Method of determining hydrophilicity of wafer and processing apparatus
A method of determining the hydrophilicity of a wafer includes capturing an image of the entire upper surface of the wafer with a camera, forming a water film on the entire upper surface of the wafer, capturing a second image of the entire upper surface of the wafer with the camera after forming the water film, forming a differential image based on a difference between lightness of the first image and the lightness of the second image, and determining that the entire upper surface of the wafer is hydrophilic if the differential image is blank and that the entire upper surface of the wafer is not hydrophilic if otherwise.
1 . A method of determining whether an entire upper surface of a wafer is hydrophilic or not, the method comprising:
a first image capturing step of capturing an image of the entire upper surface of the wafer with a camera;
a water film forming step of supplying an amount of water enough to form a water film on the entire upper surface of the wafer and rotating the wafer about an axis at a center of the wafer at a predetermined rotational speed;
after the water film forming step, a second image capturing step of capturing a second image of the entire upper surface of the wafer with the camera;
a differential image forming step of forming a differential image based on a difference between lightness of the first image captured in the first image capturing step and lightness of the second image captured in the second image capturing step; and
a determining step of determining that the entire upper surface of the wafer is not hydrophilic if the differential image contains a portion that is not blank and that the entire upper surface of the wafer is hydrophilic if the differential image is blank.
2 . A method of determining whether an entire upper surface of a wafer is hydrophilic or not, the method comprising:
a water film forming step of supplying an amount of water enough to form a water film on the entire upper surface of the wafer and rotating the wafer about an axis at a center of the wafer at a predetermined rotational speed;
after the water film forming step, a reflected light detecting step of moving a reflective sensor in a direction parallel to the upper surface of the wafer and simultaneously detecting reflected light that is reflected by the upper surface of the wafer or water on the upper surface of the wafer from measuring light applied from the reflective sensor to the wafer; and
a determining step of determining that the entire upper surface of the wafer is hydrophilic if the amount of light detected by the reflective sensor in the reflected light detecting step is of a value higher than a preset threshold value and that the entire upper surface of the wafer is not hydrophilic if at least part of the detected amount of light is of a value lower than the threshold value.
3 . A processing apparatus comprising:
a chuck table for holding a wafer thereon;
a processing unit for processing the wafer held on the chuck table;
a cleaning unit for cleaning an upper surface of the wafer by ejecting cleaning water to the upper surface of the wafer while rotating the wafer held on a cleaning table thereof;
a controller; and
a determining unit for supplying water to a central area of the wafer held on the chuck table or the cleaning table, then rotating the chuck table or the cleaning table to form a water film on the entire upper surface of the wafer, and thereafter determining whether the entire upper surface of the wafer is hydrophilic or not.
4 . The processing apparatus according to claim 3 , wherein
the determining unit includes a camera for capturing an image of the entire upper surface of the wafer held on the chuck table or the cleaning table and the controller, and
the controller includes:
a differential image forming section for forming a differential image based on a difference between lightness of a first image captured of the wafer held on the chuck table or the cleaning table by the camera and lightness of a second image captured of the wafer held on the chuck table or the cleaning table by the camera, and
a determining section for determining that the entire upper surface of the wafer is not hydrophilic if the differential image contains a portion that is not blank and that the entire upper surface of the wafer is hydrophilic if the differential image is blank.
5 . The processing apparatus according to claim 3 , wherein
the determining unit includes:
a reflective sensor having a light emitter for emitting measuring light toward the upper surface of the wafer held on the chuck table or the cleaning table and a light detector for detecting reflected light that is reflected from the measuring light by the upper surface of the wafer or water on the upper surface of the wafer,
a horizontally moving mechanism for moving the reflective sensor in a direction parallel to the upper surface of the wafer,
a rotating mechanism for rotating the chuck table or the cleaning table, and
a determining section for moving the reflective sensor in a horizontal direction with the horizontally moving mechanism while rotating the chuck table or the cleaning table with the rotating mechanism, and determining that the entire upper surface of the wafer is hydrophilic if the amount of the reflected light detected by the light detector is of a value higher than a preset threshold value and that the entire upper surface of the wafer is not hydrophilic if at least part of the amount of the reflected light is of a value lower than the threshold value.