit via the first type communication bus to thereby cause the hybrid bridge circuit to configure the determined one or more configuration parameters in the at least one selected multi-bus slave circuit; and

provide an action command to the at least one selected multi-bus slave circuit via the second type communication bus to thereby cause the at least one selected multi-bus slave circuit to perform a defined action based on the one or more configuration parameters.

3 . The hybrid bus communication circuit of claim 2 , wherein the master circuit further provides the action command to the at least one selected multi-bus slave circuit after a predetermined delay from providing the configuration command to the hybrid bridge circuit such that the hybrid bridge circuit can configure the one or more configuration parameters in the at least one selected multi-bus slave circuit prior to the at least one selected multi-bus slave circuit receiving the action command.

4 . The hybrid bus communication circuit of claim 1 , wherein the plurality of multi-bus slave circuits each comprises a plurality of registers each comprising a plurality of bits.

5 . The hybrid bus communication circuit of claim 4 , wherein the hybrid bridge circuit is further configured to write the one or more configuration parameters into one or more of the plurality of bits in one or more of the plurality of registers comprised in the at least one selected multi-bus slave circuit.

6 . The hybrid bus communication circuit of claim 5 , wherein the master circuit is further configured to write one or more second configuration parameters directly into one or more the plurality of bits in one or more of the plurality of registers in any of the plurality of multi-bus slave circuits.

7 . The hybrid bus communication circuit of claim 6 , wherein the master circuit and the hybrid bridge circuit are configured not to write concurrently into an identical one of the plurality of bits in an identical one of the plurality of registers comprised in an identical one of the plurality of multi-bus slave circuits.

8 . The hybrid bus communication circuit of claim 1 , wherein the hybrid bridge circuit comprises a control circuit configured to:

receive the configuration command via the first type communication bus;

determine the one or more configuration parameters based on the received configuration command; and

configure the determined one or more configuration parameters in the at least one selected multi-bus slave circuit among the plurality of multi-bus slave circuits via the second type communication bus.

9 . The hybrid bus communication circuit of claim 8 , wherein the hybrid bridge circuit further comprises a memory circuit configured to store one or more lookup tables (LUTs) each predetermined to correlate a respective configuration command with one or more respective configuration parameters.

10 . The hybrid bus communication circuit of claim 9 , wherein the control circuit is further configured to:

determine a selected one of the one or more LUTs having the respective configuration command matching the received configuration command; and

determine the one or more configuration parameters as being the one or more respective configuration parameters corresponding to the selected one of the one or more LUTs.

11 . The hybrid bus communication circuit of claim 1 , wherein:

the first type communication bus is a multi-wire serial bus comprising a radio frequency front-end (RFFE) bus;

the second type communication bus is a single-wire peer-to-peer bus; and

the third type communication bus is a single-wire serial bus (SuBUS).

12 . The hybrid bus communication circuit of claim 1 , wherein the hybrid bridge circuit comprises:

a multi-wire serial bus interface circuit coupled to the first type communication bus;

a single-wire peer-to-peer bus interface circuit coupled to the second type communication bus; and

a single-wire serial bus interface circuit coupled to the third type communication bus.

13 . The hybrid bus communication circuit of claim 1 , wherein each of the hybrid bridge circuit and the plurality of multi-bus slave circuits is configured to communicate exclusively with the master circuit via the first type communication bus.

14 . The hybrid bus communication circuit of claim 1 , wherein each of the hybrid bridge circuit and the plurality of multi-bus slave circuits is configured to communicate directly with one another via the second type communication bus, independent of the master circuit.

15 . The hybrid bus communication circuit of claim 14 , wherein each of the hybrid bridge circuit and the plurality of multi-bus slave circuits is preassigned a respective access priority for accessing the second type communication bus.

16 . The hybrid bus communication circuit of claim 15 , wherein the hybrid bridge circuit is preassigned with a highest access priority.

17 . The hybrid bus communication circuit of claim 1 , wherein:

each of the plurality of single-bus slave circuits is configured to communicate exclusively with the hybrid bridge circuit via the third type communication bus; and

the hybrid bridge circuit is further configured to bridge communications between the master circuit and the plurality of single-bus slave circuits.

18 . The hybrid bus communication circuit of claim 17 , wherein the plurality of single-bus slave circuits is each configured to draw power from the master circuit via the third type communication bus.

19 . A wireless device comprising a hybrid bus communication circuit, the hybrid bus communication circuit comprises:

a first type communication bus comprising multiple wires and configured to carry timing critical information;

a second type communication bus and a third type communication bus each consisting of a single wire and having a slower data rate than the first type communication bus, wherein the second type communication bus is configured to carry timing constrained information less time-sensitive than the timing critical information and the third type communication bus is configured to carry non-timing critical information less time-sensitive than the timing constrained information;

a master circuit coupled exclusively to the first type communication bus;

a hybrid bridge circuit coupled to the first type communication bus, the second type communication bus, and the third type communication bus;

a plurality of multi-bus slave circuits each coupled to the master circuit via the first type communication bus and coupled to the hybrid bridge circuit via the second type communication bus;

a plurality of single-bus slave circuits coupled to the hybrid bridge circuit via the third type communication bus; and

wherein the hybrid bridge circuit and each of the plurality of multi-bus slave circuits can initiate communication over the second type communication bus via a bus contention mechanism and the hybrid bridge circuit is configured to:

receive a configuration command from the master circuit via the first type communication bus;

determine one or more configuration parameters based on the received configuration command; and

configure the determined one or more configuration parameters in at least one selected multi-bus slave circuit among the plurality of multi-bus slave circuits via the second type communication bus.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 10, 2026
From: KHLAT, NADIM; NGO, CHRISTOPHER TRUONG; HIETALA, ALEXANDER WAYNE
To: QORVO US, INC.
Reel/Frame 074020/0748 →
Continuity (2)
Provisional Application 63091111 · Oct 13, 2020
Related Publication 20230315662A1 · Oct 5, 2023
References Cited (269)
US 3555196A · Singer · 1971 [cited by applicant]
US 3953835A · Cuccio et al. · 1976 [cited by applicant]
US 4336447A · Oguchi et al. · 1982 [cited by applicant]
US 4424812A · Lesnick · 1984 [cited by applicant]
US 4497068A · Fischer · 1985 [cited by applicant]
US 4736367A · Wroblewski et al. · 1988 [cited by applicant]
US 5412644A · Herberle · 1995 [cited by applicant]
US 5459660A · Berra · 1995 [cited by applicant]
US 5495469A · Halter et al. · 1996 [cited by applicant]
US 5499247A · Matsuda et al. · 1996 [cited by applicant]
US 5586266A · Hershey et al. · 1996 [cited by applicant]
US 5621897A · Boury et al. · 1997 [cited by applicant]
US 5684803A · Nguyen Thuy · 1997 [cited by applicant]
US 5734847A · Garbus et al. · 1998 [cited by applicant]
US 5748675A · Hormel et al. · 1998 [cited by applicant]
US 5774680A · Wanner et al. · 1998 [cited by applicant]
US 5787132A · Kishigami et al. · 1998 [cited by applicant]
US 5832207A · Little et al. · 1998 [cited by applicant]
US 5978860A · Chan et al. · 1999 [cited by applicant]
US 6094699A · Surugucchi et al. · 2000 [cited by applicant]
US 6141708A · Tavallaei et al. · 2000 [cited by applicant]
US 6189063B1 · Rekeita et al. · 2001 [cited by applicant]
US 6292705B1 · Wang et al. · 2001 [cited by applicant]
US 6308255B1 · Gorishek, IV et al. · 2001 [cited by applicant]
US 6310408B1 · Hermann · 2001 [cited by applicant]
US 6360291B1 · Tavallaei · 2002 [cited by applicant]
US 6397279B1 · Jaramillo et al. · 2002 [cited by applicant]
US 6408163B1 · Fik · 2002 [cited by applicant]
US 6484268B2 · Tamura et al. · 2002 [cited by applicant]
US 6985990B2 · Bronson et al. · 2006 [cited by applicant]
US 7197589B1 · Deneroff et al. · 2007 [cited by applicant]
US 7519005B2 · Hejdeman et al. · 2009 [cited by applicant]
US 7574637B2 · Richhetti et al. · 2009 [cited by applicant]
US 7606955B1 · Falik et al. · 2009 [cited by applicant]
US 7685320B1 · Wishneusky · 2010 [cited by applicant]
US 7729427B2 · Kwok · 2010 [cited by applicant]
US 8509318B2 · Tailliet · 2013 [cited by applicant]
US 8694710B2 · Bas et al. · 2014 [cited by applicant]
US 8775707B2 · Poulsen · 2014 [cited by applicant]
US 9152598B2 · Fosse et al. · 2015 [cited by applicant]
US 9166584B1 · Kandala et al. · 2015 [cited by applicant]
US 9252900B2 · Poulsen · 2016 [cited by applicant]
US 9430321B2 · Slik · 2016 [cited by applicant]
US 9491713B2 · Dykyy et al. · 2016 [cited by applicant]
US 9519612B2 · Hietala et al. · 2016 [cited by applicant]
US 9569386B2 · Du · 2017 [cited by applicant]
US 9639500B2 · Bas et al. · 2017 [cited by applicant]
US 9652451B2 · Elder · 2017 [cited by applicant]
US 9690725B2 · Sengoku · 2017 [cited by applicant]
US 9755821B2 · Jang et al. · 2017 [cited by applicant]
US 9946677B2 · Hapke · 2018 [cited by applicant]
US 10176130B2 · Ngo et al. · 2019 [cited by applicant]
US 10185683B2 · Ngo et al. · 2019 [cited by applicant]
US 10558607B2 · Ngo et al. · 2020 [cited by applicant]
US 10599601B1 · Ngo et al. · 2020 [cited by applicant]
US 10983942B1 · Ngo et al. · 2021 [cited by applicant]
US 11113220B2 · Ngo et al. · 2021 [cited by applicant]
US 11483778B2 · Walkowiak et al. · 2022 [cited by applicant]
US 20010050713A1 · Kubo et al. · 2001 [cited by applicant]
US 20030031039A1 · Towler et al. · 2003 [cited by applicant]
US 20040049619A1 · Lin · 2004 [cited by applicant]
US 20040100400A1 · Perelman et al. · 2004 [cited by applicant]
US 20040128594A1 · Elmhurst et al. · 2004 [cited by applicant]
US 20040221067A1 · Huang et al. · 2004 [cited by applicant]
US 20050012492A1 · Mihalka · 2005 [cited by applicant]
US 20050185665A1 · Uboldi · 2005 [cited by applicant]
US 20050259609A1 · Hansquine et al. · 2005 [cited by applicant]
US 20050289268A1 · Miller · 2005 [cited by applicant]
US 20060031618A1 · Hansquine et al. · 2006 [cited by applicant]
US 20060050694A1 · Bury et al. · 2006 [cited by applicant]
US 20060087307A1 · De Winter · 2006 [cited by applicant]
US 20060152236A1 · Kim · 2006 [cited by applicant]
US 20060236008A1 · Asano et al. · 2006 [cited by applicant]
US 20070073449A1 · Kraemer et al. · 2007 [cited by applicant]
US 20080217076A1 · Kraemer et al. · 2008 [cited by applicant]
US 20090121825A1 · Har · 2009 [cited by applicant]
US 20090248932A1 · Taylor et al. · 2009 [cited by applicant]
US 20100017553A1 · Laurencin et al. · 2010 [cited by applicant]
US 20100122103A1 · Roohparvar et al. · 2010 [cited by applicant]
US 20100305723A1 · Koyama · 2010 [cited by applicant]
US 20100306430A1 · Takahashi · 2010 [cited by applicant]
US 20110016255A1 · Hsi et al. · 2011 [cited by applicant]
US 20110035632A1 · Hong et al. · 2011 [cited by applicant]
US 20110113171A1 · Radhakrishnan et al. · 2011 [cited by applicant]
US 20110227622A1 · Kang · 2011 [cited by applicant]
US 20120027104A1 · Bas et al. · 2012 [cited by applicant]
US 20120030753A1 · Bas et al. · 2012 [cited by applicant]
US 20120102248A1 · Tailliet · 2012 [cited by applicant]
US 20120144078A1 · Poulsen · 2012 [cited by applicant]
US 20120161802A1 · Lebourg et al. · 2012 [cited by applicant]
US 20120226965A1 · Hammerschmidt et al. · 2012 [cited by applicant]
US 20120303836A1 · Ngo et al. · 2012 [cited by applicant]
US 20130049817A1 · Di Vincenzo et al. · 2013 [cited by applicant]
US 20130054850A1 · Co · 2013 [cited by applicant]
US 20130124763A1 · Kessler · 2013 [cited by applicant]
US 20130128724A1 · Farley et al. · 2013 [cited by applicant]
US 20130132624A1 · Chen et al. · 2013 [cited by applicant]
US 20130166801A1 · Chun et al. · 2013 [cited by applicant]
US 20130197920A1 · Lesso et al. · 2013 [cited by applicant]
US 20130265884A1 · Brombal et al. · 2013 [cited by applicant]
US 20130301689A1 · Marchand et al. · 2013 [cited by applicant]
US 20140025999A1 · Kessler · 2014 [cited by applicant]
US 20140112339A1 · Safranek et al. · 2014 [cited by applicant]
US 20140281593A1 · Hayes · 2014 [cited by applicant]
US 20140304442A1 · Hietala et al. · 2014 [cited by applicant]
US 20140310436A1 · Du · 2014 [cited by applicant]
US 20140376278A1 · Fornage et al. · 2014 [cited by applicant]
US 20150056941A1 · Lin et al. · 2015 [cited by applicant]
US 20150074306A1 · Ayyagari et al. · 2015 [cited by applicant]
US 20150097726A1 · Babitch et al. · 2015 [cited by applicant]
US 20150106541A1 · Southcombe et al. · 2015 [cited by applicant]
US 20150127862A1 · Fan et al. · 2015 [cited by applicant]
US 20150149673A1 · Balkan et al. · 2015 [cited by applicant]
US 20150169482A1 · Ngo et al. · 2015 [cited by applicant]
US 20150178233A1 · Guthrie · 2015 [cited by examiner]
US 20150192974A1 · Ngo et al. · 2015 [cited by applicant]
US 20150193297A1 · Ngo et al. · 2015 [cited by applicant]
US 20150193298A1 · Ngo et al. · 2015 [cited by applicant]
US 20150193321A1 · Ngo et al. · 2015 [cited by applicant]
US 20150193373A1 · Ngo et al. · 2015 [cited by applicant]
US 20150200006A1 · Wang et al. · 2015 [cited by applicant]
US 20150372679A1 · Kee et al. · 2015 [cited by applicant]
US 20160050513A1 · Wang et al. · 2016 [cited by applicant]
US 20160124892A1 · Amarilio et al. · 2016 [cited by applicant]
US 20160224488A1 · Huang et al. · 2016 [cited by applicant]
US 20160224489A1 · Mishra et al. · 2016 [cited by applicant]
US 20160274185A1 · Nishikawa · 2016 [cited by applicant]
US 20170003344A1 · Uekusa · 2017 [cited by applicant]
US 20170040986A1 · Ma · 2017 [cited by applicant]
US 20170104607A1 · Sengoku · 2017 [cited by applicant]
US 20170255250A1 · Ngo · 2017 [cited by examiner]
US 20170255578A1 · Ngo et al. · 2017 [cited by applicant]
US 20170255579A1 · Ngo et al. · 2017 [cited by applicant]
US 20170277651A1 · Ngo et al. · 2017 [cited by applicant]
US 20170286340A1 · Ngo et al. · 2017 [cited by applicant]
US 20180032457A1 · Mishra et al. · 2018 [cited by applicant]
US 20180074985A1 · Mishra · 2018 [cited by examiner]
US 20180083625A1 · Garg · 2018 [cited by applicant]
US 20180095119A1 · Chillara et al. · 2018 [cited by applicant]
US 20180173659A1 · DenBoer · 2018 [cited by examiner]
US 20180217959A1 · Ngo et al. · 2018 [cited by applicant]
US 20180225251A1 · Sthoeger · 2018 [cited by examiner]
US 20180247876A1 · Kim et al. · 2018 [cited by applicant]
US 20180357121A1 · Graif · 2018 [cited by examiner]
US 20190020433A1 · Pitigoi-Aron · 2019 [cited by examiner]
US 20190025373A1 · Bradford · 2019 [cited by applicant]
US 20190132013A1 · Sharma · 2019 [cited by examiner]
US 20190158085A1 · Rizvi · 2019 [cited by examiner]
US 20190250876A1 · Amarilio et al. · 2019 [cited by applicant]
US 20190357044A1 · Park · 2019 [cited by examiner]
US 20200033396A1 · Feucht et al. · 2020 [cited by applicant]
US 20200081859A1 · Mishra et al. · 2020 [cited by applicant]
US 20200151131A1 · Ngo et al. · 2020 [cited by applicant]
US 20200334185A1 · Ngo et al. · 2020 [cited by applicant]
US 20200344094A1 · Mishra et al. · 2020 [cited by applicant]
US 20200394046A1 · Snelgrove et al. · 2020 [cited by applicant]
US 20200404069A1 · Li · 2020 [cited by examiner]
US 20210034557A1 · Lee · 2021 [cited by examiner]
US 20210081340A1 · Rodd · 2021 [cited by examiner]
US 20210081348A1 · Rodd · 2021 [cited by examiner]
US 20210382677A1 · Amarilio et al. · 2021 [cited by applicant]
US 20210409335A1 · Zhu · 2021 [cited by examiner]
US 20220132524A1 · Mueck · 2022 [cited by examiner]
US 20220147474A1 · Ngo et al. · 2022 [cited by applicant]
US 20220166644A1 · Ngo et al. · 2022 [cited by applicant]
US 20220216708A1 · Wee et al. · 2022 [cited by applicant]
US 20220244309A1 · Sirisha et al. · 2022 [cited by applicant]
US 20220312196A1 · Guo · 2022 [cited by examiner]
US 20220350522A1 · Mayer et al. · 2022 [cited by applicant]
US 20230047577A1 · Bolton · 2023 [cited by examiner]
US 20230176120A1 · Hietala et al. · 2023 [cited by applicant]
US 20230198801A1 · Ngo et al. · 2023 [cited by applicant]
US 20230229616A1 · Ngo et al. · 2023 [cited by applicant]
US 20230253997A1 · Notari et al. · 2023 [cited by applicant]
US 20230267085A1 · Mishra · 2023 [cited by examiner]
US 20240007295A1 · Miyamoto · 2024 [cited by examiner]
US 20240202151A1 · Lee et al. · 2024 [cited by applicant]
US 20240303343A1 · Zeng · 2024 [cited by examiner]
CN 101501607A · 2009 [cited by applicant]
CN 102591834A · 2012 [cited by applicant]
CN 103870415A · 2014 [cited by applicant]
CN 104350700A · 2015 [cited by applicant]
CN 104598415A · 2015 [cited by applicant]
EP 2466481A1 · 2012 [cited by applicant]
KR 100590631B1 · 2006 [cited by applicant]
KR 20150060652A · 2015 [cited by applicant]
First Office Action for Chinese Patent Application No. 202080020865.8, mailed Jan. 12, 2024, 12 pages. [cited by applicant]
Examination Report for European Patent Application No. 20703620.3, mailed Dec. 12, 2023, 5 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 17/545,113, mailed Feb. 6, 2024, 30 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 17/545,113, mailed Aug. 25, 2023, 28 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 16/736,164, mailed Jan. 11, 2021, 10 pages. [cited by applicant]
International Search Report and Written Opinion for International Patent Application No. PCT/US2020/012702, mailed Apr. 7, 2020, 17 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 16/599,384, mailed Aug. 24, 2020, 8 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 16/599,384, mailed Dec. 1, 2020, 9 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 16/549,116, mailed Aug. 6, 2020, 9 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 16/549,116, mailed Jan. 13, 2021, 9 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 16/710,457, mailed Aug. 28, 2020, 7 pages. [cited by applicant]
Author Unknown, “IEEE Standard for Reduced-Pin and Enhanced-Functionality Test Access Point and Boundary-Scan Architecture,” IEEE Std 1149.7™-2009, Feb. 10, 2010, IEEE, 1037 pages. [cited by applicant]
Kawoosa, M.S. et al., “Towards Single Pin Scan for Extremely Low Pin Count Test,” 2018 31st International Conference on VLSI Design and 2018 17th International Conference on Embedded Systems (VLSID), Jan. 6-10, 2018, Pu… [cited by applicant]
Advisory Action for U.S. Appl. No. 16/736,164, mailed Mar. 19, 2021, 3 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/736,164, mailed Apr. 29, 2021, 8 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 16/549,116, mailed Mar. 24, 2021, 3 pages. [cited by applicant]
Non-Final Office Action and Examiner-Initiated Interview Summary for U.S. Appl. No. 16/549,116, mailed May 12, 2021, 10 pages. [cited by applicant]
Applicant-Initiated Interview Summary for U.S. Appl. No. 16/549,116, mailed Aug. 18, 2021, 2 pages. [cited by applicant]
Notice of Allowance and Examiner-Initiated Interview Summary for U.S. Appl. No. 16/549,116, mailed Sep. 14, 2021, 15 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 17/095,204, mailed Oct. 14, 2021, 8 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/095,204, mailed Mar. 17, 2022, 7 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 17/102,510, mailed Mar. 18, 2022, 12 pages. [cited by applicant]
International Search Report and Written Opinion for International Patent Application No. PCT/US2021/047854, mailed Dec. 13, 2021, 13 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/552,497, mailed Feb. 22, 2023, 8 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/575,491, mailed May 26, 2017, 20 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,379, mailed Apr. 7, 2017, 37 pages. [cited by applicant]
Author Unknown, “1-Wire,” Wikipedia, last modified Jan. 16, 2015, accessed Feb. 12, 2015, http://en.wikipedia.org/wiki/1-Wire, 4 pages. [cited by applicant]
Author Unknown, “DS1822: Econo 1-Wire Digital Thermometer,” Maxim Integrated, 2007, 21 pages. [cited by applicant]
Author Unknown, “Maxim 1-Wire® Tutorial,” Maxim, online audiovisual presentation, 17 slides, No Date, accessed Feb. 12, 2015, http://www.maximintegrated.com/products/1-wire/flash/overview/ (38 images of slides). [cited by applicant]
Awtry, Dan, et al., “Design Guide v1.0,” Springbok Digitronics, Aug. 19, 2004, 96 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/575,491, mailed Nov. 30, 2017, 18 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,292, mailed Sep. 29, 2017, 27 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,292, mailed Apr. 30, 2018, 24 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,328, mailed Sep. 8, 2017, 51 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,328, mailed Mar. 20, 2018, 61 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 14/659,328, mailed Jul. 2, 2018, 8 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,355, mailed Sep. 20, 2017, 32 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,355, mailed Apr. 17, 2018, 11 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 14/659,355, mailed Jul. 5, 2018, 3 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/467,790, mailed Jun. 28, 2018, 14 pages. [cited by applicant]
Ex Parte Quayle Action for U.S. Appl. No. 15/365,315, mailed Jul. 26, 2018, 7 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,379, mailed Oct. 18, 2017, 44 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 14/659,379, mailed Feb. 26, 2018, 3 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 14/659,379, mailed Mar. 20, 2018, 10 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,371, mailed Sep. 25, 2017, 23 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,371, mailed May 3, 2018, 21 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 14/659,371, mailed Aug. 1, 2018, 3 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,292, mailed Dec. 21, 2018, 23 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,292, mailed Jun. 4, 2019, 24 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,355, mailed Oct. 12, 2018, 8 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 14/659,355, mailed May 2, 2019, 8 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/886,209, mailed May 17, 2019, 7 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 14/659,371, mailed Feb. 26, 2019, 22 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/365,295, mailed Mar. 29, 2019, 15 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/365,295, mailed Aug. 15, 2019, 11 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/467,790, mailed Nov. 5, 2018, 15 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 15/467,790, mailed Feb. 26, 2019, 3 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/467,790, mailed May 20, 2019, 8 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 15/443,236, mailed Nov. 16, 2018, 19 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 15/443,236, mailed May 30, 2019, 20 pages. [cited by applicant]
Notice of Allowance and Examiner-Initiated Interview Summary for U.S. Appl. No. 15/365,315, mailed Sep. 14, 2018, 9 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/472,756, mailed Aug. 8, 2018, 8 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/886,209, mailed Sep. 11, 2019, 7 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/402,613, mailed Nov. 4, 2019, 9 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 16/407,397, mailed Nov. 12, 2019, 7 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 15/365,295, mailed Nov. 6, 2019, 3 pages. [cited by applicant]
Corrected Notice of Allowance for U.S. Appl. No. 15/467,790, mailed Aug. 15, 2019, 6 pages. [cited by applicant]
Corrected Notice of Allowance for U.S. Appl. No. 15/467,790, mailed Aug. 28, 2019, 6 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/443,236, mailed Sep. 24, 2019, 8 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 15/365,295, mailed Feb. 25, 2020, 8 pages. [cited by applicant]
Awtry, Dan, “Transmitting Data and Power over a One-Wire Bus,” Sensors, Feb. 1997, Dallas Semiconductor, 4 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 16/736,164, mailed Feb. 27, 2020, 7 pages. [cited by applicant]
Final Office Action for U.S. Appl. No. 16/736,164, mailed Jun. 2, 2020, 7 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 16/736,164, mailed Sep. 21, 2020, 8 pages. [cited by applicant]
Extended European Search Report for European Patent Application No. 22208632.4, mailed May 2, 2023, 11 pages. [cited by applicant]
Extended European Search Report for European Patent Application No. 22210008.3, mailed Apr. 25, 2023, 7 pages. [cited by applicant]
Extended European Search Report for European Patent Application No. 23152712.8, mailed Apr. 24, 2023, 11 pages. [cited by applicant]
Advisory Action for U.S. Appl. No. 17/545,113, mailed Apr. 3, 2024, 3 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 17/545,113, mailed May 1, 2024, 9 pages. [cited by applicant]
Non-Final Office Action for U.S. Appl. No. 18/154,127, mailed Apr. 15, 2024, 21 pages. [cited by applicant]
Notice of Allowance for U.S. Appl. No. 18/154,127, mailed Aug. 23, 2024, 8 pages. [cited by applicant]
Corrected Notice of Allowability for U.S. Appl. No. 18/154,127, mailed Oct. 7, 2024, 6 pages. [cited by applicant]
Mishra, Lalan, “A Snapshot on MIPI RFFE v3.0 from a Systems Architecture Perspective,” MIPI Alliance Developers Conference, Sep. 22-23, 2020, 19 pages. [cited by applicant]